EIC Laboratories, Inc.
|EIC Laboratories, Inc. Patent applications|
|Patent application number||Title||Published|
|20080283415||ELECTRICALLY DISBONDABLE COMPOSITIONS AND RELATED METHODS - Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.||11-20-2008|