EHWA DIAMOND INDUSTRIAL CO., LTD.
|EHWA DIAMOND INDUSTRIAL CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20140154960||CMP PAD CONDITIONER - The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.||06-05-2014|
|20140154956||Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof - The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof.||06-05-2014|
|20140094101||CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER - This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.||04-03-2014|
|20130344779||CONDITIONER FOR SOFT PAD AND METHOD FOR MANUFACTURING SAME - The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a soft pad, and a method of manufacturing the same, wherein the conditioner can be used under CMP conditions using a slurry having a small amount of polishing particles, and/or a porous pad having comparatively low hardness and very high porosity.||12-26-2013|
|20130059510||BRAZING BOND TYPE DIAMOND TOOL WITH EXCELLENT CUTTABILITY AND METHOD OF MANUFACTURING THE SAME - The present disclosure provides a brazing bond type diamond tool having excellent cuttability and a method of manufacturing the same. The diamond tool includes a shank having a body and a tip portion formed along an edge of the body, and a brazing bond layer formed on the tip portion of the shank to secure diamond particles with a brazing bond. The tip portion is thinner than the body and is integrally formed with the body.||03-07-2013|
|20110033253||DRILL BIT - There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and coupled to the receptor portion of the bit body to form a channel in which a capillary phenomenon occurs, and having an opening formed in one end thereof; and a cutting portion provided in the opening of the drilling portion to drill a workpiece. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength work-piece to the maximum extent using the minimum number of drill bits.||02-10-2011|
|20080219783||Cutting Segment of Cutting Tool and Cutting Tool - A cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low-concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The cutting segment and the cutting tool are capable of improving cutting rate and useful life.||09-11-2008|
|20080202488||Cutting Segment for Cutting Tool and Cutting Tools - The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.||08-28-2008|
Patent applications by EHWA DIAMOND INDUSTRIAL CO., LTD.