EHWA DIAMOND IND. CO., LTD. Patent applications |
Patent application number | Title | Published |
20160082619 | CUTTING TOOL AND CUTTING APPARATUS COMPRISING SAME - A cutting tool and a cutting apparatus including a cutting tool. The cutting tool includes: a blade extending and reciprocating in a length direction of a workpiece for cutting the workpiece; at least one cutting tip provided on an end of the blade and protruding in a width direction of the blade for cutting the workpiece while contacting the workpiece; and an auxiliary cutting structure provided on at least one side of the blade and corresponding to a width of the cutting tip to prevent the blade from wobbling in a slot formed by the cutting tip. The cutting apparatus includes: a frame unit disposed at both sides of a workpiece in a cutting direction of the workpiece; and the cutting tool, the cutting tool configured to cut the workpiece while being reciprocated by power transmitted from a driving unit disposed on a side of the frame unit. | 03-24-2016 |
20110250826 | PAD CONDITIONER HAVING REDUCED FRICTION AND METHOD OF MANUFACTURING THE SAME - This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same. | 10-13-2011 |