| ECI Technology, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110272289 | Boric acid replenishment in electroplating baths - Boric acid is replenished in an electroplating bath via a replenishment solution comprising boric acid dissolved in pure water, in which the solubility at room temperature is comparable to that in the plating bath at operating temperature. The replenishment solution may be used to replace all or part of the water lost by evaporation. An automated device may be used to replenish boric acid in the electroplating bath. | 11-10-2011 |
| 20110266154 | Analysis of an auxiliary leveler additive in an acid copper plating bath - An auxiliary leveler additive that cannot be analyzed by conventional CVS methods for acid copper plating baths is analyzed by cyclic voltammetry at a platinum rotating disk electrode from its effect on the anodic current at very positive potentials. | 11-03-2011 |
