DUKSAN HI-METAL CO., LTD. Patent applications |
Patent application number | Title | Published |
20140183733 | METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDUCTOR DEVICE USING THE SAME - Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer. | 07-03-2014 |
20120067629 | SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME - The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same. | 03-22-2012 |
20100272598 | LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF - Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same. | 10-28-2010 |