Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


DUFF DESIGN LIMITED

DUFF DESIGN LIMITED Patent applications
Patent application numberTitlePublished
20110078983PRODUCTION OF BAND-DRIVEN PACKAGES AND THEIR COMPONENTS - Methods are disclosed for making a band-driven package or a band-drive component for a package, and machines for performing the methods. One method comprises feeding first and second flexible webs in a feed direction, one web being fed each side of a substrate such that the webs are in mutual face-to-face disposition ahead of and behind the substrate with respect to the feed direction; joining the face-to-face webs at a first join ahead of the substrate and at a second join behind the substrate, the joins bounding web portions that together encircle the substrate between the joins; and dividing the joined web portions from the remainder of the webs such that the joined web portions together define a band that encircles the substrate, to be slid around the substrate in use of the package.04-07-2011
20110036743PACKAGING - Child-resistant packages and components thereof are disclosed. One of the disclosed child-resistant packages (02-17-2011
20100101972 PACKAGING - A container (04-29-2010
20090139187PRODUCTION OF BAND-DRIVEN PACKAGES AND THEIR COMPONENTS - Methods are disclosed for making a band-driven package or a band-drive component for a package, and machines for performing the methods. One method comprises feeding first and second flexible webs in a feed direction, one web being fed each side of a substrate such that the webs are in mutual face-to-face disposition ahead of and behind the substrate with respect to the feed direction; joining the face-to-face webs at a first join ahead of the substrate and at a second join behind the substrate, the joins bounding web portions that together encircle the substrate between the joins; and dividing the joined web portions from the remainder of the webs such that the joined web portions together define a band that encircles the substrate, to be slid around the substrate in use of the package.06-04-2009

Patent applications by DUFF DESIGN LIMITED