| Duckyang Ind. Co. Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110123667 | LOCALIZED OVER-MOLDING DIE STRUCTURE - A localized over-molding die structure may include a core die, a cavity die having an inner space therein and placed onto an upper surface of the core die, and a slide die including a step portion on a lower surface thereof and slidably engaged with the cavity die in the inner space thereof to move upward and downward, wherein, the step portion includes an undercut formed at a lateral side thereof such that when at least two materials are successively injected into the cavity die, a corresponding part to the undercut is formed to at least one of the at least two materials. | 05-26-2011 |
| 20090289092 | Tray apparatus - A tray apparatus may include a housing, a tray slidably accommodated in the housing to be opened or closed, a rotary lock pivotally coupled to the housing at a hinge portion of the rotary lock and locking the tray to the housing when external shock is applied to the tray beyond a predetermined value, wherein a center of gravity of the rotary lock is positioned above the hinge portion, and a holding unit for holding the rotary lock in a normal state so that the rotary lock maintains an original position thereof. | 11-26-2009 |
