| 20080230515 | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof - The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate. | 09-25-2008 |
