DOWA METALTECH CO., LTD. Patent applications |
Patent application number | Title | Published |
20150284296 | METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME - After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate | 10-08-2015 |
20150259815 | SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME - In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafter, an aging treatment is carried out to produce a silver-plated product wherein an area fraction in {200} orientation of the surface layer is 15% or more. | 09-17-2015 |
20150229092 | FEMALE TERMINAL AND METHOD FOR FABRICATING FEMALE TERMINAL - A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate. | 08-13-2015 |
20140291159 | PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD - A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side. | 10-02-2014 |
20140147695 | ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME - An electronic part mounting substrate includes: a metal plate | 05-29-2014 |
20140116583 | Cu-Ni-Co-Si BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME - A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×10 | 05-01-2014 |
20140083671 | HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME - A heat radiating plate | 03-27-2014 |
20140057131 | METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME - A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof. | 02-27-2014 |
20130225017 | FEMALE TERMINAL AND METHOD FOR FABRICATING FEMALE TERMINAL - A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate. | 08-29-2013 |
20120305292 | LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQUID-COOLED INTEGRATED SUBSTRATE - There is provide a liquid-cooled integrated substrate which has reduced material cost and processing cost, is reduced in warpage (shape deformation) as an integrated substrate, and has excellent strength and heat radiation performance, and a manufacturing method of the liquid-cooled integrated substrate. There is provided a liquid-cooled integrated substrate | 12-06-2012 |
20120279761 | FIN-INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF FIN-INTEGRATED SUBSTRATE - There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter. | 11-08-2012 |
20120279618 | COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME - A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I | 11-08-2012 |
20120152482 | ALUMINUM BONDING MEMBER AND METHOD FOR PRODUCING SAME - There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member | 06-21-2012 |
20110268920 | TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME - A tin-plated product formed by electroplating a substrate in a tin plating solution, which contains carbon particles and an aromatic carbonyl compound, to form a coating of a composite material, which contains the carbon particles in a tin layer, on the substrate has a coefficient of friction which is not greater than 0.18, preferably not greater than 0.13, with respect to the same kind of another tin-plated product, and has a glossiness of not less than 0.29 and a contact resistance of not greater than 1.0 mΩ. The coating has a thickness of 0.5 to 10 micrometers, and the content of carbon in the coating is in the range of from 0.1% by weight to 1.5% by weight. Separate protrusions containing the carbon particles are formed on the surface of the coating. The orientation plane of a tin matrix of the coating is ( | 11-03-2011 |
20110240180 | Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component - There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface. | 10-06-2011 |
20110138966 | Method of detinning Sn plating layer on Cu-based material - A Cu-based material 5 is immersed into an alkali hydroxide solution with a concentration of 3.0 to 37.5 mass % and a H | 06-16-2011 |
20100269959 | COPPER ALLOY SHEET AND METHOD FOR PRODUCING SAME - A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I | 10-28-2010 |
20100132851 | COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME - A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I | 06-03-2010 |
20090229987 | METHOD FOR PRODUCING COMPOSITE PLATED PRODUCT - There is provided a method for producing a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate by using a composite plating solution wherein carbon particles treated by an oxidation treatment and a silver matrix orientation adjusting agent are added to a silver plating solution, the method being capable of preventing the wear resistance of the composite plated product from being deteriorated even if the current density in a plating process is increased. The molar ratio of silver to free cyanogen in the composite plating solution is adjusted so as not to be less than 0.7, preferably so as to be in the range of from 0.7 to 1.3. The silver matrix orientation adjusting agent contains selenium ions, and is preferably potassium selenocyanate. The concentration of the silver matrix orientation adjusting agent in the composite plating solution is adjusted so as to be in the range of from 5 mg/l to 20 mg/l. | 09-17-2009 |