| DOWA METALTECH CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20110268920 | TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME - A tin-plated product formed by electroplating a substrate in a tin plating solution, which contains carbon particles and an aromatic carbonyl compound, to form a coating of a composite material, which contains the carbon particles in a tin layer, on the substrate has a coefficient of friction which is not greater than 0.18, preferably not greater than 0.13, with respect to the same kind of another tin-plated product, and has a glossiness of not less than 0.29 and a contact resistance of not greater than 1.0 mΩ. The coating has a thickness of 0.5 to 10 micrometers, and the content of carbon in the coating is in the range of from 0.1% by weight to 1.5% by weight. Separate protrusions containing the carbon particles are formed on the surface of the coating. The orientation plane of a tin matrix of the coating is ( | 11-03-2011 |
| 20110240180 | Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component - There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface. | 10-06-2011 |
| 20110138966 | Method of detinning Sn plating layer on Cu-based material - A Cu-based material 5 is immersed into an alkali hydroxide solution with a concentration of 3.0 to 37.5 mass % and a H | 06-16-2011 |
| 20100269959 | COPPER ALLOY SHEET AND METHOD FOR PRODUCING SAME - A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I | 10-28-2010 |
| 20100132851 | COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME - A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I | 06-03-2010 |
| 20090229987 | METHOD FOR PRODUCING COMPOSITE PLATED PRODUCT - There is provided a method for producing a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate by using a composite plating solution wherein carbon particles treated by an oxidation treatment and a silver matrix orientation adjusting agent are added to a silver plating solution, the method being capable of preventing the wear resistance of the composite plated product from being deteriorated even if the current density in a plating process is increased. The molar ratio of silver to free cyanogen in the composite plating solution is adjusted so as not to be less than 0.7, preferably so as to be in the range of from 0.7 to 1.3. The silver matrix orientation adjusting agent contains selenium ions, and is preferably potassium selenocyanate. The concentration of the silver matrix orientation adjusting agent in the composite plating solution is adjusted so as to be in the range of from 5 mg/l to 20 mg/l. | 09-17-2009 |
