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DOWA ELECTRONICS MATERIAL CO

TOKYO, JP

DOWA ELECTRONICS MATERIAL CO Patent applications
Patent application numberTitlePublished
20090036314METHOD OF FORMING OXIDE SUPERCONDUCTOR THICK FILM - To provide an oxide superconductor thick film formation method that can enhance adhesiveness of a Bi2223 thick film to a body to be processed on which the Bi2223 thick film is formed, and increase a cross-sectional area of the Bi2223 thick film, without a decrease in Jc of the Bi2223 thick film. A mixture of a compound oxide having composition Bi2212 and Pb is applied to a surface of the body to be processed, and burned to form a first thick film. An oxide superconductor thick film expressed by a general formula (Bi, Pb)02-05-2009