| DOW CORNING IRELAND LTD. Patent applications |
| Patent application number | Title | Published |
| 20090202739 | Method For Coating A Substrate Using Plasma - A method for forming a polymeric coating on a substrate surface, by plasma treating a mixture comprising a free-radical initiated polymerisable monomer having one or more free-radical polymerisable groups in the presence of a free radical initiator, wherein said plasma treatment is a soft ionisation plasma process (a process wherein precursor molecules are not fragmented during the plasma process and as a consequence, the resulting polymeric coating has the physical properties of the precursor or bulk polymer) aid depositing the resulting polymeric coating material onto a substrate surface. | 08-13-2009 |
| 20090142514 | Plasma System - A non-equilibrium atmospheric pressure plasma incorporating an atomised surface treatment agent is generated by applying a radio frequency high voltage to at least one electrode positioned within a dielectric housing while causing a process gas to flow from the inlet of the housing past the electrode to the outlet. The voltage applied is sufficiently high to generate a non-equilibrium atmospheric pressure plasma extending from the electrode at least to the outlet of the housing. The electrode may be combined with an atomiser for the surface treatment agent within the housing. The electrode may comprise a radioactive material. The surface to be treated can be positioned adjacent to the plasma outlet so that the surface is in contact with the plasma, and moved relative to the plasma outlet. | 06-04-2009 |
| 20090065485 | Plasma System - In a process for plasma treating a surface, a non-equilibrium atmospheric pressure plasma is generated within a dielectric housing having an inlet and an outlet through which a process gas flows from the inlet to the outlet. A tube formed at least partly of dielectric material extends outwardly from the outlet of the housing, whereby the end of the tube forms the plasma outlet. The surface to be treated is positioned adjacent to the plasma outlet so that the surface is in contact with the plasma and is moved relative to the plasma outlet. | 03-12-2009 |