DOW BRASIL S.A.
Sao Paulo - Sp, BR
|DOW BRASIL S.A. Patent applications|
|Patent application number||Title||Published|
|20140072787||POLYOLEFIN BASED FILMS SUITABLE FOR THERMOFORMING - The present invention relates to a film structure comprising an outer layer, a core and an inner layer (or sealant layer). The outer layer comprises a polyolefinic material having a Vicat softening temperature of 85° C. or greater, and a total crystallinity in the range of 25 to 45%. The core comprises a linear low density polyethylene having a density of 0.925 g/cm||03-13-2014|
|20130273356||POLYOLEFINS HAVING ONE OR MORE SURFACES MODIFIED TO IMPROVE ADHESION OF POLYISOCYANATE FUNCTIONAL ADHESIVES THERETO - This invention relates to the modification of polyolefin structures, parts or components, used in assemblies to enhance the bonding of polar adhesives to surface of the polyolefin structures. Disclosed herein are novel articles comprising polyolefin structures having one or more surfaces modified according to the invention. The polyolefin structures have one or more surfaces with an epoxy resin layer disposed directly on the surface and then disposed on the epoxy resin layer is a layer of one or more compounds, oligomers or prepolymers having reactive isocyanate groups. The invention is also a method for modifying one or more surfaces of a polyolefin structure by successively depositing on the surfaces an epoxy resin layer disposed and a layer of one or more compounds, oligomers or prepolymers having reactive isocyanate groups. Also disclosed are kits of the modified polyolefin structures and one or more of adhesives or coatings having polar reactive groups. Further disclosed are methods of bonding the modified polyolefin structures to other substrates by contacting adhesives having polar reactive groups with the modified surfaces and the other substrates with the adhesive disposed therebetween. Also disclosed are coating methods which comprise contacting one or more coatings comprising polar reactive groups with the modified surfaces of the polyolefin structure.||10-17-2013|
|20130035444||POLYETHYLENE WITH HIGH MELT STRENGTH FOR USE IN FILMS - The present invention is a method for producing a film particularly well suited for shrink film applications, said method comprising the steps of selecting a target polyethylene resin and then increasing the melt strength of the polyethylene resin by reacting the polyethylene resin with an alkoxy amine derivative, and then forming a film from the reacted target polyethylene.||02-07-2013|
|20130035438||METHOD FOR PREPARING POLYETHYLENE WITH HIGH MELT STRENGTH - The present invention is an ethylene-based polymer comprising reacting a polyethylene resin with an alkoxy amine derivative corresponding to the formula:||02-07-2013|
|20130022804||THICK BLOWN FILMS - The present invention is a film having a thickness greater than 100 microns comprising from 10 to 100 percent by weight of a polyethylene polymer made by the process of a) selecting a target polyethylene resin having a density, as determined according to ASTM D792, in the range of from 0.90 g/cm3 to 0.955 g/cm3, and a melt index, as determined according to ASTM D1238(2.16 kg, 190 C), in the range of from 0.01 g/10 min to 10 g/10 min; b) reacting said target polyethylene with an alkoxy amine derivative in an amount less than 900 parts derivative per million parts by weight of total polyethylene resin under conditions sufficient to increase the melt strength of the target polyethylene resin; and c) forming a thick film from the modified target resin. The present films include those which can achieve similar processability as those containing unmodified linear polyethylene despite having at least 10% less LDPE resins in the formulation.||01-24-2013|
|20120283390||HIGH MELT STRENGTH POLYETHYLENE COMPOSITIONS AND METHODS FOR MAKING THE SAME - The present invention is a method for increasing the melt strength of a polyethylene resin comprising reacting the polyethylene resin with a free radical generator with a decomposition energy in between −50 kJoule/mole and −250 kJoules/mole and a peak decomposition temperature of less than 280 degree C. The resulting resin has increased melt strength with higher ratio of elongational viscosities at 0.1 to 100 rad/s when compared to substantially similar polyethylene resins which have not been reacted with a free radical generator such as an alkoxy amine derivative.||11-08-2012|
Patent applications by DOW BRASIL S.A.