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DoPont Air Products Nanomaterials LLC

DoPont Air Products Nanomaterials LLC Patent applications
Patent application numberTitlePublished
20100167546Method and Composition for Chemical Mechanical Planarization of A Metal or A Metal Alloy - A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing.07-01-2010