DOMINTECH CO., LTD.
|DOMINTECH CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20130213698||HOLDER FOR SEMICONDUCTOR PACKAGE - A holder includes a main body on which a plurality of circuit lines are laid out. The main body is integrally molded from a plastic material and can be formed thereon with a circuit layout by a specific process, such as a laser activated and chemical plating process. The main body includes a chamber having an opening formed at the top side of the main body, a base surface, and a stepped wall. Each of the circuit lines is arranged on the stepped wall of the chamber stereoscopically. Thus, the holder does not need to make a hole running therethrough to reach electrical connection between surfaces of different heights. Besides, the circuit lines are arranged stereoscopically, so they can extend to the top and bottom sides of the holder. Therefore, the holder can be applied to not only the traditional package but an upside-down package.||08-22-2013|
|20110269296||METHOD FOR SEPARATING SEMICONDUCTOR WAFER INTO CHIPS - A method for separating a semiconductor wafer into chips includes the steps of sandwiching a soluble spacer between a wafer and a substrate to form a laminate, etching the wafer into a plurality of chips attached on the spacer, positioning the laminate in a chamber of an apparatus in a way that the etched wafer faces a stage of the apparatus, and introducing a solvent into the chamber to dissolve the soluble spacer so as to facilitate the chips to be supported on the stage.||11-03-2011|
|20110228481||THERMALLY CONDUCTIVE INTERFACE MEANS - A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together.||09-22-2011|
|20110141747||BULB FOR ELECTRIC LAMP - A bulb for an electric lamp having a light-emitting element includes a light transmittable shell body for housing the light-emitting element. The light transmittable shell body includes an accommodation for receiving the light-emitting element of the electric lamp, and an inner surface surrounding the accommodation. On the inner surface of the light transmittable shell body a plurality of light-guiding portions are provided for guiding the light emitted from the light-emitting element towards an outside of the light transmittable shell body.||06-16-2011|
|20110140210||MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME - A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device.||06-16-2011|
|20110127191||METHOD OF PREVENTING ELECTRONIC COMPONENT FROM DAMAGE DURING TRANSPORTATION AND TRAYMADE BASED ON THE METHOD - A method includes the steps of preparing a tray having at least one chamber with an opening facing upward; placing at least one electronic component in the chamber; filling the chamber with a liquid that does not react with the at least one electronic component; and sealing the chamber. In light of this, when the electronic component having any kind of shape is placed in the chamber, the space for movement of the electronic component is limited, so that the electronic component is not subject to damage incurred by collision during transportation. In light of this, the chances of damaging the electronic component during transportation can be effectively decreased.||06-02-2011|
Patent applications by DOMINTECH CO., LTD.