DigitalOptics Corporation East Patent applications |
Patent application number | Title | Published |
20130229719 | Wafer Level Optical Elements and Applications Thereof - The present invention provides wafer level optical elements that obviate a substrate wafer or a portion thereof disposed between optical structures or optical surfaces of the element. | 09-05-2013 |
20130188247 | LWIR IMAGING LENS, IMAGE CAPTURING SYSTEM HAVING THE SAME, AND ASSOCIATED METHOD - An imaging lens for use with an operational waveband over any subset of 7.5-13.5 μm may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm. | 07-25-2013 |
20130083397 | OPTICAL ELEMENTS, METHOD OF REPLICATING OPTICAL ELEMENTS, PARTICULARLY ON A WAFER LEVEL, AND OPTICAL DEVICES - Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level. | 04-04-2013 |
20130023072 | Substrate For Integrated Modules - A method of fabricating a plurality of components using wafer-level processing can include bonding first and second wafer-level substrates together to form a substrate assembly, such that first surfaces of the first and second substrates confront one another, the first substrate having first electrically conductive elements exposed at the first surface thereof, forming second electrically conductive elements contacting the first conductive elements, and processing the second substrate into individual substrate elements. The second conductive elements can extend through a thickness of the first substrate and can be exposed at a second surface thereof opposite the first surface. The processing can include trimming material to produce the substrate elements at least some of which have respective different controlled thicknesses between first surfaces adjacent the first substrate and second surfaces opposite therefrom. | 01-24-2013 |
20120229908 | RECESSED OPTICAL SURFACES - An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes. | 09-13-2012 |
20120199857 | Wafer-Scale Emitter Package Including Thermal Vias - Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends. | 08-09-2012 |
20120184652 | CURABLE RESINS AND ARTICLES MADE THEREFROM - Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages. | 07-19-2012 |
20120178859 | CURABLE RESINS AND ARTICLES MADE THEREFROM - Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages. | 07-12-2012 |
20120076456 | Optical element and system using the same - A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber. | 03-29-2012 |