| DiCon Fiberoptics Inc. Patent applications |
| Patent application number | Title | Published |
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| 20120043907 | COMPACT HIGH BRIGHTNESS LED GROW LIGHT APPARATUS, USING AN EXTENDED POINT SOURCE LED ARRAY WITH LIGHT EMITTING DIODES - A compact high-brightness LED grow light fixture is described for use in growing plants under artificial light, or as a supplement to natural sunlight. The LED grow light uses a densely-packed array of high-brightness light emitting diodes (LEDs) that are not individually packaged where the array behaves similarly to a point source of light. The LED chips are distributed laterally over an area, where the LED chips have light emitting surfaces for emitting light in directions transverse to said area, wherein the dimensions of the area do not exceed 25 mm. Adjacent chips of the array are preferably separated by less than about 0.2 mm. The extended point source LED array, with its lens and associated reflector, result in a concentrated, partially-collimated light source, such that the intensity of the light does not diminish rapidly as distance from the light source increases. Thus, foliage that is lower down on the plant will receive almost as much light energy as does foliage on the top of the plant. The compact LED grow light does not block much of the natural sunlight, making the LED grow light suitable for use as a supplement to natural sunlight. The LED array contains a plurality of LED strings that may be separately controlled, thereby allowing the spectral content of the LED grow light to be varied, to facilitate desired plant growth at various stages of plant life. Multiple wavelengths of LEDs may be used within each LED string, thereby allowing the ability to further optimize the spectral content of the LED grow light. Due to the compact size of the LED grow light, the light emitted at each of the multiple different wavelengths from the array is evenly distributed, when the objects being illuminated by the array are at a distance of less than about 6 feet or even less than 1 foot from the array. Flexible mounting options allow for the use of multiple compact LED grow lights within a single plant growing area, and also allow for side or bottom lighting of plant foliage, in addition to the more typical overhead lighting. | 02-23-2012 |
| 20100032699 | System for High Efficiency Solid-State Light Emissions and Method of Manufacture - In one embodiment of the invention, a bonding material is used to bond a substitute substrate to the LED, wherein the bonding material does not including gold or tin. The bonding material preferably includes gallium (Ga), such as a combination of Ga and Al or Cu. This bonding material has high thermal conductivity, high strength, high temperature stability and is low cost. In another embodiment of the invention, the substitute substrate is first thinned before it is bonded to the LED structure, so that the substitute substrate is flexible and conforms to the shape of the LED structure. In yet another embodiment of the invention, an apparatus is used for bonding a substitute substrate to a LED which comprises a plurality of semiconductor epitaxial layers, said semiconductor epitaxial layers having been grown on the growth substrate so that said semiconductor epitaxial layers are curved in shape. The apparatus comprises a conduit for evacuating a region near the substitute substrate on a side of the substitute substrate that is opposite to that of said semiconductor epitaxial layers. Gas pressure is applied on the semiconductor epitaxial layers, and the substitute substrate conforms to the shape of said semiconductor epitaxial layers as a result of pressure applied. A bonding material is used for bonding said substitute substrate to the semiconductor epitaxial layers. | 02-11-2010 |
| 20080315220 | High Light Efficiency Solid-State Light Emitting Structure And Methods To Manufacturing The Same - In one embodiment of an epitaxial LED device, a buffer layer (e.g. dielectric layer) between the current spreading layer and the substitute substrate comprises a plurality of vias and has a refractive index that is below that of the current spreading layer. A reflective metal layer between the buffer layer and the substitute substrate is connected to the current spreading layer through the vias in the buffer layer. The buffer layer separates the current spreading layer from the reflective metal layer. In yet another embodiment, stress management is provided by causing or preserving stress, such as compressive stress, in the LED so that stress in the LED is reduced when it experiences thermal cycles. In one implementation of this embodiment, a layer is attached to the LED and reflective metal layer, and causes or preserves stress in the LED along one or more directions parallel to an interface between the LED epitaxial layers so that stress in the LED is reduced in said one or more directions when temperature of the structure is increased. | 12-25-2008 |
