| DESPATCH INDUSTRIES LIMITED PARTNERSHIP Patent applications |
| Patent application number | Title | Published |
|---|
| 20110212010 | Apparatus and Method for Thermal Destruction of Volatile Organic Compounds - A thermal oxidizer assembly is adapted for mounting onto a furnace, such that a heating chamber of the assembly is in direct flow-through communication with an interior of the furnace and defines a flow path for volatile organic compounds that are released from workpieces being processed within the furnace. A heating module is mounted within the heating chamber of the assembly and is located within the flow path to create turbulent flow therethrough. The assembly is configured to allow a natural draft to pull the volatile organic compounds from the furnace and through the flow path, and the heating module heats the volatile organic compounds, within the heating chamber, to a temperature necessary to destroy greater than approximately 99% of the volatile organic compounds. A flow rate of the volatile organic compounds being pulled along the flow path is, preferably, between approximately five and thirty standard cubic feet per minute. | 09-01-2011 |
| 20110188538 | ENCLOSURE AND METHOD FOR TEMPERATURE-SENSITIVE COMPONENTS - Protective enclosure and method for protecting heat sensitive, data recording devices in high temperature environments. The protective enclosure has a housing having at least one compartment for containing a heat sensitive, data recording device, e.g., a temperature recording device, and a jacket configured to contain a phase change material. The jacket may be vented and configured to at least partially surround the compartment. The housing may be sealed with an endcap. The recording device and a heat absorbing element are disposed within the same or within adjoining or adjacent sub-compartments within the enclosure. In a method, the enclosure with heat absorbing element and temperature recording device is placed within a heated environment or environment to be heated, e.g., a furnace. The recording device is connected to a thermal couple. | 08-04-2011 |
