| DESIGNER MOLECULES, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120065336 | CURABLE COMPOSITION WITH RUBBER-LIKE PROPERTIES - Low viscosity, radiation curable compositions have been developed that produce plastics with silicone rubber-like properties. These compositions have also been shown to give great adhesion to plastics. The combination of an ethylenically unsaturated oligomer with di- or polythiol compound, reactive diluents and a radical initiator will produce these properties. These materials can find use in many areas such as: Electronics packaging, displays, conformal coatings, seals, gaskets, fiber optics coatings, and golf ball coatings. | 03-15-2012 |
| 20110152466 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF - The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared. | 06-23-2011 |
| 20110130485 | IMIDE-LINKED MALEIMIDE AND POLYMALEIMIDE COMPOUNDS - The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds. | 06-02-2011 |
| 20110049731 | MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS - The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. | 03-03-2011 |
| 20110017400 | ANTI-BLEED COMPOUNDS, COMPOSITIONS AND METHODS FOR USE THEREOF - The invention is based on the discovery that addition of certain carboxylic acid derivatives of siloxanes to thermosetting adhesive compositions and die-attach pastes renders such compositions and pastes extremely resistant to resin bleed. The present invention provides siloxane-carboxylic acid compounds useful as anti-bleed additives. Also provided are adhesive compositions and pastes containing the compounds of the invention, which are particularly useful in applications that require little to no resin bleed prior to curing of the compositions (such as e.g., electronic packaging applications). | 01-27-2011 |
| 20100249276 | CURATIVES FOR EPOXY COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 09-30-2010 |
| 20100144977 | CURING AGENTS FOR EPOXY RESINS - A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV: | 06-10-2010 |
| 20100113643 | CURATIVES FOR EPOXY ADHESIVE COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 05-06-2010 |
| 20100063184 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF - The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction. | 03-11-2010 |
| 20100056671 | POLYFUNCTIONAL EPOXY OLIGOMERS - The present invention provides epoxy functional oligomeric compounds, methods of preparation and uses therefor. In particular, the present invention provides to oligomeric epoxy compounds derived from allyl glycidyl ether. | 03-04-2010 |
| 20100041845 | HETERO-FUNCTIONAL COMPOUNDS AND METHODS FOR USE THEREOF - The invention provides hetero-functional compound compounds useful in a variety of adhesive applications. More particularly, the invention provides compounds bearing at least one electron rich olefinic bond and at least one electron poor olefinic bond, wherein the two olefinic bonds are separated by a C | 02-18-2010 |
| 20100041832 | FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS - The present invention provides functionalized styrene oligomers and polymers prepared by Friedel-Crafts chemistry, as well as epoxidation products thereof. In particular, the invention provides allyl functional TPE. The invention also provides methods for making the functionalized styrene oligomers and polymers of the invention as well as epoxidation products thereof, compositions containing the same, and methods for using the functionalized and epoxified styrene oligomers that take advantage of the unique properties of the compounds and compositions of the invention. | 02-18-2010 |
| 20100041823 | NOVEL SILOXANE MONOMERS AND METHODS FOR USE THEREOF - The invention provides novel siloxane monomers useful in a variety of adhesive applications. In one aspect, the siloxane compounds described herein can be used as Diels-Alder type curatives for bismaleimide or poly-maleimide monomers. The unsaturated resins shown here are attractive for use as maleimide curatives due to their poly-functionality. Each substituted styrenyl reside can react with two maleimide functional groups. Thus, an invention adhesive composition typically contains an excess of bismaleimide monomers. | 02-18-2010 |
| 20100041803 | THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF - Hyperbranched polymers and methods for preparing the same are disclosed. The polymers are obtained based on monomers synthesized via reacting a substituted or unsubstituted cyclic anhydride with a bifunctional amine. | 02-18-2010 |
