| Denki Kagaku Kogyo Kabushiki Kaisha Patent applications |
| Patent application number | Title | Published |
|---|
| 20120130008 | POLYCHLOROPRENE, PROCESS FOR PRODUCTION OF SAME, AND ADHESIVES CONTAINING SAME - Provided is a polychloroprene having narrower molecular weight distribution, a method of producing the same and an adhesive containing the same. | 05-24-2012 |
| 20120112236 | LED CHIP ASSEMBLY, LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE - Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly ( | 05-10-2012 |
| 20120109072 | SYRINGE - There is provided a syringe capable of preventing the occurrence of “link-thread” from the distal end nozzle when the cap is pulled out, even in the case where the medicinal liquid filled has a high viscosity. | 05-03-2012 |
| 20120108744 | POLYCHLOROPRENE LATEX COMPOSITION, PROCESS FOR PRODUCTION OF SAME, AND PRODUCTS OF FORMING THEREOF - Provided are a polychloroprene latex composition giving immersion-molded articles superior in releasability from the mold during immersion molding and also superior in flexibility, a production method thereof and a molded article prepared by using the same. | 05-03-2012 |
| 20120094086 | EMBOSSED CARRIER TAPE AND METHOD OF PRODUCTION THEREOF - Provided are an embossed carrier tape having an embossed portion which is excellent in transparency and which has a high shape accuracy and a high buckling strength, and a method of production of the embossed carrier tape. The method of production of an embossed carrier tape comprises (a) a step of slitting a sheet which is obtained by biaxially stretching a styrene-based resin composition and which has an orientation relaxation stress of 0.2 to 0.8 MPa, measured in accordance with ASTM D-1504, into a tape-like form, (b) a step of heating only the reason of the slit tape where the embossed portion is to be formed, and (c) a step of forming an embossed portion in the heated area. Also, an embossed carrier tape manufactured by the method of production is provided. | 04-19-2012 |
| 20120070660 | CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, CURED OBJECT OR COMPOSITE - A curable resin composition that is adhesive and transparent. The curable resin composition comprises (1) a polymerizable vinyl monomer, (2) a curing agent, (3) a reducing agent, and (4) an acrylic block copolymer having a structure represented by formula (1): [a | 03-22-2012 |
| 20120070361 | METHOD FOR COLLECTION OF HEXACHLORODISILANE AND PLANT FOR THE METHOD - Disclosed is a method for collecting hexachlorodisilane which is produced as a by-product in the production of trichlorosilane from tetrachlorosilane and hydrogen. The method has the steps of: reacting a source gas composed of vaporized trichlorosilane and hydrogen at a temperature ranging from 700 to 1400° C. to yield a reaction product gas; cooling the reaction product gas to a temperature ranging from 30 to 60° C. to yield a cooled condensate liquid containing hexachlorodisilane; and concentrating and collecting a high boiling material containing hexachlorodisilane from the cooled condensate liquid. | 03-22-2012 |
| 20120026426 | GROUP OF PHOSPHOR PARTICLES, LIGHT-EMITTING DEVICE USING SAME, AND LIQUID CRYSTAL TELEVISION RECEIVER - Provided is a phosphor particle group of divalent europium-activated oxynitride green light emitting phosphor particles ( | 02-02-2012 |
| 20120022196 | POLYCHLOROPRENE ELASTOMER COMPOSITION, AND PRODUCTION METHOD- AND THE VULCANIZATE AND MOLDED ARTICLES THEREOF - Provided is a polychloroprene elastomer composition superior in extrusion processability and mechanical properties, a production method thereof, and vulcanized and molded articles thereof. | 01-26-2012 |
| 20120022195 | SULFUR-MODIFIED CHLOROPRENE ELASTOMER COMPOSITION AND THE BLEND AND VULCANIZED ARTICLE THEREOF - Provided is a sulfur-modified chloroprene elastomer composition superior both in viscosity stability during storage and scorching resistance during processing and a blend and vulcanized article thereof. A sulfur-modified chloroprene elastomer composition, containing a thiuram compound in an amount of 1 to 2.5 mass % and having an organic acid content, as determined in accordance with JIS K6237, of 1.5 to 15 mass %, an ash content, as determined in accordance with JIS K6228, of 0.03 to 0.2 mass %, and a mass ratio of the organic acid content to the ash content (organic acid content/ash content) of 50 to 500, as they are so regulated by modification of the blending amount of the emulsifier. | 01-26-2012 |
| 20120003429 | COVER FILM - A cover film comprising a substrate layer, an intermediate layer comprising a resin composition containing 50% by mass or more of a metallocene linear low-density polyethylene resin having a density of 0.900 to 0.940×10 | 01-05-2012 |
| 20120000599 | ADHESIVE AND ADHESIVE SHEET - Provided is a adhesive and an adhesive sheet which exhibit excellent chip-holding properties during dicing and from which chips can be easily stripped during pick up, even when considering changes over time. It is a adhesive composition which contains both (A) a (meth)acrylic acid ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of less than 350,000 and (B) a (meth)acrylic ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of 350,000 to 2,000,000 at a weight ratio of 10:90 to 90:10, and further contains 0.5 to 20 parts by mass of a crosslinking agent per 100 parts by mass of components (A) and (B) in total, the crosslinking agent being a crosslinking agent that reacts with both the functional groups of the component (A) and the functional groups of the component (B). | 01-05-2012 |
| 20110316040 | COMPOSITE SUBSTRATE FOR LED LIGHT EMITTING ELEMENT, METHOD OF PRODUCTION OF SAME, AND LED LIGHT EMITTING ELEMENT - A substrate for an LED light emitting element having a small difference of linear thermal expansion coefficient with the III-V semiconductor crystal constituting an LED, having an excellent thermal conductivity, and suitable for high output LEDs. A porous body comprises one or more materials selected from silicon carbide, aluminum nitride, silicon nitride, diamond, graphite, yttrium oxide, and magnesium oxide and has a porosity that is 10 to 50 volume % and a three-point bending strength that is 50 MPa or more. The porous body is infiltrated, by means of liquid metal forging, with aluminum alloy or pure aluminum at an infiltration pressure of 30 MPa or more, cut and/or ground to a thickness of 0.05 to 0.5 mm and to a surface roughness (Ra) of 0.01 to 0.5 μm, then is formed with a metal layer comprising one or more elements selected from Ni, Co, Pd, Cu, Ag, Au, Pt and Sn on its surface to a thickness of 0.5 to 15 μm, so as to thereby produce the composite substrate for the LED light emitting element. | 12-29-2011 |
| 20110316038 | SUBSTRATE COMPRISING ALUMINUM/GRAPHITE COMPOSITE, HEAT DISSIPATION PART COMPRISING SAME, AND LED LUMINESCENT MEMBER - A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×10 | 12-29-2011 |
| 20110311831 | METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE - A method for manufacturing a substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, having a lamination step of laminating and integrating a laminate having an insulating adhesive agent which is composed of a resin containing heat conductive fillers and has a heat conductivity of 1.0 W/mK or more and a metal layer member, with a metal layer member having a thick metal section while drawing out each member. | 12-22-2011 |
| 20110300384 | POWDER, METHOD FOR PRODUCING SAME, AND RESIN COMPOSITION CONTAINING SAME - Provided is a semiconductor sealing material in which the contamination rate of conductive foreign matter is extremely low. Further provided are powder comprising spherical silica powder and/or spherical alumina powder suitable for preparing such a semiconductor sealing material, a method for producing the same, and a resin composition. The powder comprises spherical silica powder and/or spherical alumina powder, and when a color reaction test for particles using an aqueous potassium ferricyanide solution under specific conditions is performed for magnetizable particles having a particle size of 45 [mu]m or more, the ratio of the number of particles which develop color to the total number of the magnetizable particles is 20% or less. Such powder can be produced by supplying a specific amount of oxygen gas and/or water vapor to at least one arbitrary site at which the atmospheric temperature is 1600 to 1800 DEG C. in a furnace at an angle of 60 DEG to 90 DEG with respect to the injection direction of a starting material of the powder, and setting the relative velocity of the starting material of the powder and/or the spherical powder to stainless steel and/or iron to 5 m/s or less. | 12-08-2011 |
| 20110293945 | VINYLIDENE FLUORIDE RESIN FILM - Provided is a vinylidene fluoride resin film that has good adhesiveness to a base material, achieves good dispersivity even when a pigment is contained in large amounts, and has excellent thermal stability during a forming process. | 12-01-2011 |
| 20110287247 | COMPOSITE PARTICLES, PROCESS FOR PRODUCING THE COMPOSITE PARTICLES, HOLLOW PARTICLES, PROCESS FOR PRODUCING THE HOLLOW PARTICLES, AND USE OF THE HOLLOW PARTICLES - An organic polymer-silicon compound composite particle comprising (a) a core composed of an organic polymer particle containing polyvinyl acetate as a principal component and (b) a shell containing a silicon compound, an average particle size of the organic polymer-silicon compound composite particle being 5 to 150 nm. | 11-24-2011 |
| 20110284914 | METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE - A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section. | 11-24-2011 |
| 20110276005 | SYRINGE - Provided is a syringe with which it is possible to hold with greater stability a liquid inside the barrel while maintaining the slidability and air-tightness between the barrel and the gasket without requiring fixation of silicone oil, and which is excellent in terms of accuracy of visual inspection. The syringe has a resin barrel, a gasket slidably inserted inside the barrel, a plunger attached to the gasket, and a silicone film obtained by applying silicone oil having a kinematic viscosity of 500 to 10,000 cSt over the inner peripheral surface of the barrel in an amount of 5 to 50 μg per 1 cm | 11-10-2011 |
| 20110272731 | SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE - This invention provides a substrate for a light emitting element package that can obtain a sufficient heat dissipation effect from a light emitting element and can also lower the costs and reduce the size as a substrate for packaging the light emitting element, as well as a light emitting element package using the same. The substrate for a light emitting element package includes an insulating layer | 11-10-2011 |
| 20110269868 | CURABLE RESIN COMPOSITION, SURFACE PROTECTION METHOD, TEMPORARY FIXATION METHOD, AND SEPARATION METHOD - To provide an environmentally-friendly curable resin composition for surface protection, having a high adhesive strength and being capable of forming a protective film which will readily be removed in the film form without adhesive residue in water on a member to be processed, a photocurable adhesive using it, a method for temporarily fixing a member, and a method for removing a protective film. | 11-03-2011 |
| 20110265934 | ADHERENT COMPOSITION AND METHOD OF TEMPORARILY FIXING MEMBER THEREWITH - Provided are a temporal fixation method in processing of optical members and a resin composition suitable therefore, which uses a composition which is characterized by containing the following (A3), (B3) and (D3), wherein (A3) is a urethane (meth)acrylate; (B3) is one or more (meth)acrylic acid derivative monomers selected from the group consisting of n-(meth)acryloyloxyalkyl hexahydrophthalimides, carboxyl group-containing (meth)acrylates and (meth)acrylic acid derivative monomers represented by the formula (C3): | 11-03-2011 |
| 20110257300 | CERAMIC POWDER AND APPLICATIONS THEREOF - The present invention provides ceramic powder capable of being incorporated into rubber or a resin for the preparation of a composition, which shows excellent heat resistance and flame retardancy and which is used, for instance, as a semiconductor-sealing material. The ceramic powder has a multi-peak frequency distribution pattern having at least two peaks as a particle size distribution as determined using a laser diffraction-scattering type particle size-analyzer, wherein the maximum particle size for the first peak ranges from 40 to 80 μm and that for the second peak ranges from 3 to 8 μm and wherein the rate of the particles having a particle size of not less than 20 μm and less than 40 μm is not more than 20% by mass (inclusive of 0% by mass). | 10-20-2011 |
| 20110245276 | PHOTOSTABILIZED PHARMACEUTICAL COMPOSITIONS - A crosslinking reaction and a reaction for reducing molecular weight that take place in a hyaluronic acid-methotrexate conjugate upon irradiation with light are suppressed to improve the photostability of the conjugate. Specifically, a substance having a quenching effect and/or a radical scaveng effect is added to a pharmaceutical composition containing the hyaluronic acid-methotrexate conjugate. | 10-06-2011 |
| 20110237712 | CERAMIC POWDER AND USE THEREOF - The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3. | 09-29-2011 |
| 20110223743 | ELECTRONIC COMPONENT MANUFACTURING METHOD - The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand while improving the cohesive force. Provided is a dicing method for semiconductor wafers with a semi-cured adhesive layer that comprises a process to coat the back surface of semiconductor wafers with a paste-like adhesive and semi-cure the paste-like adhesive in a sheet form using heating or ultraviolet irradiation to form a semi-cured adhesive layer, a gluing process to glue an adhesive sheet, wherein an ultraviolet curable adhesive is laminated on a base film, onto the semi-cured adhesive layer, an ultraviolet irradiation process to apply ultraviolet irradiation to the ultraviolet curable adhesive, and a dicing process to dice the semi-cured adhesive layer glued to the adhesive sheet and the semiconductor wafers. | 09-15-2011 |
| 20110212324 | COVER TAPE - Provided is a cover tape that has a small range of stripping strength and generates little static electricity when stripped at a high speed. The cover tape according to the present invention comprises at least a substrate layer, an intermediate layer, a charge transfer layer, and a heat seal layer, characterized in that (A) the charge transfer layer containing an acid-modified polyolefin resin and a conductive agent, and (B) the heat seal layer containing (a) a thermoplastic resin component composed of an acrylic resin, and (b) a styrene-conjugated diene copolymer or a hydrogenated resin thereof, the mass ratio of the two components ((a)/(b)) being 20/80 to 80/20. | 09-01-2011 |
| 20110198771 | MANUFACTURING METHOD OF ALUMINUM-DIAMOND COMPOSITE - A process for the production of an aluminum-diamond composite, characterized by comprising the step of preparing a diamond powder having a specific diameter, the step of adding a colloidal silica to the diamond powder to form a slurry, the step of subjecting the slurry to press forming or slip casting to produce a compact of the diamond particles, the step of firing the compact either in air or in a nitrogen atmosphere to form a porous diamond preform, the step of heating the porous diamond preform, the step of heating an aluminum alloy to a temperature equal to or above the melting point of the alloy and impregnating the molten alloy into the porous diamond preform to make a flat plate-like aluminum-diamond composite wherein both surfaces are covered with surface layers containing an aluminum-base metal, and the step of working the aluminum-diamond composite into an aluminum-diamond composite. | 08-18-2011 |
| 20110190709 | Injector - There is provided a injector in which a backstop function is realized by a collar part at a position situated away from a gasket in the direction of the side of the proximal end and adequate sterilization can be carried out, with a plunger rod (in which the collar part is formed) assembled, while aiming to secure airtightness. | 08-04-2011 |
| 20110190414 | ADHESIVE COMPOSITION AND ADHESION METHOD - Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper. | 08-04-2011 |
| 20110172345 | RESIN COMPOSITION - Disclosed is a resin composition having an excellent balance between shortness of curing time and longness of pot life. The resin composition contains (A) an organopolysiloxane having an alkenyl group, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a hydrosilylation catalyst, (D) a silane coupling agent and (E) an unsaturated dicarboxylic acid ester. The component (B) contains (B-1) an organopolysiloxane having a molecular weight of not less than 5,000 but not more than 50,000 and (B-2) an organopolysiloxane having a molecular weight of not less than 100 but not more than 5,000, and the ratio of (B-2) to (B-1) is preferably not less than 0.01% by mass but not more than 20% by mass. | 07-14-2011 |
| 20110128023 | PROBE INSPECTING METHOD AND CURABLE RESIN COMPOSITION - Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe. | 06-02-2011 |
| 20110123821 | ALUMINUM-DIAMOND COMPOSITE AND MANUFACTURING METHOD - Disclosed is an aluminum-diamond composite having both high thermal conductivity and thermal expansion coefficient close to those of semiconductor elements, which is improved in platability in the surface and surface roughness so that the composite becomes suitable for use as a heat sink of a semiconductor element of the like. Specifically disclosed is a plate-like aluminum-diamond composite containing diamond particles and a metal mainly composed of aluminum. The aluminum-diamond composite is composed of a composite part and surface layers formed on both sides of the composite part, and the surface layers are composed of a material containing a metal mainly composed of aluminum. The diamond particle content is 40-70% by volume of the entire aluminum-diamond composite. | 05-26-2011 |
| 20110086973 | CURABLE COMPOSITION - To provide a curable composition which is quickly cured, with which objects to be bonded can be sufficiently bonded even if gaps are formed between the objects, if the size of the gaps is at a level of at most 100 μm. | 04-14-2011 |
| 20110077329 | AMORPHOUS SILICEOUS POWDER, PROCESS FOR PRODUCTION THEREOF, RESIN COMPOSITION, AND SEMICONDUCTOR ENCAPSULATION MATERIAL - A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20. | 03-31-2011 |
| 20110059682 | ADHESIVE SHEET AND PROCESS FOR MANUFACTURING ELECTRONIC PART - An adhesive sheet comprising a sheetlike base material and, superimposed on one major surface thereof, an adhesive layer, wherein the average surface roughness on one major surface of the base material is in the range of 0.1 to 3.5 μm and on the other major surface thereof is in the range of 0.05 to 0.7 μm. In this structure, the average surface roughness values on both the major surfaces of the base material as a constituent of the adhesive sheet are regulated so as to fall within respective specified ranges, so that not only can any blocking occurring in backwinding of reeled adhesive sheet be inhibited but also any occurrence of minute unevenness (waving) on the wafer surface after grinding can be inhibited, and further that the transparency of the adhesive sheet can be maintained. | 03-10-2011 |
| 20110052873 | FILM AND METHOD OF FILM PROCESSING - [PROBLEMS] To provide a film superior in hand tearability and linear cutting efficiency that can be produced without need for a complicated blending of resin raw materials and high-grade processing facilities. | 03-03-2011 |
| 20110046267 | ALUMINA POWDER, PROCESS FOR ITS PRODUCTION AND RESIN COMPOSITION EMPLOYING IT - To provide an alumina powder having an improved flowability, a process for its production, and a resin composition employing it. | 02-24-2011 |
| 20110040038 | THERMOPLASTIC RESIN COMPOSITION - Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance. | 02-17-2011 |
| 20110039764 | THERAPEUTIC COMPOSITION FOR BONE INFECTIOUS DISEASE - A biodegradable composition containing an antibiotic or a physiologically active substance for use in surgical treatment of infection. A highly safe and biocompatible composition showing appropriately sustained release of an antibiotic or physiologically active substance which produces excellent antibiotic and bone regenerating effects. A composition having excellent effects in treatment of bone infection occurring after operations for total arthroplasty and/or bone fracture. (1) A medical composition for treatment of bone infection comprising an antibiotic and a polysaccharide. | 02-17-2011 |
| 20110024541 | METHOD OF WINDING TAPE-LIKE MULTI-LAYER FILM AND WOUND ARTICLE OF TAPE-LIKE MULTI-LAYER FILM - A method of winding a tape-like laminated film in a disk form, in which the winding tension force applied to the tape-like laminated film is so controlled as to be 0%/winding meters to +0.10%/winding meters to the tension value at the start of winding in accordance with the length of the tape-like laminated film wound around a core. According to this method, the occurrence of the deformation and the winding breakage of the tape-like laminated film during the transportation and storage thereof can be suppressed. | 02-03-2011 |
| 20110021666 | AMORPHOUS SILICA POWDER, PROCESS FOR ITS PRODUCTION, AND SEALING MATERIAL FOR SEMICONDUCTORS - To provide an amorphous silica powder suitable for a sealing material for semiconductors having improved HTSL properties and HTOL properties, and a process for its production. | 01-27-2011 |
| 20110008561 | SHEET FOR PACKAGING ELECTRONIC PART - [Problems] Provided is a novel sheet for packaging electronic parts which is excellent in transparency and suitability for thickness reduction. | 01-13-2011 |
| 20100323141 | ACRYLIC RUBBER - To provide an acrylic rubber composition having an excellent heat resistance, especially an excellent balance between the residual ratio of the tensile strength and the residual ratio of the elongation after heat aging, when formed into a vulcanized product, and a hose article, a sealing article and a rubber vibration insulator using the acrylic rubber composition. | 12-23-2010 |
| 20100320424 | GRANULAR ACETYLENE BLACK, PROCESS FOR PRODUCTION THEREOF, AND COMPOSITION - The present invention provides a granulated acetylene black which can be easily and well dispersed when it is incorporated in at least one of a resin and a rubber, the process for producing it, and its composition. | 12-23-2010 |
| 20100294423 | PROTECTIVE FILM FOR LASER PROCESSING AND PROCESSING METHOD USING THE SAME - Disclosed is a protective film for laser processing, which has high adhesiveness and is capable of protecting an object to be processed with a uniform thickness, while being prevented from carbonization/adhesion due to thickness variations. In addition, this protective film for laser processing is free from the problem of waste water contamination when it is removed. Also disclosed is a laser processing method using such a protective film. Specifically disclosed is a protective film for laser processing, which contains a (meth)acrylate copolymer and a radiation-polymerizable (meth)acrylate having an unsaturated bond. | 11-25-2010 |
| 20100275554 | METHOD OF PACKAGING RECORD ROLLS OF COVER TAPE AND PACKAGE - The method for packaging together a plurality of record rolls of cover tape according to the present invention comprises wrapping a stack obtained by roughly coaxially stacking said record rolls in a heat-shrink film; and heat-shrinking said heat-shrink film, so that a pressure of at least 0.8 mN/mm | 11-04-2010 |
| 20100248452 | ADHESIVE, ADHESIVE SHEET, MULTI-LAYERED ADHESIVE SHEET, AND PRODUCTION METHOD FOR ELECTRONIC PART - A multi-layered adhesive sheet | 09-30-2010 |
| 20100236716 | ADHESIVE COMPOSITION AND BONDING METHOD - To provide an adhesive composition having high adhesion and quick curing properties on the second time scale, and having a high retention in a durability test such as a high temperature and high humidity test. | 09-23-2010 |
| 20100233390 | VINYL CHLORIDE RESIN FIBER AND METHOD FOR PRODUCING SAME - To provide a fiber made of a vinyl chloride resin which is excellent in heat resistance and thus hardly shrinks thermally even at a temperature exceeding 100° C. | 09-16-2010 |
| 20100227095 | ACRYLIC RUBBER COMPOSITION, AND VULCANIZED RUBBER THEREOF AND ITS APPLICATIONS - To provide an acrylic rubber composition and a vulcanized rubber that ensure heat resistance of the vulcanized rubber, especially less changes in the elongation at break (EB) and hardness of the vulcanized rubber under heating conditions. | 09-09-2010 |
| 20100222487 | INORGANIC HOLLOW POWDER, PROCESS FOR PRODUCING THE INORGANIC HOLLOW POWDER, AND COMPOSITION COMPRISING THE INORGANIC HOLLOW POWDER - Inorganic hollow powder is provided having a high purity, an enhanced fineness and a high hollowness. Specifically, inorganic hollow powder is provided having an average particle diameter of 1 to 5 μm, the maximum particle diameter of 20 μm or less, a particle size distribution standard deviation of 3 μm or less, and an average hollowness of 35 to 70 vol %. The inorganic hollow powder is obtained, for instance, by supplying, via an inorganic feed material powder supply pipe at a discharge rate of 80 m/s or more, inorganic raw material powder having a specific surface area of 500 m | 09-02-2010 |
| 20100209688 | WINDING STATE EVALUATION METHOD FOR TAPE FILM AND WINDING METHOD FOR TAPE FILM - A winding state evaluation method of a tape film includes a step of determining the attenuation rate of ultrasonic wave for the tape film ( | 08-19-2010 |
| 20100204389 | RESIN COMPOSITION AND CURED PRODUCT USING IT, AND SHEET - To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. | 08-12-2010 |
| 20100204383 | SILICA POWDER, PROCESS FOR ITS PRODUCTION, AND COMPOSITION EMPLOYING IT - To provide a silica powder which is excellent in flowability and packing properties and which is less likely to form a flash, a process for its production, and a composition having it incorporated in at least one of a rubber and a resin, particularly a sealing material. | 08-12-2010 |
| 20100204342 | SPHERICAL ORGANIC POLYMER-SILICON COMPOUND COMPOSITE PARTICLES, HOLLOW PARTICLES AND THEIR PRODUCTION METHODS - The present invention is to provide hollow particles with a low degree of agglomeration and having a high roundness, and a process for producing them. | 08-12-2010 |
| 20100196719 | CONDUCTIVE SHEET - To provide a sheet having mechanical strength which is capable of coping with high speed packaging and mounting of electronic components, which can be molded in a wide temperature region at a lower temperature side by various molding methods, and with which a molded product having formation of burrs and sink marks at the time of blanking and slitting remarkably reduced can be obtained. | 08-05-2010 |
| 20100196644 | ACRYLIC RUBBER COMPOSITION AND VULCANIZED PRODUCT THEREOF - To provide an acrylic rubber composition and its vulcanized product, having excellent workability and an excellent balance of the vulcanization properties, the reduction of scorching, the rubber mechanical properties, the compression set and the heat resistance. | 08-05-2010 |
| 20100194262 | ELECTRON SOURCE - An electron source producing an electron beam which is highly reliable and stable even when it is externally oscillated. The electron source comprises a cathode ( | 08-05-2010 |
| 20100180905 | METHOD OF PACKING FIBER FOR ARTIFICIAL HAIR - [Problems] To provide a method of packing fiber for artificial hair, while suppressing generation of folding mark during packaging, transportation and storage and yet preserving preferable processability and hairdressing characteristics. | 07-22-2010 |
| 20100164362 | METAL BASE CIRCUIT BOARD - Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer. | 07-01-2010 |
| 20100126389 | Filling Material for Reinforcing Joint and Construction Method of Filling Reinforcing Joint - A filler for reinforcement joint that ensures excellent fluidity and retention thereof, exhibiting appropriate length change ratio and high strength performance; and a method of reinforcement joint filling operation using the same. There are provided a filler for reinforcement joint containing a cement, an expanding material, a pozzolana micropowder, a water reducing agent and a sand, and a method of reinforcement joint filling operation using the same, characterized in that the expanding material is a calcium aluminoferrite expanding material, and that the pozzolana micropowder is a silicious micropowder having a silicon dioxide (SiO | 05-27-2010 |
| 20100119854 | PRIMER COMPOSITION FOR ACRYLIC ADHESIVE, BONDING METHOD AND ASSEMBLY - To provide a primer composition for assisting an acrylic adhesive which exhibits a temporarily fixing effect very quickly and which is completely cured quickly at room temperature, while maintaining excellent characteristics of the acrylic adhesive. | 05-13-2010 |
| 20100113658 | ADHESIVE COMPOSITION AND ADHESIVE USING SAME - To provide an adhesive composition which exhibits sufficient initial strength even in a wet state right after application, and which provides a coating film having sufficient flame retardancy after it is dried, and an adhesive using it. | 05-06-2010 |
| 20100105838 | MATERIAL FOR MD SHRINK AND MD SHRINK FILM - Provided are a material for an MD shrink film with good shrinking performance and thickness accuracy, and a film formed with the material. | 04-29-2010 |
| 20100090581 | ELECTRON SOURCE - Provided is an electron source which provides a stable electron beam even when vibration is applied from external to a device which uses the electron source. The electron source is provided with a needlelike chip ( | 04-15-2010 |
| 20100086788 | POLYVINYL ACETAL SHEET AND PROCESS FOR PRODUCTION THEREOF - Provided are a polyvinyl acetal sheet which is excellent in adhesion to glass, easy in control of adhesion, little colored, highly transparent and excellent in penetration resistance even under high-temperature conditions when the sheet is used for laminated glass or the like, a process for its production and a process for producing polyvinyl acetal particles used for the sheet. | 04-08-2010 |
| 20100076149 | POLYCHLOROPRENE LATEX COMPOSITION AND ITS PRODUCTION METHOD - A nonionic polychloroprene latex composition employing a polyvinyl alcohol as an emulsifier/dispersant has favorable chemical and mechanical stability but has a high viscosity, and therefore it has such drawbacks that its coating method is limited, and it is hardly made to have a high solid content. | 03-25-2010 |
| 20100074824 | PROCESS FOR CONTINUOUSLY PRODUCING MONOSILANE - Provided is a process for readily and efficiently producing monosilane which is industrially significantly useful. | 03-25-2010 |
| 20100072294 | SET ACCELERATOR AND TECHNIQUE FOR SPRAYING WITH THE SAME - To provide a quick-setting admixture for spraying and a spraying method, which are effective to prevent solidification of a quick-setting admixture slurried in a quick-setting admixture-adding tool. | 03-25-2010 |
| 20100068540 | CURABLE COMPOSITION, BONDING METHOD AND ASSEMBLY - To provide a curable composition and an adhesive which exhibit a temporarily fixing effect very quickly and which are completely cured quickly at room temperature, and a bonding method. | 03-18-2010 |
| 20100051855 | ALUMINA POWDER AND METHOD FOR PREPARING THE SAME AS WELL AS USE THEREOF - Herein disclosed is alumina powder incorporated into a composition which should have excellent heat conduction and used as a heat-radiating member and for sealing a semiconductor. The spherical α-alumina powder has an average sphericity of not less than 0.93 and a content of α-crystalline form is not less than 95% and the spherical α-alumina powder is prepared according to the method, which comprises the steps of: (1) softening metallic aluminum powder or alumina powder through the treatment with a flame; (2) solidifying the softened powder by passing the same through a zone maintained at a temperature ranging from 800 to 500° C.; (3) increasing the content of α-phase by passing the solidified powder through a zone maintained at a temperature ranging from 950 to 1,500° C.; and (4) collecting the resulting powdery product while cooling the same. | 03-04-2010 |
| 20100048435 | GREASE - The present invention provides a grease showing low thermal resistance, which is not significantly deteriorated by a heat cycle, particularly, a grease suitable as a thermally conductive material for heat-generating electronic components. | 02-25-2010 |
| 20100040807 | FIBER BUNDLE FOR ARTIFICIAL HAIR, AND PROCESS FOR ITS PRODUCTION - To provide a fiber bundle for artificial hair which has a well balanced combination of properties such as bulkiness, yarn separability, weaving efficiency and hot water-curling efficiency. The fiber bundle for artificial hair is a fiber bundle obtained by crimping fibers (A) having a flexural rigidity of from 0.7 to 2.5 gf·cm | 02-18-2010 |
| 20100035494 | HIGHLY THERMALLY CONDUCTIVE ACRYLIC ADHESIVE SHEET - To provide a thermally conductive acrylic sheet having a high temperature conductivity and also a good adhesion characteristic. | 02-11-2010 |
| 20100027261 | LED LIGHT SOURCE UNIT - To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life. | 02-04-2010 |
| 20100026160 | ELECTRON SOURCE - An electron source showing little surplus current even at a time of high angular intensity operation is provided. An electron source comprising an electron emitting portion, a suppressor electrode and an extractor electrode, wherein the electron emitting portion is present at a leading edge of an end of a single crystal rod having a shape comprising a first truncated cone portion or a cone portion, and a second truncated cone portion continuing therefrom. It is preferably the electron source, wherein the single crystal rod has an oxide of a metal element selected from the group consisting of Ca, Sr, Ba, Sc, Y, La, Ti, Zr, Hf and lanthanoide elements as a diffusion source, and the single crystal rod is made of tungsten or molybden of <100> orientation. | 02-04-2010 |
| 20100022711 | TUBULAR FORMING MATERIAL AND ITS HEAT-SHRINKABLE FILM - To provide a tubular forming material excellent in bubble formation stability in the case of producing a heat-shrinkable film. | 01-28-2010 |
| 20100000670 | ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME - To provide a method for temporarily fixing an optical member suitable for processing of optical members, and an adhesive composition useful for such a method. | 01-07-2010 |
| 20090312477 | CERAMIC POWDER AND APPLICATIONS THEREOF - The present invention provides ceramic powder capable of being incorporated into rubber or a resin for the preparation of a composition, which shows excellent heat resistance and flame retardancy and which is used, for instance, as a semiconductor-sealing material. The ceramic powder has a multi-peak frequency distribution pattern having at least two peaks as a particle size distribution as determined using a laser diffraction-scattering type particle size-analyzer, wherein the maximum particle size for the first peak ranges from 40 to 80 μm and that for the second peak ranges from 3 to 8 μm and wherein the rate of the particles having a particle size of not less than 20 μm and less than 40 μm is not more than 20% by mass (inclusive of 0% by mass). | 12-17-2009 |
| 20090306272 | CERAMIC POWDER AND METHOD OF USING THE SAME - The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F | 12-10-2009 |
| 20090298973 | Cement Admixture and Cement Composition Using Thereof - A cement admixture for concrete using a polycarboxylate based water reducing agent that can produce light concrete with little slump loss and good workability that prevents dragging and the like and having no material separation, and a cement composition using the cement admixture are provided. | 12-03-2009 |
| 20090295046 | ALUMINUM NITRIDE POWDER AND ALUMINUM NITRIDE SINTERED COMPACT - The present invention relates to a process of producing an aluminum nitride sintered body which satisfies both high thermal conductivity and reduction in the shrinkage factor at the time of sintering. The aluminum nitride sintered body is a sintered body of a powder mixture containing an aluminum nitride powder and a sintering aid, characterized by having a thermal conductivity of at least 190 W/m·K and a shrinkage factor represented by the percentage of {(dimensions of the molded body before sintering)−(dimensions of the sintered body after sintering)}/(dimensions of the molded body before sintering) of at most 15%. | 12-03-2009 |
| 20090283307 | SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT SUBSTRATE USING THE SAME, AND ITS USE - Provided are a silicon nitride substrate and a silicon nitride circuit board with excellent electrical characteristics, and power control parts utilizing them. | 11-19-2009 |
| 20090280351 | ALUMINUM/SILICON CARBIDE COMPOSITE AND HEAT RADIATION PART MAKING USE OF THE SAME - An aluminum-silicon carbide composite suitable for a base plate for power module is provided. A base plate for power module, comprising an aluminum-silicon carbide composite that is a flat plate-shaped silicon carbide porous body impregnated with a metal containing aluminum as the main component, and an aluminum layer made of a metal containing aluminum as the main component formed only on one of the principal planes of the composite, wherein a rear surface being the other one of principal planes of the aluminum-silicon carbide composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is a rectangle or a rectangle from which portions encompassing holes in the peripheral portion are removed. Plating property is imparted to the composite by providing an aluminum layer on one principal plane of the composite, and the flatness of the composite was improved by grinding its rear surface so that the aluminum-silicon carbide composite is exposed to the outside, and further, the warpage shape after the rear surface is ground is controlled by controlling the thickness of the aluminum layer. | 11-12-2009 |
| 20090280280 | CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE SHEETS COMPRISING THE SAME - To provide an electrically conductive resin composition with which contamination of an electronic component resulting from abrasion of an electrically conductive sheet by friction with the electronic component is small, and which is excellent in sealing properties with a cover tape. | 11-12-2009 |
| 20090279300 | LED LIGHT SOURCE UNIT - To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life. | 11-12-2009 |
| 20090263604 | PROCESS FOR PRODUCTION OF CROSS COPOLYMERS, CROSS COPOLYMERS OBTAINED BY THE PROCESS, AND USE THEREOF - To provide a novel cross copolymer and resin composition which are improved in heat resistance and compatibility over conventional ethylene/aromatic vinyl compound copolymers and which have low crystallinity, are excellent in softness, transparency and compatibility and show mechanical properties similar to soft vinyl chloride resins, as compared with conventional cross copolymers. | 10-22-2009 |
| 20090246518 | COVER FILM - To provide a cover film with which the temperature range of a sealing iron to obtain peel strength is wide and stability of peel strength is good at the time of peeling, and which is excellent in heat sealing properties to a carrier tape. | 10-01-2009 |
| 20090226503 | ADHESION INHIBITING MATERIAL FOR VERTEBRAL/SPINAL OPERATION - It is to provide a material to inhibit spine/spinal cord adhesion in the form of a sponge, a film or a suspension to be used for the purpose of assisting/accelerating the tissue healing. An adhesion inhibiting material for a spine/spinal cord surgery in the form of a sponge, a film or a suspension to be used for reducing the degree of adhesion or for inhibiting adhesion caused by a spine/spinal cord surgery, which contains a crosslinked acid polysaccharide. | 09-10-2009 |
| 20090202824 | TAPE SUBSTRATE AND ADHESIVE TAPE - Provided are a tape substrate having excellent oil resistance as well as balanced properties of flexibility, a hand cutting property and heat resistance, and an adhesive tape using the tape substrate. | 08-13-2009 |
| 20090133912 | RESIN COMPOSITION AND HYBRID INTEGRATED CIRCUIT BOARD MAKING USE OF THE SAME - A substrate, a circuit board and a multilayer circuit board are provided which, although being made of an inorganic filler as a crushed product, are capable of providing a highly reliable hybrid integrated circuit because of having excellent adhesion to a metal plate or metal foil and exhibiting a high thermal conductivity. | 05-28-2009 |
| 20090093414 | Hyaluronic Acid-Methotrexate Conjugate - An object of the present invention is to provide a hyaluronic acid-methotrexate conjugate useful as a therapeutic drug for joint disorders. There is provided a hyaluronic acid-methotrexate conjugate useful for the treatment of joint disorders, wherein methotrexate is conjugated with a hydroxy group of hyaluronic acid through a linker containing a peptide chain consisting of 1 to 8 amino acids, and the linker is conjugated with the hyaluronic acid through a carbamate group. | 04-09-2009 |
| 20090092793 | ALUMINUM/SILICON CARBIDE COMPOSITE AND RADIATING PART COMPRISING THE SAME - A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 μm in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies, | 04-09-2009 |
| 20090085464 | Resin Composition and Sheet Containing Phosphor, and Light Emitting Element Using Such Composition and Sheet - Provided is a phosphor for a white light emitting device with a blue to ultraviolet light as a light source. | 04-02-2009 |
| 20090075056 | ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING THE SAME - An aluminum-silicon carbide composite suitable as e.g. a base plate for power module is provided. | 03-19-2009 |
| 20090071378 | Ultra high strength fiber-reinforced cement composition, ultra high strength fiber-reinforced mortar or concrete and ultra high strength cement additives - Therefore, the problem to be solved by the present invention is to provide highly general purpose ultra high strength fiber-reinforced mortar or concrete that shows a higher fluidity (workability) at the fresh state, a higher bending strength with a less content of metal fiber by enhancing both the absolute value of the compressive strength of mortar -matrix excluding metal fiber and the ratio of the bending strength relative to the compressive strength simultaneously at the hardened state, and acceptability of fine aggregate being used in ordinary ready-mixed concrete. An ultra high strength fiber-reinforced cement composition is characterized in that it contains cement, silica fume, coal gasification fly ash, gypsum and metal fiber and that the mass ratio of silica fume : coal gasification fly ash is 95 through 50 portions: 5 through 50 portions. Ultra high strength fiber-reinforced mortar or concrete contains such a cement composition and fine aggregate. An ultra high strength cement additives is characterized in that it contains silica fume, coal gasification fly ash and gypsum as principal ingredients and the mass ratio of silica fume: coal gasification fly ash is 95 through 50 portions: 5 through 50 portions. | 03-19-2009 |
| 20090050845 | BETA TYPE SIALON FLUORESCENT SUBSTANCE - A β type Sialon fluorescent substance is disclosed that is capable of achieving enhanced brightness of a white light emitting diode using blue to ultraviolet light as a light source. In the fluorescent substance which contains not less than 90% by mass of a β type Sialon composition represented by general formula: Si | 02-26-2009 |
| 20090032295 | METAL BASE CIRCUIT BOARD, LED, AND LED LIGHT SOURCE UNIT - To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. | 02-05-2009 |
| 20090030134 | Inorganic Hollow Particle, Process For Producing The Same, And Composition Containing The Same - The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m | 01-29-2009 |
| 20090030107 | ENERGY RAY-CURABLE RESIN COMPOSITION AND ADHESIVE USING SAME - To provide an energy ray-curable resin composition which exhibits equally high adhesive strength to various objects to be bonded, such as glasses, metals and plastics and which has good heat resistance and moisture resistance and is excellent also in rigidity, particularly an energy ray-curable resin composition having a low cure shrinkage and little adhesion strain. | 01-29-2009 |
| 20090029128 | METHOD FOR PRODUCING CERAMIC SHEET, CERAMIC SUBSTRATE USING CERAMIC SHEET OBTAINED BY SUCH METHOD, AND USE THEREOF - Provided are a process for producing a highly reliable ceramic sheet with stable quality by reducing voids, and a ceramic substrate using the sheet. | 01-29-2009 |
| 20090023355 | ELECTRON SOURCE MANUFACTURING METHOD - An electron source excellent in the uniformity in current emission distribution is provided certainly and at a low cost | 01-22-2009 |
| 20090021141 | FLUORESCENT SUBSTANCE AND PROCESS FOR PRODUCING THE SAME, AND LUMINESCENT ELEMENT USING THE SAME - Provided is a phosphor material for a white LED with a blue LED or ultraviolet LED as a light source. | 01-22-2009 |
| 20080289750 | Curable Resin Composition, Surface Protection Method, Temporary Fixation Method, and Separation Method - To provide an environmentally-friendly curable resin composition for surface protection, having a high adhesive strength and being capable of forming a protective film which will readily be removed in the film form without adhesive residue in water on a member to be processed, a photocurable adhesive using it, a method for temporarily fixing a member, and a method for removing a protective film. | 11-27-2008 |
| 20080282936 | CEMENT ADMIXTURE, CEMENT COMPOSITION, AND METHOD FOR SUPPRESSING CARBONATION USING THE SAME - A cement admixture and a cement composition having a carbonation suppressing effect and a heat-of-hydration suppressing effect are provided. A cement admixture containing one or more non-hydraulic compounds selected from the group consisting of γ-2CaO.SiO | 11-20-2008 |
| 20080255293 | Silica Powder and Use Thereof - The present invention herein provides silica powder which can be incorporated into a sealing material at a high content to thus give a sealing material having excellent moldability. The silica powder at least has, in the volume-based frequency distribution of particle size as determined by the laser diffraction-scattering technique, a maximum frequency value for a mode peak 1 present in a particle size range extending from 1 to 4 μm and a maximum frequency value for a mode peak 2 present in a particle size range extending from 15 to 55 μm, wherein the maximum frequency value for the mode peak 2 is greater than that for the mode peak 1, the mode peak 2 has a shoulder, and the content of particles whose particle size ranges from 15 to 55 μm is larger than that of particles whose particle size ranges from 1 to 4 μm. | 10-16-2008 |
| 20080214764 | Modified Polyvinyl Alcohol and Process for Producing the Same - The present invention provides modified PVA having unsaturated double bonds derived from a specific monomer in the main chain of the molecule. | 09-04-2008 |
| 20080210250 | Fiber Bundle for Artificial Hair and Head Decoration Article Comprising the Same - To provide fibers for artificial hair prepared under a low nozzle pressure with little gumming, and a fiber bundle for artificial hair having a soft touch close to human hair, while maintaining uniform curling. | 09-04-2008 |
| 20080200326 | ALUMINUM NITRIDE POWDER AND ALUMINUM NITRIDE SINTERED COMPACT - The present invention relates to an aluminum nitride sintered body which satisfies both high thermal conductivity and reduction in the shrinkage factor at the time of sintering. The aluminum nitride sintered body is a sintered body of a powder mixture containing an aluminum nitride powder and a sintering aid, characterized by having a thermal conductivity of at least 190 W/m·K and a shrinkage factor represented by the percentage of {(dimensions of the molded body before sintering)-(dimensions of the sintered body after sintering)}/(dimensions of the molded body before sintering) of at most 15%. | 08-21-2008 |
