| 20080198557 | HEAT-DISSIPATING MODULE - A heat-dissipating module includes a circuit board, an electronic component and a heat-dissipating device. The circuit board includes at least a hollow portion and at least a contact portion. The electronic component includes at least a pin connected to the contact portion of the circuit board. The heat-dissipating device is embedded into the hollow portion of the circuit board and interposed between the electronic component and an inner surface of the covering body, thereby providing a heat-transfer path along the heat-conducting device to the covering body to remove the heat generate from the electronic component | 08-21-2008 |
