| DECA TECHNOLOGIES INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110202896 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING - An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units. | 08-18-2011 |
| 20110198762 | PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC - A method of panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die units in place, which are then encapsulated. The cured dielectric film is then patterned utilizing a mask-less patterning technique. | 08-18-2011 |
