Danfoss Silicon Power GmbH Patent applications |
Patent application number | Title | Published |
20140230989 | METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AND A POWER SEMICONDUCTOR WHICH IS USED TO BOND TO THICK WIRES OR STRIPS - The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal moulded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal moulded bodies, and applying the metal moulded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the moulded body. | 08-21-2014 |
20130032230 | FLOW DISTRIBUTOR - A flow distributor for distributing a flow of fluid through a cooling body, the flow distributor comprising:
| 02-07-2013 |
20120282772 | METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT - A method of manufacturing a semiconductor component includes the steps of manufacturing of a wafer, applying structures of components on the wafer to form a wafer assembly, applying a metal coating on the wafer, removing the metal coating in non-contact areas of the components, applying surrounds on the edge areas of the components, arranging the wafer on a foil held by a clamping ring, separating the components of the wafer compound carried by the foil from one another, arranging a covering mask on the areas of the separated components carried by the foil which are not to be coated, applying a metal coating on the separate components covered with the mask, removal of the mask, and removal of the components from the foil and further processing the separate components wherein that applying a metal coating on the separate components covered by the mask takes place by means of thermal spraying. | 11-08-2012 |
20120037688 | METHOD FOR PRODUCING A HIGH-TEMPERATURE AND TEMPERATURE-CHANGE RESISTANT CONNECTION BETWEEN A SEMICONDUCTOR MODULE AND A CONNECTION PARTNER - The invention relates to a method for producing a connection between a semiconductor component and semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process, wherein a metal powder suspension is applied to the areas of the semiconductor module to be connected later; the suspension layer is dried, outgassing the volatile components and generating a porous layer; the porous layer is pre-sealed without complete sintering taking place throughout the suspension layer; and, in order to obtain a solid electrically and thermally conductive connection of a semiconductor module to a connection partner from the group of: substrate, further semiconductor or interconnect device, the connection is a sintered connection generated without compression by increasing the temperature and made of a dried metal powder suspension that has undergone a first transport-safe contact with the connection partner in a pre-compression step and has been solidified at zero pressure using temperature sintering. | 02-16-2012 |
20110255246 | METHOD FOR MANUFACTURING A RIGID POWER MODULE SUITED FOR HIGH-VOLTAGE APPLICATIONS - Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps:
| 10-20-2011 |
20100277873 | METHOD FOR MANUFACTURING A RIGID POWER MODULE SUITED FOR HIGH-VOLTAGE APPLICATIONS - Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps:
| 11-04-2010 |
20090146293 | FLOW DISTRIBUTION MODULE AND A STACK OF FLOW DISTRIBUTION MODULES - A flow distribution module ( | 06-11-2009 |