| DAISHINKU CORPORATION Patent applications |
| Patent application number | Title | Published |
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| 20120067611 | SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE - A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material. | 03-22-2012 |
| 20120055708 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which an electronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate. | 03-08-2012 |
| 20120012356 | PACKAGE MEMBER ASSEMBLY, METHOD FOR MANUFACTURING THE PACKAGE MEMBER ASSEMBLY, PACKAGE MEMBER, AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE USING THE PACKAGE MEMBER - [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face. | 01-19-2012 |
| 20110265298 | METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained. | 11-03-2011 |
| 20110260577 | PIEZOELECTRIC RESONATOR DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device is provided with a piezoelectric resonator plate, and first and second sealing members that hermetically seal driving electrodes formed on the piezoelectric resonator plate. The piezoelectric resonator plate and the first sealing member are bonded together with a bonding material, and the piezoelectric resonator plate and the second sealing member are bonded together with a bonding material. Also, a multiple-surface bonding portion and a spread preventing portion are provided in at least either of a bonding area between the piezoelectric resonator plate and the first sealing member and a bonding area between the piezoelectric resonator plate and the second sealing member, the multiple-surface bonding portion allowing a bonding material to be bonded to multiple surfaces of different surface orientations, and the spread preventing portion being located on an outer side of the multiple-surface bonding portion and preventing a bonding region bonded to the bonding material from being enlarged. | 10-27-2011 |
| 20110228399 | OPTICAL FILTER - An optical filter | 09-22-2011 |
| 20110215678 | PIEZOELECTRIC RESONATOR DEVICE, MANUFACTURING METHOD FOR PIEZOELECTRIC... - A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface. | 09-08-2011 |
| 20110187236 | PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves. | 08-04-2011 |
| 20110114353 | ELECTRONIC COMPONENT PACKAGE, BASE OF ELECTRONIC COMPONENT PACKAGE, AND JUNCTION STRUCTURE OF ELECTRONIC COMPONENT PACKAGE AND CIRCUIT SUBSTRATE - An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid. | 05-19-2011 |
| 20110043079 | TUNING-FORK TYPE PIEZOELECTRIC RESONATOR PLATE AND TUNING-FORK TYPE PIEZOELECTRIC RESONATOR DEVICE - A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside. | 02-24-2011 |
| 20100327705 | PIEZOELECTRIC RESONATOR - A piezoelectric resonator includes a pair of driving electrodes and a pair of lead electrodes that are formed facing each other on the frontside and backside of a piezoelectric plate that operates in a thickness-shear vibration mode. The front and back driving electrodes are formed such that they each have one or more pairs of parallel sides and have the same shape, and their centers face each other. The parallel sides of one of the front and back driving electrodes are formed parallel with either the X-axis or the Z′-axis of the piezoelectric plate, but the parallel sides of the other driving electrodes are formed without being parallel with the X-axis and Z′-axis thereof. | 12-30-2010 |
| 20100270891 | SEALING MEMBER OF PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member. | 10-28-2010 |
| 20100033268 | PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device includes a metal base through which at least two metal lead terminals are erected via an insulating material, a piezoelectric resonator plate that is placed on the metal lead terminals and is electrically connected to the metal lead terminals via an electroconductive resin adhesive, and a metal lid that hermetically covers the piezoelectric resonator plate placed on the metal lead terminals. | 02-11-2010 |
| 20100006315 | ELECTRONIC COMPONENT PACKAGE - There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid. | 01-14-2010 |
| 20090267460 | PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves. | 10-29-2009 |
| 20090085428 | Crystal Resonator - A crystal resonator comprises an AT-cut crystal vibrating element that is driven by a thickness-shear mode and is in the shape of a rectangular plate. A pair of excitation electrodes is formed, facing front and rear surfaces of the crystal vibrating element. Each of the excitation electrodes is formed in the shape of a quadrangle as viewed from the top, and mass adjustment portions are formed at least two opposite sides of each of the excitation electrodes formed on the front and rear surfaces. | 04-02-2009 |
