DAISHINKU CORPORATION Patent applications |
Patent application number | Title | Published |
20160006413 | TUNING FORK TYPE PIEZOELECTRIC VIBRATION PIECE AND TUNING FORK TYPE PIEZOELECTRIC VIBRATOR - A tuning fork type piezoelectric vibration piece | 01-07-2016 |
20140083735 | ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PACKAGE MANUFACTURING METHOD - An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W | 03-27-2014 |
20140047687 | PIEZOELECTRIC RESONATOR DEVICE, MANUFACTURING METHOD FOR PIEZOELECTRIC RESONATOR DEVICE, AND METHOD FOR ETCHING CONSTITUENT MEMBER OF PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface. | 02-20-2014 |
20130214646 | ELECTRONIC COMPONENT PACKAGE AND PIEZOELECTRIC RESONATOR DEVICE - An electronic component package is provided with a base on which an electronic component element is mounted and a lid that includes a conductive member and that is bonded to the base with a sealing member so as to hermetically seal the electronic component element. The base includes a bottom portion and a wall portion that extends from the bottom portion. A cavity in which the electronic component element is mounted is formed on a first main surface of the base by the bottom portion and the wall portion. The base also includes electrode pads electrically connected to electrodes of the electronic component element, external terminals electrically connected to outside and line patterns electrically connected to the electrode pads and the external terminals. The external terminals include a GND terminal for grounding. The line patterns include a wall portion GND line pattern formed on the wall portion so as to connect the lid to the GND terminal, and an electronic component element GND line pattern formed on the first main surface of the base in the cavity so as to connect the electronic component element to the GND terminal. Furthermore, a connecting portion, which connects the electronic component element GND line pattern to the wall portion GND line pattern, is disposed between layers of the bottom portion and the wall portion in plane view of the base, without being exposed in the cavity. | 08-22-2013 |
20130098654 | BASE OF SURFACE-MOUNT ELECTRONIC COMPONENT PACKAGE, AND SURFACE-MOUNT ELECTRONIC COMPONENT PACKAGE - A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm. | 04-25-2013 |
20130094075 | IR CUT FILTER - An IR cut filter includes an infrared light absorber to absorb infrared light, and an infrared light reflector to reflect infrared light. The infrared light absorber has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 620 to 670 nm. The infrared light reflector has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 670 to 690 nm. The wavelength with respect to which the infrared light reflector has the 50% transmittance is longer than the wavelength with respect to which the infrared light absorber has the 50% transmittance. A combination of the infrared light absorber and the infrared light reflector provides a light transmission property of 50% transmittance with respect to a wavelength in the 620 to 670 nm wavelength band and less than 5% transmittance with respect to a 700 nm wavelength. | 04-18-2013 |
20130087739 | SCINTILLATOR MATERIAL AND SCINTILLATION DETECTOR - A scintillator material is made of a zinc-oxide single crystal grown on a +C surface or a −C surface of a plate-shaped seed crystal of zinc oxide including a C surface as a main surface. The zinc-oxide single crystal contains In and Li. In response to an incident radiation, the scintillator material emits fluorescence of less than 20-ps fluorescence lifetime. | 04-11-2013 |
20130020915 | TUNING FORK-TYPE PIEZOELECTRIC RESONATOR PLATE AND TUNING FORK-TYPE PIEZOELECTRIC RESONATOR - A tuning fork-type piezoelectric resonator plate has a resonator blank comprising a pair of vibrating leg portions and a base portion from which the leg portions protrude. The pair of leg portions are arranged in parallel protrudingly from one end face of the base portion, and a pronged portion is formed between the pair of leg portions in an intermediate position in a width direction of the one end face of the base portion. The base portion has a pair of through holes along the one end face of the base portion, and on another end face side opposite to the one end face of the base portion, a joining region that joins to an external portion. The pair of through holes are specially positioned and have special wall surface configurations. | 01-24-2013 |
20130009521 | QUARTZ PLATE AND QUARTZ RESONATOR IN WHICH THE QUARTZ PLATE IS USED - An AT-cut quartz plate having chamfered ridge portions and an almost rectangular shape in planar view, wherein a resonance frequency is equal to or larger than 7 MHz and equal to or smaller than 9 MHz, lengths of long and short sides of the rectangular shape are equal to or larger than 1.5 mm and equal to or smaller than 2.4 mm, and equal to or larger than a frequency difference between primary vibration and sub-vibration is equal to or larger than 975 kHz and equal to or smaller than 1,015 kHz. | 01-10-2013 |
20120313721 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material. | 12-13-2012 |
20120280759 | OSCILLATOR - There are disposed a sealing member, a pair of electrode pads to electrically couple a piezoelectric resonator, a plurality of connection pads to electrically couple an integrated circuit element and the piezoelectric resonator, and wiring patterns to establish electrical continuity between the pair of electrode pads and the plurality of connection pads, and the piezoelectric resonator and the integrated circuit element are disposed side by side in plan view. An output wiring pattern establishes electrical continuity between one of the connection pads and an alternating current output terminal of an oscillation circuit, and a power source wiring pattern establishes electrical continuity between one of the connection pads and a direct current power source terminal of the oscillation circuit. The electrode pads are disposed closer to the power source wiring pattern than the output wiring pattern. | 11-08-2012 |
20120280597 | PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed. | 11-08-2012 |
20120262030 | SEALING MEMBER FOR PIEZOELECTRIC RESONATOR DEVICE, AND PIEZOELECTRIC RESONATOR DEVICE - A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece. | 10-18-2012 |
20120235544 | LEAD TYPE PIEZOELECTRIC RESONATOR DEVICE - A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer. | 09-20-2012 |
20120187805 | PIEZOELECTRIC RESONATOR PLATE AND MANUFACTURING METHOD FOR PIEZOELECTRIC RESONATOR PLATE - In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed. | 07-26-2012 |
20120152585 | ELECTRONIC COMPONENT PACKAGE AND BASE OF THE SAME - A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face. | 06-21-2012 |
20120067611 | SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE - A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material. | 03-22-2012 |
20120055708 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which an electronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate. | 03-08-2012 |
20120012356 | PACKAGE MEMBER ASSEMBLY, METHOD FOR MANUFACTURING THE PACKAGE MEMBER ASSEMBLY, PACKAGE MEMBER, AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE USING THE PACKAGE MEMBER - [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face. | 01-19-2012 |
20110265298 | METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained. | 11-03-2011 |
20110260577 | PIEZOELECTRIC RESONATOR DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device is provided with a piezoelectric resonator plate, and first and second sealing members that hermetically seal driving electrodes formed on the piezoelectric resonator plate. The piezoelectric resonator plate and the first sealing member are bonded together with a bonding material, and the piezoelectric resonator plate and the second sealing member are bonded together with a bonding material. Also, a multiple-surface bonding portion and a spread preventing portion are provided in at least either of a bonding area between the piezoelectric resonator plate and the first sealing member and a bonding area between the piezoelectric resonator plate and the second sealing member, the multiple-surface bonding portion allowing a bonding material to be bonded to multiple surfaces of different surface orientations, and the spread preventing portion being located on an outer side of the multiple-surface bonding portion and preventing a bonding region bonded to the bonding material from being enlarged. | 10-27-2011 |
20110228399 | OPTICAL FILTER - An optical filter | 09-22-2011 |
20110215678 | PIEZOELECTRIC RESONATOR DEVICE, MANUFACTURING METHOD FOR PIEZOELECTRIC... - A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface. | 09-08-2011 |
20110187236 | PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves. | 08-04-2011 |
20110114353 | ELECTRONIC COMPONENT PACKAGE, BASE OF ELECTRONIC COMPONENT PACKAGE, AND JUNCTION STRUCTURE OF ELECTRONIC COMPONENT PACKAGE AND CIRCUIT SUBSTRATE - An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid. | 05-19-2011 |
20110043079 | TUNING-FORK TYPE PIEZOELECTRIC RESONATOR PLATE AND TUNING-FORK TYPE PIEZOELECTRIC RESONATOR DEVICE - A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside. | 02-24-2011 |
20100327705 | PIEZOELECTRIC RESONATOR - A piezoelectric resonator includes a pair of driving electrodes and a pair of lead electrodes that are formed facing each other on the frontside and backside of a piezoelectric plate that operates in a thickness-shear vibration mode. The front and back driving electrodes are formed such that they each have one or more pairs of parallel sides and have the same shape, and their centers face each other. The parallel sides of one of the front and back driving electrodes are formed parallel with either the X-axis or the Z′-axis of the piezoelectric plate, but the parallel sides of the other driving electrodes are formed without being parallel with the X-axis and Z′-axis thereof. | 12-30-2010 |
20100270891 | SEALING MEMBER OF PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member. | 10-28-2010 |
20100033268 | PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device includes a metal base through which at least two metal lead terminals are erected via an insulating material, a piezoelectric resonator plate that is placed on the metal lead terminals and is electrically connected to the metal lead terminals via an electroconductive resin adhesive, and a metal lid that hermetically covers the piezoelectric resonator plate placed on the metal lead terminals. | 02-11-2010 |
20100006315 | ELECTRONIC COMPONENT PACKAGE - There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid. | 01-14-2010 |
20090267460 | PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves. | 10-29-2009 |
20090085428 | Crystal Resonator - A crystal resonator comprises an AT-cut crystal vibrating element that is driven by a thickness-shear mode and is in the shape of a rectangular plate. A pair of excitation electrodes is formed, facing front and rear surfaces of the crystal vibrating element. Each of the excitation electrodes is formed in the shape of a quadrangle as viewed from the top, and mass adjustment portions are formed at least two opposite sides of each of the excitation electrodes formed on the front and rear surfaces. | 04-02-2009 |