| DAINIPPON SCREEN MFG CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120128336 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - A semiconductor wafer in which a carbon thin film is formed on a surface of a silicon substrate implanted with impurities is irradiated with flash light emitted from flash lamps. Absorbing the flash light causes the temperature of the carbon thin film to increase. The surface temperature of the silicon substrate implanted with impurities is therefore increased to be higher than that in a case where no thin film is formed, and the sheet resistance value can be thereby decreased. When the semiconductor wafer with the carbon thin film formed thereon is irradiated with flash light in high concentration oxygen atmosphere, since the carbon of the thin film is oxidized to be vaporized, removal of the thin film is performed concurrently with flash heating. | 05-24-2012 |
| 20120114316 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more. | 05-10-2012 |
| 20120063751 | Heat Treatment Apparatus Emitting Flash of Light - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 03-15-2012 |
| 20120061374 | Heat Treatment Apparatus Emitting Flash of Light - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 03-15-2012 |
| 20120057855 | Heat Treatment Apparatus Emitting Flash of Light - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 03-08-2012 |
| 20120008926 | HEAT TREATMENT APPARATUS HEATING SUBSTRATE BY IRRADIATION WITH LIGHT - A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer. | 01-12-2012 |
| 20110279501 | INKJET PRINTER AND IMAGE RECORDING METHOD - In recording an image by an inkjet printer, when not forming a dot on a recording paper, non-ejection operation of droplet is performed in a head part by a non-ejection pulse (P | 11-17-2011 |
| 20110279500 | INKJET PRINTER AND IMAGE RECORDING METHOD - In a head part of inkjet printer, a leading droplet and a following droplet are ejected from an outlet by inputting one driving signal, and the leading droplet and the following droplet land onto a recording paper. At this time, a waveform of the driving signal is set such that an average of distance from the center of a main dot element formed by the leading droplet to the farthest point in a group of dot elements formed by the leading droplet and the following droplet is equal to or more than 1.1 times an average of radius of the main dot element and equal to or less than 3.0 times the average. Therefore, the dot shape can be made noncircular, and as the result, it is possible to suppress jaggies on edges of an image on the recording paper and lowering of density in a solid area. | 11-17-2011 |
| 20110222126 | INKJET PRINTER AND INKJET PRINTING METHOD - An ejection part ( | 09-15-2011 |
| 20110174336 | SUBSTRATE PROCESSING APPARATUS - In a solution change processing which comprises: changing a processing solution stored in a processing bath, specifically deionized water for sulfuric acid; and controlling the temperature of sulfuric acid so changed to a predetermined temperature, first, deionized water is discharged from a processing bath and an external bath. Subsequently, sulfuric acid is supplied from a supplying nozzle to the external bath. Subsequently, an upper circulating process is started by opening and closing a predetermined valve, while allowing a pump and a temperature controller be operated. At the time the temperature of a processing solution is higher than a predetermined value, an inside circulating process is carried out by opening and closing a predetermined valve, while having the pump and the temperature controller keep operating. | 07-21-2011 |
| 20100328376 | IMAGE RECORDING DEVICE - An image recording device for recording an image by an interlace system of scanning a specified region repeatedly with use of an ink-jet head having a configuration of a plurality of nozzle heads arranged in a sub-scanning direction, the nozzle head including multiple ink discharged discharge nozzles arranged in the sub-scanning direction. | 12-30-2010 |
| 20100150426 | APPARATUS AND METHOD FOR INSPECTING PATTERN - An operation part in a pattern inspection apparatus includes a defect candidate image generator for generating a binary defect candidate image representing a defect candidate area in an inspection image by comparing the inspection image with a reference image, in an inspection image masking part the inspection image is masked with the defect candidate image to obtain a masked inspection image. In a feature value calculation part, an autocorrelation feature value is obtained from the masked inspection image, and outputted to a classifying part. The classifying part comprises a classifier outputting a classification result on the basis of the autocorrelation feature value and a classifier construction part for constructing the classifier by learning. It is thereby possible to easily perform the high accurate classification of defect candidate using the autocorrelation feature value which is hard to characterize as compared with geometric feature value or feature value representing density. | 06-17-2010 |
| 20100126532 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A processing solution supply nozzle is moved relatively from one end to the opposite end of a semiconductor wafer having undergone a developing operation while discharging an anti-static processing solution in a discharge width equal to or greater than the width of the semiconductor wafer. The anti-static processing solution is thereby supplied onto the semiconductor wafer. The prevention of charging of the substrate avoids the occurrence of defects. The processing solution supplied almost uniformly on the entire surface of the substrate also avoids the occurrence of defects. | 05-27-2010 |
| 20090019722 | Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate - In a body of a film-thickness measuring apparatus ( | 01-22-2009 |
| 20090015625 | Printing Apparatus And Cleaning Mechanism Thereof - The present invention relates to a printing apparatus and a cleaning mechanism thereof. | 01-15-2009 |
| 20080220682 | Panel for flat panel display | 09-11-2008 |
