Daiken Chemical Co., Ltd.
|Daiken Chemical Co., Ltd. Patent applications|
|Patent application number||Title||Published|
|20110193034||COPPER-CONTAINING NANOPARTICLES AND MANUFACTURING METHOD THEREFOR - Copper-containing nanoparticles with excellent oxidation resistance is provided. The present invention relates to a method for manufacturing copper-containing nanoparticles including obtaining copper-containing nanoparticles that contain an organic component by heat treating an organic copper compound at a temperature equal to or higher than a decomposition initiation temperature of the compound and lower than a complete decomposition temperature of the compound in a non-oxidative atmosphere in the presence of an organic material containing a 1,2-alkanediol having 5 or more carbon atoms and/or a derivative thereof.||08-11-2011|
|20110193033||COMPOSITE NANOPARTICLES AND MANUFACTURING METHOD THEREOF - Metal nanoparticles having improved migration resistance are provided. The present invention relates to a method for manufacturing composite nanoparticles including obtaining composite nanoparticles containing at least silver and copper in a single particle by heat treating a mixture containing an organic silver compound and an organic copper compound at a temperature of 150° C. or more in a non-oxidative atmosphere in the presence of a tertiary amine compound represented by the general formula R||08-11-2011|
|20090283013||Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components - Diamond fine particles having porous structure known in a high thermal resistance and low dielectric constant film has a high thermal conductivity and is expected as an insulating film for multiplayer wirings of a semiconductor integrated circuit device. A liquid composition of diamond fine particles, which are raw material of the film, is unstable as colloid, resulting in low reproducibility and yield in the production of films. It becomes possible to impart a very low viscosity and improved stability to the colloid liquid composition of diamond fine particles by containing a small amount of amine. If necessary, a thickener may be used to adjust the viscosity appropriately, so that various kinds of application systems can be used. A low dielectric constant film having a relative dielectric constant of about 2.5 can be thus obtained. Further, the liquid composition may be utilized as an abrasive for finishing.||11-19-2009|
Patent applications by Daiken Chemical Co., Ltd.