Cyber Laser Inc.
|Cyber Laser Inc. Patent applications|
|Patent application number||Title||Published|
|20100219542||SUBSTRATE MANUFACTURING METHOD INCLUDING PROTRUSION REMOVING STEP, AND METHOD AND APPARATUS FOR MODIFYING COLOR FILTER PROTRUSION - A method for removing and modifying a protrusion by using a short pulse laser is provided for modifying a color filter. In a color filter modifying method, a transparent substrate (||09-02-2010|
|20100009550||METHOD AND APPARATUS FOR MODIFYING INTEGRATED CIRCUIT BY LASER - [PROBLEMS] To provide a method and an apparatus for cutting a conductive link of a redundant circuit in a semiconductor circuit.||01-14-2010|
Patent applications by Cyber Laser Inc.