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Cosmos Vacuum Technology Corporation
| Cosmos Vacuum Technology Corporation Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080251282 | HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE - A highly thermally conductive circuit substrate includes a metallic substrate, an insulated layer, a first medium layer, and an electrically conductive layer. The insulated layer is formed on a surface of said metallic substrate. The first medium layer is formed on a surface of said insulated layer. The electrically conductive layer is formed on a surface of said first medium layer. | 10-16-2008 |