COOLIT SYSTEMS INC.
|COOLIT SYSTEMS INC. Patent applications|
|Patent application number||Title||Published|
|20130025818||MODULAR HEAT-TRANSFER SYSTEMS - Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.||01-31-2013|
|20120152498||FLUID HEAT EXCHANGE SYSTEMS - A heat exchanger includes: a heat spreader plate; plural microchannels for directing heat transfer fluid over the heat spreader plate, wherein each microchannel has a first end and an opposite end, extends substantially parallel with each other microchannel, and has a continuous flow path between the first and opposite ends; a fluid inlet opening for the microchannels and positioned between the first and opposite ends, a first fluid outlet opening from each of the microchannel first ends; and an opposite fluid outlet opening from each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that a flow fluid that passes into the plurality of microchannels, flows along the plurality of microchannels outwardly from the fluid inlet opening. A method of cooling a heat generating component uses a fluid heat exchanger that splits a mass flow of coolant.||06-21-2012|
|20110149506||ADJUSTABLE MOUNTING BRACKET FOR A COMPUTER COMPONENT - A bracket, computer component and method for connecting to connection points associated with a socket on a computer circuit board are provided. The bracket and computer component have a mounting device including a fastener connectable to one of the connection points and positioned on a mounting flange. The mounting device is adjustable relative to the mounting flange from a first position on the mounting flange to a second position to allow the bracket and computer component to be used in conjunction with a number of different types of sockets.||06-23-2011|
|20100286843||AIR CONDITIONING SYSTEM CONTROL - Systems, devices and methods for generating a virtual mapping of a room are provided. A plurality of racks for housing servers, a plurality of position determining devices and a plurality of temperature sensors can be provided. A computer can be operatively connected to the plurality of position determining devices and the temperature sensors. Each position determining device can be associated with one or more of the temperature sensors. For each of the temperature sensors, position information can be obtained from the position determining device associated with the temperature sensor and the position information used to plot the temperature sensor in a virtual mapping of the room. The virtual mapping can then be used to visually represent a location in the room where a temperature measurement was taken.||11-11-2010|
|20100129140||CONNECTOR FOR A LIQUID COOLING SYSTEM IN A COMPUTER - A connector and a connection system for a liquid cooling system for a computer are provided. The connector has a cylindrical base and a sealing ring encircling the base. A retaining channel is provided on the base to receive a retaining device. One of the components in the liquid cooling system has a liquid port with a cavity having an inner surface, an opening in fluid communication with the cavity and a fluid passage in fluid communication with the cavity. The base of the connector is sized to fit within the liquid port so that when the base is inserted in the liquid port, the sealing ring is forced against an inner surface of the liquid port, forming a seal between the sealing ring and the inner surface of the liquid port.||05-27-2010|
|20090199580||AIR CONDITIONING SYSTEM CONTROL - A cooling system for cooling a room containing a plurality of computer devices is provided. The cooling system has a number of cooling supplies and at least one temperature sensor. Using the at least one temperature sensor and altering the cooling supplied to the room by the cooling supplies, the affect of each cooling supply on the temperature of the room can be approximated and used for the operation of the cooling system.||08-13-2009|
|20090071625||FLUID HEAT EXCHANGER - A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microchannels, flows along the full length of each of the plurality of microchannels in two directions outwardly from the fluid inlet opening. A method of cooling a heat generating component uses a fluid heat exchanger that splits a mass flow of coolant.||03-19-2009|
|20090040721||COMPUTER COOLING SYSTEM AND METHOD - A method for providing a computer component includes providing a motherboard apart from a cooling solution such that the end user can select the motherboard and cooling solution separately, based on preferences and needs for each and connect them together after they are selected. To support this method, a motherboard includes: a support board; a chipset mounted on the support board; and a heat sink base mounted over the chipset, the heat sink base including an open, planar upper surface devoid of any cooling system working components pre-installed thereon but including a fastener aperture about the edge of the open, planar upper surface and in addition to any support board mounting connections, the fastener aperture formed to accept releasable connectors for securing the selected cooling working component.||02-12-2009|
|20080236799||PUMP EXPANSION VESSEL - A pump comprising: a housing defining therein an inner chamber of fixed volume; an inlet through the housing providing communication to the inner chamber; an outlet through the housing providing communication to the inner chamber; a pumping mechanism in the inner chamber; and a resiliently, compressible member accommodating a portion of the fixed volume of the inner chamber.||10-02-2008|
Patent applications by COOLIT SYSTEMS INC.