| Cooligy Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120097370 | FLOW BALANCING SCHEME FOR TWO-PHASE REFRIGERANT COOLED RACK - A cooling system distributes fluid to a plurality of docking bays within a server rack. The server rack includes docking bays for housing electronics devices. A two-phase fluid-based heat exchanging system is coupled to each docking bay, which functions to remove heat from the electronics server. The docking bays are conceptually divided into one or more sections, and a dynamic fluid flow regulator is included within a section input line that supplies a liquid-phase fluid to each section. The section input line branches into a plurality of parallel fluid paths, one parallel fluid path coupled to each docking bay in the section. A fixed fluid flow regulator is included within each branching fluid pathway. The combination of the dynamic and fixed fluid flow regulators provides balanced fluid flow to each two-phase heat exchanging system. | 04-26-2012 |
| 20100035024 | BONDED METAL AND CERAMIC PLATES FOR THERMAL MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES - A ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. The ceramic layer has high thermal conductivity and high electrical resistivity. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer. The top conductive layer and the joining layer are etched to form the electrically isolated conductive pads. The conductive layers are bonded to the ceramic layer using a bare ceramic approach or a metallized ceramic approach. | 02-11-2010 |
| 20100032143 | MICROHEAT EXCHANGER FOR LASER DIODE COOLING - A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer. | 02-11-2010 |
