| COOLEDGE LIGHTING, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120027557 | METHOD AND ELECTROSTATIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING ELECTROSTATIC TRANSFER PRINTING TECHNIQUES - A transfer stamp that can be charged with a spatial pattern of electrostatic charge for picking up selected semiconductor dice from a host substrate and transferring them to a target substrate. The stamp may be bulk charged and then selectively discharged using irradiation through a patterned mask. The technique may also be used to electrostatically transfer selected semiconductor dice from a host substrate to a target substrate. | 02-02-2012 |
| 20110163682 | METHOD AND SYSTEM FOR DRIVING LIGHT EMITTING ELEMENTS - A system topology and circuit design for efficiently and stably driving currents through strings of solid state light emitting elements by providing current sources that are controlled by a stable voltage reference. | 07-07-2011 |
| 20110151602 | METHOD OF MANUFACTURING TRANSFERABLE ELEMENTS INCORPORATING RADIATION ENABLED LIFT OFF FOR ALLOWING TRANSFER FROM HOST SUBSTRATE - Semiconductor material is formed on a host substrate of a material exhibiting optical transparency with an intervening radiation lift off layer. A transfer device, intermediate substrate or target substrate is brought into adhesive contact with the semiconductor material and the radiation lift off layer is irradiated to weaken it, allowing the semiconductor material to be transferred off the host substrate. Electronic devices may be formed in the semiconductor layer while it is attached to the host substrate or the intermediate substrate. | 06-23-2011 |
| 20110151588 | METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES - Releasable semiconductor dice are deposited with a magnetic layer and held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate. | 06-23-2011 |
| 20110151114 | COMPOSITE PATTERNING DEVICE AND METHOD FOR REMOVING ELEMENTS FROM HOST SUBSTRATE BY ESTABLISHING CONFORMAL CONTACT BETWEEN DEVICE AND A CONTACT SURFACE - A composite patterning device includes a stiff first layer having a Young's modulus in a first range, a flexible second layer having a Young's modulus in a second range, a fluidic layer interposed between the first and second layers and having a Young's modulus in a variable range, and a relief pattern in the second layer. The device can be used for establishing conformal contact between the relief pattern in the second layer and a contact surface of a host substrate with attached elements. Then, a magnetic field is applied to the device so as to increase the Young's modulus of the fluidic layer to be similar to that of second layer after which a force is applied to the contact surface so as to release and remove the elements from the host substrate by withdrawing the device. | 06-23-2011 |
| 20110136324 | SEMICONDUCTOR DICE TRANSFER-ENABLING APPARATUS AND METHOD FOR MANUFACTURING TRANSFER-ENABLING APPARATUS - A transfer-enabling apparatus, produced by a method of manufacturing, includes a substrate patterned with islands separated by trenches and an epitaxial layer, grown at least on the islands, providing semiconductor dice in such a configuration partially released from said substrate and suspended over the substrate, and interconnected, by anchors of epitaxial or other material that are attached to the substrate. The anchors are of width less than or equal to than the semiconductor dice and define fracture zones at connections of the anchors with the semiconductor dice. | 06-09-2011 |
