Component Re-Engineering Company, Inc. Patent applications |
Patent application number | Title | Published |
20140197227 | Method For Manufacture Of A Multi-Layer Plate Device - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-17-2014 |
20130250471 | COMPRESSIBLE CONDUCTIVE ELEMENT FOR USE IN CURRENT-CARRYING STRUCTURE - An electrostatic chuck is provided and can include a body having a surface for receiving a wafer. An electrode can be embedded in the body and spaced beneath the surface by a layer. A compressible element having a first end portion electrically coupled to the electrode and a second end portion coupleable to the electrical connector can be provided to inhibit damage to the exposed portion of the electrode and the layer during use. Other embodiments of an electrostatic chuck and embodiments of a conductive element are provided, and an embodiment of a wafer heater is provided. | 09-26-2013 |
20130189022 | Hermetically Joined Plate And Shaft Devices - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-25-2013 |
20130186940 | Hermetically Joined Ceramic Assemblies And Low Temperature Method For Hermetically Joining Ceramic Materials - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-25-2013 |
20130181038 | Method For Hermetically Joining Plate And Shaft Devices Including Ceramic Materials Used In Semiconductor Processing - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-18-2013 |
20130180976 | Multi-Layer Plate Device - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-18-2013 |