COFAN USA, INC.
COFAN USA, INC. Patent applications | ||
Patent application number | Title | Published |
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20140116613 | Method of Forming Thermal Conductive Pillar in Metal Core Printed Circuit Board - A method of forming a thermal conductive pillar in a metal core printed circuit board comprises providing a substrate, depositing a dielectric layer on top surface of the substrate, depositing a conductive layer on top surface of the dielectric layer, forming a space in the metal core printed circuit board by selectively removing at least part of dielectric material from the dielectric layer, and depositing thermal conductive material in the space to form a thermal conductive pillar, wherein the thermal conductive pillar conducts heat generated by a device that is assembled with the metal core printed circuit board. | 05-01-2014 |
20140069695 | Designs and Fabrication Processes of a Heatsink - A heat sink dissipates heat that is generated by an electronic component on a top surface of a print circuit board. A portion of the print circuit board is removed to expose a portion of bottom surface of the electronic component. The heat sink comprises a heat sink body of a first thermally conductive material and an embossing pattern formed on a first surface of the heat sink body. The embossing pattern includes a surface area that is defined by a perimeter circumscribing the embossing pattern. The embossing pattern is made of a second thermally conductive material and is coupled to the electronic component. | 03-13-2014 |