C/O SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent applications |
Patent application number | Title | Published |
20140140373 | APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE - There are provided an apparatus and a method of testing a semiconductor module capable of easily testing a power semiconductor module including a plurality of switching devices. The apparatus for testing a semiconductor module includes: a main substrate disposed within a case; a jig substrate detachably coupled to the main substrate; and a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon. | 05-22-2014 |
20140076611 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate. | 03-20-2014 |
20130170100 | ELECTRODE, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR INCLUDING THE SAME - Disclosed herein are an electrode including a plurality of electrode active material layers formed above an electrode current collector, each of the electrode active material layers including different structures of binders; a method for manufacturing the same; and an electrochemical capacitor.
| 07-04-2013 |
20130162385 | COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern; a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; and a ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside. | 06-27-2013 |
20130162382 | CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same. | 06-27-2013 |
20130147595 | COIL PARTS - Disclosed herein are coil parts including: a lower magnetic substance; a primary coil pattern disposed on the lower magnetic substance; a first complex layer for covering the primary coil pattern; a secondary coil pattern correspondingly disposed on an upper side of the primary coil pattern; a second complex layer for covering the secondary coil pattern; and an insulation layer disposed between the primary coil pattern and the secondary coil pattern and blocking an electrical connection between the primary coil pattern and the secondary coil pattern. The coil parts according to the present invention can have a simple structure and processing capable of increasing magnetic permeability and accordingly improving an impedance characteristic of the coil parts, thereby implementing excellent performance and characteristic. | 06-13-2013 |
20130143030 | PREPREG AND PRINTED CIRCUIT BOARD COMPROMISING THE SAME - Disclosed herein are a prepreg including an insulating resin composition impregnated into a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, the porous support used for impregnation of the insulating resin composition has excellent thermal stability and wide surface area, a coefficient of thermal expansion (CTE) of the porous support is not changed according to directivity, and the prepreg has a structure in which fillers included in the insulating resin composition are dispersed between the porous supports, such that the CTE may be efficiently improved. In addition, although damage is generated from the outside, the damage is not enlarged due to adjacent porous supports but is only locally generated and physical properties for pressure load is excellent due to the porous structure, such that damage of the printed circuit board may be reduced. | 06-06-2013 |