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Chu, Tse Ming
Taipei City, TW
| Chu, Tse Ming Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100244200 | Integrated circuit connecting structure having flexible layout - A wafer has a cutting part filled with a connecting medium. After the wafer is cut into chips along the cutting part, two contacts on two surfaces of the chip can be connected through corresponding leading wires and the connecting medium. Thus, the chip can have a flexible layout. | 09-30-2010 |