CHENMING MOLD IND. CORP.
|CHENMING MOLD IND. CORP. Patent applications|
|Patent application number||Title||Published|
|20130193566||Integrated Circuit Shielding Film and Manufacturing Method Thereof - An integrated circuit shielding film and a manufacturing method thereof. The manufacturing method provides a plate. A stripping glue is coated on the plate. An integrated circuit is disposed on the stripping glue and the stripping glue is deposited on the surface of the integrated circuit. A shielding film is then formed on the integrated circuit by coating operations.||08-01-2013|
|20130171464||Composite Insulating Layer and Manufacturing Method Thereof - A composite insulating layer and a manufacturing method thereof. The composite insulating layer includes a socket substrate, a connection layer disposed on the socket substrate, a conductive metal layer disposed on the connection layer, an insulating metal layer disposed on the conductive metal layer, an insulating ceramic layer disposed on the insulating metal layer, and a electrodeposition layer disposed on the insulating ceramic layer. The composite insulating layer of the present invention can avoid the electromagnetic interference generated from the pins of the CPU and increase the stability of the CPU.||07-04-2013|
|20130134036||Equipment for Making IC Shielding Coating Layer and Metal Shielding Layer of IC - Equipment for making IC shielding coating layer and a metal shielding layer of IC. The equipment comprises a base, a work support, a plurality of medium frequency magnetron targets and a plurality of multi-arc ion targets. The base comprises a chamber. The work support is disposed in the chamber and movably connected with a plurality of rotation axes. Each rotation axes comprises at least one fixture. The fixture is used to put at least one IC. Each medium frequency magnetron target and each multi-arc ion target are disposed in the chamber. The medium frequency magnetron targets and the multi-arc ion targets are used to sputter a metal material over the IC to form at least one metal shielding layer on a surface of the IC.||05-30-2013|
|20130092527||Method for Manufacturing Shielding - A method for manufacturing shielding which uses multiple vacuum sputtering methods to produce shielding on single IC chip. The method comprises the following steps: using covering fixtures to cover a plurality of IC chips and fixing these IC chips on a work support; vacuumizing the chamber to a pretreatment vacuum level; keeping pumping an ionizable gas into the chamber and performing ion bombardment on the material for IC packaging on the surface of these IC chips in order to produce carbon dangling bond connection layer on the material when the vacuum level of the chamber reaches the work vacuum level; performing multiple vacuum sputtering method to sequentially form a first coating layer, a second coating layer and a third coating layer on the carbon dangling bond connection layer; and breaking the vacuum status of the chamber and taking out the coated IC chips.||04-18-2013|
|20120141755||Metal Member and Manufacturing Method Thereof - The present invention discloses a metal member and a manufacturing method thereof. The metal member comprises a metal substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the metal substrate by vacuum depositing, and the intermediate layer is a carbonized metal. Preferably, the intermediate layer could have a composition gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the metal substrate.||06-07-2012|
|20120138585||MANUFACTURING METHOD FOR METAL MARK PLATE - A manufacturing method for a metal mark plates is disclosed. In this manufacturing method, a welding flux layer is firstly disposed onto a metal base plate, and a plurality of metal mark parts are arranged on corresponding regions of the metal base plate on which the welding flux layer is disposed. Thereafter, a laser spot welding step is performed to assemble the metal mark parts with the metal base plate by heating the backside of the metal back plate at a location corresponding to the welding flux layer. This manufacturing method therefore provides a fast and stable welding way for manufacturing the metal mark plate. Besides, this manufacturing method can be applied for automatic production and precise mass production could thereby be accomplished.||06-07-2012|
|20110293947||Coating Method and Structure Thereof - The present invention discloses a coating method and a structure thereof applicable to absorb the heat radiation and heat dissipation. The method comprises the steps of: providing a metal material and an insulating material; melting the metal material and the insulating material; atomizing and spraying the metal material on a substrate at least a predetermined thickness; disposing the insulating material on the metal material.||12-01-2011|
|20110287124||UNIFORM-PRESSURE SHAPING APPARATUS AND SYSTEM - In a uniform-pressure shaping apparatus and system, the system comprises a uniform-pressure shaping apparatus, a vacuum unit and a fluid circulation unit, and the apparatus comprises a first cavity and a second cavity, each including a sealed pressure chamber, a heat conduction film and a template. An object to be imprinted is put on a pattern-imprinting surface of the template. When the first and second cavities get close to each other, the vacuum unit vacuums the space between the pattern-imprinting surfaces of the two templates. Meanwhile, the fluid circulation unit drives a hot fluid to pass through the two sealed pressure chambers. With the iso-pressure characteristic of the hot fluid, the object to be imprinted is heated and pressed uniformly until a desired shape is formed, and then a cold fluid is driven to pass through the two sealed pressure chambers to cool the object to be imprinted.||11-24-2011|
|20110277963||THERMAL MODULE AND METHOD OF MANUFACTURING THE SAME - A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.||11-17-2011|
|20110061848||Heat Dissipation Module and the Manufacturing Method Thereof - The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium.||03-17-2011|
|20100230561||Digital mobile device and stand module thereof - The present invention discloses a digital mobile device and a stand module thereof. The digital mobile device includes a stand module comprising a fixing element and a rotating element. The fixing element is disposed on a side of the digital mobile device and includes an elastic element and a positioning member. The positioning member is disposed on a side of the elastic element. The rotating element is pivotally connected to the fixing element and has a positioning hole. The elastic element and the positioning member are disposed in the positioning hole. If the rotating element is rotated with respect to the fixing element, the elastic element will compress the positioning member to abut the fixing element, such that the fixing element and the rotating element are maintained at a positioning angle.||09-16-2010|
Patent applications by CHENMING MOLD IND. CORP.