| CHENMING MOLD IND. CORP. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110293947 | Coating Method and Structure Thereof - The present invention discloses a coating method and a structure thereof applicable to absorb the heat radiation and heat dissipation. The method comprises the steps of: providing a metal material and an insulating material; melting the metal material and the insulating material; atomizing and spraying the metal material on a substrate at least a predetermined thickness; disposing the insulating material on the metal material. | 12-01-2011 |
| 20110287124 | UNIFORM-PRESSURE SHAPING APPARATUS AND SYSTEM - In a uniform-pressure shaping apparatus and system, the system comprises a uniform-pressure shaping apparatus, a vacuum unit and a fluid circulation unit, and the apparatus comprises a first cavity and a second cavity, each including a sealed pressure chamber, a heat conduction film and a template. An object to be imprinted is put on a pattern-imprinting surface of the template. When the first and second cavities get close to each other, the vacuum unit vacuums the space between the pattern-imprinting surfaces of the two templates. Meanwhile, the fluid circulation unit drives a hot fluid to pass through the two sealed pressure chambers. With the iso-pressure characteristic of the hot fluid, the object to be imprinted is heated and pressed uniformly until a desired shape is formed, and then a cold fluid is driven to pass through the two sealed pressure chambers to cool the object to be imprinted. | 11-24-2011 |
| 20110277963 | THERMAL MODULE AND METHOD OF MANUFACTURING THE SAME - A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost. | 11-17-2011 |
| 20110061848 | Heat Dissipation Module and the Manufacturing Method Thereof - The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium. | 03-17-2011 |
| 20100230561 | Digital mobile device and stand module thereof - The present invention discloses a digital mobile device and a stand module thereof. The digital mobile device includes a stand module comprising a fixing element and a rotating element. The fixing element is disposed on a side of the digital mobile device and includes an elastic element and a positioning member. The positioning member is disposed on a side of the elastic element. The rotating element is pivotally connected to the fixing element and has a positioning hole. The elastic element and the positioning member are disposed in the positioning hole. If the rotating element is rotated with respect to the fixing element, the elastic element will compress the positioning member to abut the fixing element, such that the fixing element and the rotating element are maintained at a positioning angle. | 09-16-2010 |
