CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
|CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20100166535||SYSTEM AND METHOD FOR SEPARATING DEFECTIVE DIES FROM WAFER - A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.||07-01-2010|
|20100063619||SYSTEM AND METHOD FOR INSPECTION OF CHIPS ON TRAY - A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.||03-11-2010|
|20090214326||SYSTEM AND METHOD FOR INSPECTING CHIPS IN A TRAY AND TRAY HANDLING APPARATUS THEREOF - A tray handling apparatus comprises a plurality of guides, a chuck device, a linear movement device, and a rack and pinion device. A space defined by the erected guides is used to hold a tray stack. The chuck of the chuck device is located at the center position of the bottom area of the space. The linear movement device is used to move the chuck relative to the guides. The rack and pinion device is used to cause the guides to move symmetrically. When an operator moves any one of the guides, the other guides move symmetrically and the center of the bottom area of the space surrounded by the guides remains at the same location during the movement of the guides. The operator does not need to adjust the position of the chuck if the positions of the guides are changed.||08-27-2009|
|20090169094||SYSTEM AND METHOD FOR INSPECTING CHIPS IN A TRAY - A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor.||07-02-2009|
Patent applications by CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.