CHANG CHUN PLASTICS CO., LTD.
|CHANG CHUN PLASTICS CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20140088283||PHOSPHORUS-CONTAINING COMPOUNDS AND THEIR PREPARATION PROCESS AND USE - A series of novel phosphorus-containing compounds having the following formula is provided:||03-27-2014|
|20130146811||METHOD OF REUSING MICRO-ENCAPSULATED CHOLESTERIC LIQUID CRYSTAL - A method of reusing micro-encapsulated cholesteric liquid crystals is provided. The method includes providing a display medium material containing a micro-encapsulated cholesteric liquid crystal and a dispersant. The display medium material is mixed with a solvent to form a mixture having a temperature of between 40° C. and 60° C. A centrifugal process is performed to the mixture for separating the micro-encapsulated cholesteric liquid crystal and the dispersant. Then, the dispersant and the solvent are removed to obtain the micro-encapsulated cholesteric liquid crystal.||06-13-2013|
|20120116078||PHOSPHORUS-CONTAINING BISPHENOLS AND PREPARING METHOD THEREOF - The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the formula (1) includes reacting compounds respectively defined by a formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol.||05-10-2012|
|20110172384||PHOSPHORUS-CONTAINING EPOXY RESIN AND METHOD FOR SYNTHESIZING THE SAME - A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.||07-14-2011|
|20100105939||PHOSPHORUS-CONTAINING COMPOUND AND METHOD FOR PREPARING THE SAME - The present invention provides a phosphorus-containing compound of formula (I):||04-29-2010|
|20100016585||PHOSPHORUS-CONTAINING BISPHENOLS AND PREPARING METHOD THEREOF - The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the general formula (1) includes reacting compounds respectively defined by a general formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol.||01-21-2010|
|20100004426||Phosphorus-containing compounds and their prepartion process and use - A series of novel phosphorus-containing compounds having the following formula is provided:||01-07-2010|
|20090258997||Novel phosphorus-containing compounds and their preparing process and use - A series of novel phosphorus-containing compounds having the following formula are disclosed:||10-15-2009|
|20090171120||PHOSPHORUS-BASED OXAZINE COMPOUNDS AND PREPARATION METHOD OF THE SAME - The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.||07-02-2009|
|20080275153||UV curable resin, its preparation and composition containing the same - The present invention relates to an ultraviolet curable resin of the present invention which is prepared from alkyl(meth)acrylates, glycidyl(meth)acrylate, and substituted or unsubstituted acrylic acid, wherein the resin contains terminal vinyl group in amount of at least 50 wt % based on the resin and its glass transition temperature (Tg) is in a range of from 40˜100° C. The present invention also relates to a resin composition containing the ultraviolet curable resin.||11-06-2008|
|20080262127||FLAME RESISTANT RESIN COMPOSITION - A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability. Therefore, the resin composition is particularly useful in composite materials, forming materials or semiconductor packaging materials.||10-23-2008|
|20080255353||METHOD FOR PREPARING MELAMINE SALT OF BIS(PENTAERYTHRITOL PHOSPHATE) PHOSPHORIC ACID - A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided.||10-16-2008|
Patent applications by CHANG CHUN PLASTICS CO., LTD.