| Cascade Microtech, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120112779 | RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME - Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers. | 05-10-2012 |
| 20120098559 | SYSTEMS AND METHODS FOR SIMULTANEOUS OPTICAL TESTING OF A PLURALITY OF DEVICES UNDER TEST - Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs. | 04-26-2012 |
| 20110291680 | CHUCK FOR SUPPORTING AND RETAINING A TEST SUBSTRATE AND A CALIBRATION SUBSTRATE - A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate. The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate. | 12-01-2011 |
| 20110178752 | LINE-REFLECT-REFLECT MATCH CALIBRATION - A method of compensating a calibration for a vector network analyzer includes performing calibrations on at least a pair of ports to determine error terms associated with each port wherein at least one of the error terms is based upon selecting the reactance of the load standard from a set of potential values in a manner such that the reference reactance errors are reduced. | 07-21-2011 |
| 20100271060 | MEMBRANE PROBING METHOD USING IMPROVED CONTACT - A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process. | 10-28-2010 |
| 20100264948 | DIFFERENTIAL SIGNAL PROBING SYSTEM - A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal | 10-21-2010 |
| 20100253377 | ACTIVE WAFER PROBE - A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test. | 10-07-2010 |
| 20100251545 | WAFER PROBE - The present invention relates to a probe for testing of integrated circuits or other microelectronic devices. | 10-07-2010 |
| 20100244874 | TEST STRUCTURE AND PROBE FOR DIFFERENTIAL SIGNALS - A test structure including a differential gain cell and a differential signal probe include compensation for the Miller effect reducing the frequency dependent variability of the input impedance of the test structure. | 09-30-2010 |
| 20100167559 | LOW INSERTION FORCE BGA SOCKET ASSEMBLY - A socket assembly includes a housing with a plurality of through openings that extend between opposite surfaces of the housing. First and second plurality of contact members are positioned in a plurality of the through openings. The contact members each include major beams and minor beams with proximal ends attached to a center portion, and distal ends extending away from the center portion. The major beams preferably have a length greater than the minor beams. When the first circuit member is engaged with the socket assembly the ball grid array displaces the distal ends of the major beams to create a plurality of first and second forces. The first plurality of forces generally oppose the second plurality of forces. The first and second plurality of forces also generate an engagement force that biases the first circuit member toward the housing. The minor beams on the first and second plurality of contact members do not contribute to the engagement force. | 07-01-2010 |
