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CARL ZEISS SMT GMBH

CARL ZEISS SMT GMBH Patent applications
Patent application numberTitlePublished
20120127481METHOD AND APPARATUS FOR DETERMINING A DEVIATION OF AN ACTUAL SHAPE FROM A DESIRED SHAPE OF AN OPTICAL SURFACE - An optical element having an optical surface (05-24-2012
20120127440OPTICAL ASSEMBLY FOR PROJECTION LITHOGRAPHY - An optical assembly for projection lithography has an optical component to guide imaging or illumination light. The optical component has a reflective substrate that contains a fluorescent component. An excitation light source is used to produce fluorescence excitation light. An excitation optical system is used to guide the fluorescence excitation light to the fluorescent component of the substrate. The optical assembly also has a fluorescent light detector and a fluorescence optical system for guiding fluorescent light to the fluorescent light detector. The fluorescent light is produced via fluorescence of the fluorescent component upon irradiation with fluorescence excitation light. The optical assembly can detect a temperature or temperature distribution of the substrate of the optical component with a high degree of precision.05-24-2012
20120120378COMPONENT OF AN EUV OR UV LITHOGRAPHY APPARATUS AND METHOD FOR PRODUCING IT - To improve the bonding of two parts (05-17-2012
20120113429DEVICE AND METHOD FOR THE OPTICAL MEASUREMENT OF AN OPTICAL SYSTEM BY USING AN IMMERSION FLUID - A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.05-10-2012
20120105958LENS MODULE COMPRISING AT LEAST ONE EXCHANGEABLE OPTICAL ELEMENT - Disclosed is a lens module, especially a projection lens for semiconductor lithography, comprising at least one replaceable optical element that is disposed in a lens housing. At least one gas exchange device is positioned in an area of the replaceable optical element in such a way that a receiving zone for the replaceable optical element can be flushed when the optical element is replaced.05-03-2012
20120105865MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS AND RELATED METHOD - A microlithographic projection exposure apparatus includes an optical surface and a measurement device which measures a parameter related to the optical surface at a plurality of separated areas on the optical surface. The measurement device includes an illumination unit which directs individual measuring light beams towards the areas on the optical surface. Each measuring light beam illuminates at least a portion of an area, which is associated with the measuring light beam, and at least a portion of an adjacent area which is not associated with the measuring light beam. A detector unit measures a property for each measuring light beam after it has interacted with the optical surface.05-03-2012
20120104252Particle-Optical Systems and Arrangements and Particle-Optical Components for such Systems and Arrangements - A particle-optical arrangement comprises a charged-particle source for generating a beam of charged particles; a multi-aperture plate arranged in a beam path of the beam of charged particles, wherein the multi-aperture plate has a plurality of apertures formed therein in a predetermined first array pattern, wherein a plurality of charged-particle beamlets is formed from the beam of charged particles downstream of the multi-aperture plate, and wherein a plurality of beam spots is formed in an image plane of the apparatus by the plurality of beamlets, the plurality of beam spots being arranged in a second array pattern; and a particle-optical element for manipulating the beam of charged particles and/or the plurality of beamlets; wherein the first array pattern has a first pattern regularity in a first direction, and the second array pattern has a second pattern regularity in a second direction electron-optically corresponding to the first direction, and wherein the second regularity is higher than the first regularity.05-03-2012
20120099093POLARIZATION ACTUATOR - The present invention relates to an apparatus for influencing a light beam arrangement comprising a plurality of light beams (04-26-2012
20120092669MEASUREMENT METHOD AND MEASUREMENT SYSTEM FOR MEASURING BIREFRINGENCE - A method measuring the birefringence of an object. A measurement beam having a defined input polarization state is generated, the measurement beam being directed onto the object. Polarization properties of the measurement beam after interaction with the object are detected in order to generate polarization measurement values representing an output polarization state of the measurement beam after interaction with the object. The input polarization state of the measurement beam is modulated into at least four different measurement states in accordance with a periodic modulation function of an angle parameter α, and the polarization measurement values associated with the at least four measurement states are processed to form a measurement function dependent on the angle parameter α. A two-wave portion of the measurement function is determined and analysed in order to derive at least one birefringence parameter describing the birefringence, preferably by double Fourier transformation of the measurement function.04-19-2012
20120092637MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to a microlithographic projection exposure apparatus and a microlithographic projection exposure apparatus, as well as related components, methods and articles made by the methods. The microlithographic projection exposure apparatus includes an illumination system and a projection objective. The illumination system can illuminate a mask arranged in an object plane of the projection objective. The mask can have structures which are to be imaged. The method can include illuminating a pupil plane of the illumination system with light. The method can also include modifying, in a plane of the projection objective, the phase, amplitude and/or polarization of the light passing through that plane. The modification can be effected for at least two diffraction orders in mutually different ways. A mask-induced loss in image contrast obtained in the imaging of the structures can be reduced compared to a method without the modification.04-19-2012
20120086925METHOD FOR AVOIDING CONTAMINATION AND EUV-LITHOGRAPHY-SYSTEM - A method for preventing contaminating gaseous substances (04-12-2012
20120082823METHOD FOR BONDING BODIES AND COMPOSITE BODY - A method for bonding a first body (04-05-2012
20120081686MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS ILLUMINATION OPTICS - Optics, such as, for example, microlithographic projection exposure apparatus illumination optics, as well as related systems, methods, components and devices are disclosed.04-05-2012
20120081685MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS ILLUMINATION OPTICS - Optics, such as, for example, microlithographic projection exposure apparatus illumination optics, as well as related systems, methods, components and devices are disclosed.04-05-2012
20120075611DIAPHRAGM CHANGING DEVICE - The invention relates to an optical imaging device, in particular an objective 03-29-2012
20120075608PROJECTION OBJECTIVE AND PROJECTION EXPOSURE APPARATUS WITH NEGATIVE BACK FOCUS OF THE ENTRY PUPIL - The disclosure concerns a projection objective, which can include an object plane in which an object field is formed, an entry pupil, a mirrored entry pupil (RE) in a mirrored entry pupil plane obtained by mirroring the entry pupil (VE) at the object plane, an image plane, an optical axis, at least a first mirror and a second mirror. The projection objective can have a negative back focus of the entry pupil, and a principal ray originating from a central point of the object field and traversing the objective from the object plane to the image plane can intersect the optical axis in at least one point of intersection, wherein the geometric locations of all points of intersection lie between the image plane and the mirrored entry pupil plane.03-29-2012
20120075602OPTICAL ARRANGEMENT IN A PROJECTION OBJECTIVE OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to an optical arrangement in a projection objective of a microlithographic projection exposure apparatus which is designed for operation in EUV. The optical arrangement includes first and second mirrors that are in direct succession to each other along the projection beam direction. The second mirror is rigidly connected to the first mirror.03-29-2012
20120069318PROJECTION EXPOSURE METHOD AND PROJECTION EXPOSURE SYSTEM THEREFOR - The disclosure provides a projection exposure method for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask. The mask has a first pattern area with a first subpattern, and at least one second pattern area, arranged laterally offset from the first pattern area, with a second subpattern. The first subpattern is irradiated during a first illumination time interval with a first angular distribution, adapted to the first subpattern, of the illumination radiation. Thereafter, the second subpattern is irradiated during the second illumination time interval with a second angular distribution, adapted to the second subpattern, of the illumination radiation, said second angular distribution differing from the first angular distribution.03-22-2012
20120069315IMAGING OPTICS AND PROJECTION EXPOSURE INSTALLATION FOR MICROLITHOGRAPHY WITH AN IMAGING OPTICS - Imaging optics includes a first mirror in the imaging beam path after the object field, a last mirror in the imaging beam path before the image field, and a fourth to last mirror in the imaging beam path before the image field. In an unfolded imaging beam path between the object plane and the image plane, an impingement point of the chief ray on a used region of each of the plurality of mirrors has a mirror spacing from the image plane. The mirror spacing of the first mirror is greater than the mirror spacing of the last mirror. The mirror spacing of the fourth to last mirror is greater than the mirror spacing of the first mirror. Chief rays that emanate from points of the object field that are spaced apart from another have a mutually diverging beam course, giving a negative back focus of the entrance pupil.03-22-2012
20120069314IMAGING OPTICS AND PROJECTION EXPOSURE INSTALLATION FOR MICROLITHOGRAPHY WITH AN IMAGING OPTICS OF THIS TYPE - An imaging optics has a plurality of mirrors which image an object field in an object plane in an image field in an image plane. A pupil plane is arranged in the imaging beam path between the object field and the image field. A stop is arranged in the pupil plane. The pupil plane is tilted at an angle (α) with respect to the object plane, where α is greater than 0.1°. The imaging optics results allows for a manageable combination of small imaging errors, manageable production and good throughput.03-22-2012
20120069313EUV MICROLITHOGRAPHY ILLUMINATION OPTICAL SYSTEM AND EUV ATTENUATOR FOR SAME - An illumination optical system for EUV microlithography is used to direct an illumination light beam from a radiation source to an object field. At least one EUV mirror has a reflective face with a nonplanar mirror topography for forming the illumination light beam. The EUV mirror has at least one EUV attenuator arranged in front of it. The attenuator face which faces the reflective face of the EUV mirror has an attenuator topography which is designed to complement the mirror topography such that at least sections of the attenuator face are arranged at a constant interval from the reflective face. The result is an illumination optical system in which it is possible to correct unwanted variations in illumination parameters, for example an illumination intensity distribution or an illumination angle distribution, over the object field with as few unwanted radiation losses as possible.03-22-2012
20120069312IMAGING OPTICAL SYSTEM AND PROJECTION EXPOSURE INSTALLATION FOR MICROLITHOGRAPHY WITH AN IMAGING OPTICAL SYSTEM OF THIS TYPE - An imaging optical system has a plurality of mirrors which image an object field in an object plane in an image field in an image plane. The imaging optical system has a pupil obscuration. The last mirror in the beam path of the imaging light between the object field and the image field has a through-opening for the passage of the imaging light. A penultimate mirror of the imaging optical system in the beam path of the imaging light between the object field and the image field has no through-opening for the passage of the imaging light. The result is an imaging optical system that provides a combination of small imaging errors, manageable production and a good throughput for the imaging light.03-22-2012
20120069310SEMICONDUCTOR MICROLITHOGRAPHY PROJECTION EXPOSURE APPARATUS - The disclosure relates to an optical correction arrangement including at least one optical element and at least one irradiation mechanism for the targeted local irradiation of the optical element with electromagnetic heating radiation for the targeted local heating of the optical element. The optical correction arrangement also includes a mechanism for dissipating the thermal energy introduced into the optical element by the at least one irradiation mechanism. The disclosure furthermore relates to a projection exposure apparatus for semiconductor lithography including an optical correction arrangement according to the disclosure.03-22-2012
20120067833SUPPORT ELEMENTS FOR AN OPTICAL ELEMENT - Support elements for an optical element and a method for supporting an optical element are disclosed. The disclosure can be used in connection with arbitrary optical apparatuses or optical imaging methods. In particular, the disclosure can be used in connection with the microlithography employed in the manufacture of microelectronic circuits.03-22-2012
20120062865OPTICAL IMAGING WITH REDUCED IMMERSION LIQUID EVAPORATION EFFECTS - An optical arrangement for use in an optical imaging process includes an optical element, an immersion zone and a liquid repelling device. During the optical imaging process, the immersion zone is located adjacent to the optical element and is filled with an immersion liquid. The optical element has a first surface region and a second surface region. During the optical imaging process, the first surface region is wetted by the immersion liquid. At least temporarily during the optical imaging process, the liquid repelling device generates an electrical field in the region of the second surface. The electrical field being is adapted to cause a repellent force on parts of the immersion liquid which are responsive to the electrical field and inadvertently contact the second surface region. The repellent force has a direction to drive away the parts of the immersion liquid from the second surface region.03-15-2012
20120044474OPTICAL MODULE FOR GUIDING A RADIATION BEAM - An optical module is used to guide an EUV radiation beam. The optical module has a chamber that can be evacuated and at least one mirror accommodated in the chamber. The mirror has a plurality of individual mirrors, the reflection faces of which complement one another to form an overall mirror reflection face. A support structure is in each case mechanically connected via a thermally conductive portion to a mirror body of the respective individual mirror. At least some of the mirror bodies have an associated actuator for the predetermined displacement of the mirror body relative to the support structure in at least one degree of freedom. The thermally conductive portions are configured to dissipate a thermal power density of at least 1 kW/m02-23-2012
20120044473OPTICAL ELEMENT FOR UV OR EUV LITHOGRAPHY - To reduce deformations which may be caused by a functional coating on a substrate in an optical element for UV or EUV lithography, an optical element is suggested comprising a functional coating (02-23-2012
20120033296PROJECTION OBJECTIVE FOR A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - A projection objective of a microlithographic projection exposure apparatus contains a plurality of optical elements arranged in N>−2 successive sections A02-09-2012
20120026479OPTICAL IMAGING DEVICE AND METHOD FOR REDUCING DYNAMIC FLUCTUATIONS IN PRESSURE DIFFERENCE - There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (02-02-2012
20120026476DEVICE FOR CONTROLLING TEMPERATURE OF AN OPTICAL ELEMENT - A device serves for controlling temperature of an optical element provided in vacuum atmosphere. The device has a cooling apparatus having a radiational cooling part, arranged apart from the optical element, for cooling the optical element by radiation heat transfer. A controller serves for controlling temperature of the radiational cooling part. Further, the device comprises a heating part for heating the optical element. The heating part is connected to the controller for controlling the temperature of the heating part. The resulting device for controlling temperature in particular can be used with an optical element in a EUV microlithography tool leading to a stable performance of its optics.02-02-2012
20120019800LITHOGRAPHY PROJECTION OBJECTIVE, AND A METHOD FOR CORRECTING IMAGE DEFECTS OF THE SAME - A lithography projection objective for imaging a pattern to be arranged in an object plane of the projection objective onto a substrate to be arranged in an image plane of the projection objective comprises a multiplicity of optical elements that are arranged along an optical axis of the projection objective. The optical elements comprise a first group, following the object plane, of optical elements, and a last optical element, which follows the first group and is next to the image plane and which defines an exit surface of the projection objective and is arranged at a working distance from the image plane. The projection objective is tunable or tuned with respect to aberrations for the case that the volume between the last optical element and the image plane is filled by an immersion medium with a refractive index substantially greater than 1. The position of the last optical element is adjustable in the direction of the optical axis. A positioning device is provided that positions at least the last optical element during immersion operation such that aberrations induced by disturbance are at least partially compensated.01-26-2012
20120019799OPTICAL ASSEMBLY - An optical assembly has at least one mirror with a mirror body. The latter is carried by a support body, which has a first support body portion and a second support body portion. An at least thermally separating region is arranged between the two support body portions. At least one surface portion of at least one of the support body portions or of a body thermally coupled thereto is modified in such a way that a thermal emission coefficient ε01-26-2012
20120019798POSITIONING UNIT AND ALIGNMENT DEVICE FOR AN OPTICAL ELEMENT - The disclosure provides a positioning unit for an optical element in a microlithographic projection exposure installation having a first connecting area for connection to the optical element, and having a second connecting area for connection to an object in the vicinity of the optical element.01-26-2012
20120019797REFLECTIVE OPTICAL ELEMENT FOR EUV LITHOGRAPHY - A stress-reduced reflective optical element for a working wavelength in the soft X-ray and extreme ultraviolet wavelength range includes a first multilayer system (01-26-2012
20120019796ILLUMINATION SYSTEM FOR MICROLITHOGRAPHY - An illumination system for microlithography serves to illuminate an illumination field with illumination light of a primary light source. A first raster arrangement has bundle-forming first raster elements which are arranged in a first plane of the illumination system or adjacent to the plane. The first raster arrangement serves to generate a raster arrangement of secondary light sources. A transmission optics serves for superimposed transmission of the illumination light of the secondary light sources into the illumination field. The transmission optics has a second raster arrangement with bundle-forming second raster elements. In each case one of the raster elements of the first raster arrangement is allocated to one of the raster elements of the second raster arrangement for guiding a partial bundle of an entire bundle of illumination light. The first raster arrangement for example has at least two types (I, II, III) of the first raster elements which have different bundle-influencing effects. The raster elements of the two raster arrangements are arranged relative to one another in such a way that to each raster element type (I to III) is allocated at least one individual distance (Δ01-26-2012
20120013985METHOD FOR CORRECTING OPTICAL PROXIMITY EFFECTS - A system provided with a first projection objective including at least one optical proximity correction (OPC) filter having a filter function adapted to a particular pattern. The first projection objective and a second projection objective in the system have, for the particular pattern, to which the filter function of the optical proximity correction (OPC) filter is adapted, at least essentially the same imaging properties. The first projection objective differs from the second projection objective with respect to optical imaging properties for the particular pattern when the optical proximity correction (OPC) filter is not present in the first projection objective. An associated method is also disclosed.01-19-2012
20120013976REFLECTIVE OPTICAL ELEMENT FOR EUV LITHOGRAPHY - A stress-reduced reflective optical element for a working wavelength in the soft X-ray and extreme ultraviolet wavelength range includes a first multilayer system (01-19-2012
20120013878Projection Exposure System, Beam Delivery System and Method of Generating a Beam of Light - A beam delivery system of a projection exposure system comprises a laser generating a beam of laser light from a plurality of longitudinal laser modes in a cavity, wherein light generated by a single longitudinal laser mode has an average line width λ01-19-2012
20120008125IMAGING OPTICS AND PROJECTION EXPOSURE INSTALLATION FOR MICROLITHOGRAPHY WITH AN IMAGING OPTICS - An imaging optics has at least six mirrors, which image an object field in an object plane in an image field in an image plane. An entry pupil of the imaging optics is arranged in the imaging beam path in front of the object field. At least one of the mirrors has a through-opening for the passage of imaging light. A mechanically accessible pupil, in which an obscuration stop is arranged for the central shading of the pupil of the imaging optics, is located in a pupil plane in the imaging beam path between the object field and a first of the through-openings. A first imaging part beam directly after a second mirror in the imaging beam path after the object field and a second imaging part beam directly after a fourth mirror in the imaging beam path after the object field intersect one another in an intersection region. The result is an imaging optics, in which a handleable combination of small imaging errors, manageable production and a good throughput for the imaging light is achieved.01-12-2012
20120008124IMAGING OPTICAL SYSTEM AND PROJECTION EXPOSURE INSTALLATION FOR MICROLITHOGRAPHY WITH AN IMAGING OPTICAL SYSTEM OF THIS TYPE - An imaging optical system has a plurality of mirrors, which via a beam path for imaging light, image an object field in an object plane into an image field in an image plane. The imaging optical system has an exit pupil obscuration. At least one of the mirrors has no opening for passage of the imaging light. The fourth to last mirror in the beam path is concave, resulting in an imaging optical system having improved imaging properties without compromise in throughput.01-12-2012
20120008121ACTUATOR INCLUDING MAGNET FOR A PROJECTION EXPOSURE SYSTEM AND PROJECTION EXPOSURE SYSTEM INCLUDING A MAGNET - The present disclosure relates to an actuator for projection exposure systems that include a magnet. The magnet is encapsulated and/or supported in a magnet holding plate that is produced by microtechnical production methods so that a moving manipulator surface is held in the magnet holding plate via monolithic or bonded connections without additional connecting material so that there is a secure connection.01-12-2012
20120002273CATADIOPTRIC PROJECTION OBJECTIVE WITH PUPIL CORRECTION - The disclosure provides a catadioptric projection objective which includes a plurality of optical elements, including first, second and third refractive objection parts. Optical elements arranged between an object surface and a first pupil surface form a Fourier lens group that includes a negative lens group arranged optically close to the first pupil surface. The Fourier lens group is configured such that a Petzval radius R01-05-2012
20120002185MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - A microlithographic projection exposure apparatus includes an optical surface, which may be formed by a plurality of micro-mirrors, and a measurement device which is configured to measure a parameter related to the optical surface at a plurality of locations. The measurement device includes an illumination unit with a plurality of illumination members, each having a light exit facet. An optical imaging system establishes an imaging relationship between an object plane in which at least two light exit facets are arranged, and an image plane which at least substantially coincides with the optical surface. A detector unit measures the property of measuring light after it has interacted with the optical surface, and an evaluation unit determines the surface related parameter for each of the locations on the basis of the properties determined by the detector unit.01-05-2012
20120002184ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An illumination system of a microlithographic projection exposure apparatus includes a light source configured to produce projection light that propagates along a light path. The illumination system also includes a beam deflection array of reflective or transmissive beam deflection elements. Each beam deflection element is configured to deflect an impinging light beam by a deflection angle that is variable in response to a control signal. The beam deflection array is used in a first mode of operation to determine an irradiance distribution in the system pupil surface. The system further includes an optical raster element, in particular a diffractive optical element, which is used in a second mode of operation to determine the irradiance distribution in the system pupil surface. An exchange unit is configured to hold the optical raster element in the second mode of operation such that it is inserted into the light path.01-05-2012
20110318696ILLUMINATION OPTICAL SYSTEM AND OPTICAL SYSTEMS FOR MICROLITHOGRAPHY - An imaging optical system for microlithography is used to illuminate an object field (12-29-2011
20110317140PROJECTION EXPOSURE APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY INCLUDING AN ACTUATOR SYSTEM - The disclosure relates to a projection exposure apparatus for semiconductor lithography which includes an actuator system to mechanically actuate a component of the projection exposure apparatus. The actuator system has at least one mechanism to reduce and/or dampen the heat input into the component that is due to heat arising during the operation of the actuator system.12-29-2011
20110310524WAFER CHUCK FOR EUV LITHOGRAPHY - A wafer chuck (12-22-2011
20110304926CATADIOPTRIC PROJECTION OBJECTIVE WITH TILTED DEFLECTING MIRRORS, PROJECTION EXPOSURE APPARATUS, PROJECTION EXPOSURE METHOD, AND MIRROR - A projection objective has an object surface and an image surface. The projection objective includes a plurality of optical elements arranged along an optical axis and configured so that during operation the projection objective images a pattern arranged in the object surface onto the image surface. The optical elements include a concave mirror a first deflecting mirror and a second deflecting mirror. The first deflecting mirror is tilted relative to the optical axis by a first tilt angle, t12-15-2011
20110304837PROJECTION EXPOSURE METHOD, PROJECTION EXPOSURE APPARATUS, LASER RADIATION SOURCE AND BANDWIDTH NARROWING MODULE FOR A LASER RADIATION SOURCE - In a projection exposure method for the exposure of a radiation-sensitive substrate arranged in the region of an image surface of a projection objective with at least one image of a pattern of a mask arranged in the region of an object surface of the projection objective, laser radiation having a spectral intensity distribution I(ω) dependent on the angular frequency ω is used. The laser radiation is characterized by an aberration parameter α in accordance with:12-15-2011
20110303529PROCESSES AND DEVICE FOR THE DEPOSITION OF FILMS ON SUBSTRATES - Deposition processes and devices for the fabrication of multilayer systems to better control the energy contribution at different stages of the deposition. This is achieved by depositing films by sputtering in a scheme providing for thermalized particles. Thermalized particles are obtained by choosing the working gas pressure and the distance between target and substrate to result in a mean free path of particles smaller than the distance between target and substrate or to result in a product of pressure and distance being larger than 2.0 cmPa.12-15-2011
20110299285FILTER DEVICE FOR THE COMPENSATION OF AN ASYMMETRIC PUPIL ILLUMINATION - The invention relates to a filter device for an illumination system, especially for the correction of the illumination of the illuminating pupil, including a light source, with the illumination system being passed through by a bundle of illuminating rays from the light source to an object plane, with the bundle of illuminating rays impinging upon the filter device, including at least one filter element which can be introduced into the beam path of the bundle of illuminating rays, with the filter element including an actuating device, so that the filter element can be brought with the help of the actuating device into the bundle of illuminating rays.12-08-2011
20110299053OPTICAL DEVICE HAVING A DEFORMABLE OPTICAL ELEMENT - The disclosure relates to an optical device, in particular for microlithography. The optical device includes an optical module and a support structure that supports the optical module. The optical module includes an optical element and a holding device that holds the optical element. The holding device includes a deformation device having a plurality of active deformation units which contact the optical element and which are designed so as to impose a pre-defined deformation on the optical element. The optical module is fixed to the support structure in a replaceable manner.12-08-2011
20110292367IMAGING OPTICAL SYSTEM - The disclosure generally relates to imaging optical systems that include a plurality of mirrors, which image an object field lying in an object plane in an image field lying in an image plane, where at least one of the mirrors has a through-hole for imaging light to pass through. The disclosure also generally relates to projection exposure installations that include such imaging optical systems, methods of using such projection exposure installations, and components made by such methods.12-01-2011
20110285979PROJECTION OBJECTIVE WITH DIAPHRAGMS - A projection objective for imaging an object arranged in an object plane of the projection objective into an image of the object lying in an image plane of the projection objective has a multiplicity of transparent optical elements and holding devices for holding the optical elements at prescribable positions along an imaging beam path of the projection objective. Each of the optical elements has an optical useful region lying in the imaging beam path and an edge region lying outside the optical useful region. At least one holding element of the holding device assigned to the optical element acts at the edge region in the region of a contact zone. At least one of the optical elements is assigned a diaphragm arrangement with a false light diaphragm arranged directly upstream of the optical element and a second false light diaphragm arranged directly downstream of the optical element. Each of the false light diaphragms is fashioned in such a way that the false light diaphragm screens at least a part of the edge region against radiation running outside the imaging beam path.11-24-2011
20110285978ILLUMINATION SYSTEM FOR A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An illumination system for a microlithographic projection exposure step-and-scan apparatus has a light source, a first optical raster element and a second optical raster element. The first optical raster element extends in a first pupil plane of the illumination system and is designed such that the geometrical optical flux of the system is increased perpendicular to a scan direction of the projection exposure apparatus. The second optical raster element extends in a second pupil plane of the illumination system, which is not necessarily different from the first pupil plane, and is designed such that the geometrical optical flux of the system is increased in the scan direction and perpendicular thereto. This makes it possible to improve the irradiance uniformity in a reticle plane.11-24-2011
20110281043SUPPORT STRUCTURE AND RELATED ASSEMBLIES AND METHODS - A method is provided for producing a support structure including an at least partly reversibly deformable base body with a cut-out. A component can be held in the cut-out by friction. The method includes machining the base body in the braced state, wherein an opening is introduced into the base body and/or widened. The opening is deformed when the deformation force is removed such that the cut-out is formed. The opening is formed such that the application of a joining force makes it possible to deform the cut-out such that a component to be held can be introduced into the deformed cut-out with a clearance fit and an at least partial recovery of the deformed cut-out brings about a pressure contact between the held component and the cut-out in predefined circumferential regions. A method is disclosed for connecting a component to a support structure. A method is disclosed for connecting a component to an assembly including a support structure with a cut-out and a component.11-17-2011
20110279914OPTICAL ELEMENT UNIT - An optical element unit is provided comprising an optical element group for projecting light along an optical axis of the optical element group and a housing having an inner housing part partly defining a first space and a light passageway between the inner housing part and a second space. The inner housing part receives the optical element group. The optical element group comprises an ultimate optical element located in the region of the light passageway. A load-relieving device is provided adjacent to the ultimate optical element, the load relieving device partly defining the first space and the second space and at least partly relieving the ultimate optical element from loads resulting from pressure differences between the first space.11-17-2011
20110279803METHOD FOR CORRECTING A LITHOGRAPHY PROJECTION OBJECTIVE, AND SUCH A PROJECTION OBJECTIVE - A method for correcting at least one image defect of a projection objective of a lithography projection exposure machine, the projection objective comprising an optical arrangement composed of a plurality of lenses and at least one mirror, the at least one mirror having an optically operative surface that can be defective and is thus responsible for the at least one image defect, comprises the steps of: at least approximately determining a ratio VM of principal ray height h11-17-2011
20110279802DEVICE FOR AN OPTICAL ARRANGEMENT AND METHOD FOR POSITIONING AN OPTICAL ELEMENT OF AN OPTICAL ARRANGEMENT - A device for an optical arrangement includes an optical element and a holding structure. The optical element makes contact with the holding structure at six discrete contact points. Coupling elements are provided, by which it is possible to apply a force at the contact points. A component of the force is greater than the weight force of the optical element in terms of absolute value and/or direction.11-17-2011
20110279799EUV Lithography Device and Method For Processing An Optical Element - An EUV lithography device including an illumination device for illuminating a mask at an illumination position in the EUV lithography device and a projection device for imaging a structure provided on the mask onto a light-sensitive substrate. The EUV lithography device has a processing device (11-17-2011
20110273791CATOPTRIC OBJECTIVES AND SYSTEMS USING CATOPTRIC OBJECTIVES - In general, in one aspect, the invention features an objective arranged to image radiation from an object plane to an image plane, including a plurality of elements arranged to direct the radiation from the object plane to the image plane, wherein the objective has an image side numerical aperture of more than 0.55 and a maximum image side field dimension of more than 1 mm, and the objective is a catoptric objective.11-10-2011
20110273694INDIVIDUAL MIRROR FOR CONSTRUCTING A FACETED MIRROR, IN PARTICULAR FOR USE IN A PROJECTION EXPOSURE SYSTEM FOR MICROLITHOGRAPHY - An individual mirror is used to construct a facet mirror. A mirror body of the individual mirror is configured to be tiltable relative to a rigid carrier body about at least one tilting axis of a tilting joint. The tilting joint is configured as a solid-body joint. The solid-body joint, perpendicular to the tilting axis, has a joint thickness S and, along the tilting axis, a joint length L. The following applies: L/S>50. The result is an individual mirror to construct a facet mirror, which can be reproduced and is precisely adjustable and simultaneously ensures adequate heat removal, in particular, heat produced by residually absorbed useful radiation, which is reflected by the individual mirror, by dissipation of the heat by the mirror body.11-10-2011
20110267596GRAVITATION COMPENSATION FOR OPTICAL ELEMENTS IN PROJECTION EXPOSURE APPARATUSES - A gravitation compensator for mounting optical elements in a projection exposure apparatus and a corresponding projection exposure apparatus are disclosed. The gravitation compensator at least partly compensates for the weight force of a mounted optical element and simultaneously enables a change in the position of the optical element without the compensated weight force being altered in an impermissible manner during the change in position. This applies, in particular, to high weight forces which are to be compensated. Furthermore, the gravitation compensator enables use in different atmospheres and the compensation of corresponding aging effects.11-03-2011
20110261343REFLECTIVE OPTICAL ELEMENT, OPTICAL SYSTEM EUV AND LITHOGRAPHY DEVICE - In order to obtain optimal reflectivity on optical elements for the EUV and the soft X-ray range, multilayers constructed of a number of layers are used. Contamination or degradation of the surface leads to imaging defects and transmission losses. In the prior art, it has been attempted to counter a negative change in the surface by providing a cover layer system on the surface of the reflective optical element that should protect the surface. The invention renders the influence of the surface degradation manageable by a targeted selection of the distribution of thickness of the cover layer system, whereby at least one layer of the cover layer system has a gradient that is not equal to zero.10-27-2011
20110261341OPTICAL MODULE WITH AN ADJUSTABLE OPTICAL ELEMENT - An optical module, in particular for microlithography, includes an optical element and a support unit. The optical element has at least one optically utilised area, which defines a rotational axis of symmetry. To support the optical element the support unit has a plurality of more than three support elements. Each of the support elements in the area of a first end is connected with the optical element and in the area of a second end is connected with the support structure. The support unit is designed such that the degree of freedom of rotation of the optical element around the rotational axis of symmetry is restricted, while the position or orientation of the optical element in the other five degrees of freedom is spatially adjustable via the support unit.10-27-2011
20110261338MICROLITHOGRAPHY PROJECTION SYSTEM WITH AN ACCESSIBLE DIAPHRAGM OR APERTURE STOP - The invention relates to a microlithography projection lens for wavelengths <=248 nm <=, preferably <=193 mm, in particular EUV lithography for wavelengths ranging from 1-30 nm for imaging an object field in an object plane onto an image field in an image plane, the microlithography projection lens developed in such a manner that provision is made for an accessible diaphragm plane, into which for instance an iris diaphragm can be introduced.10-27-2011
20110255181REPLACEMENT APPARATUS FOR AN OPTICAL ELEMENT - A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.10-20-2011
20110255067MICROLITHOGRAPHY ILLUMINATION SYSTEMS, COMPONENTS AND METHODS - The disclosure relates to microlithography systems, such as EUV micro-lithography illumination systems, as well as related components, systems and methods.10-20-2011
20110242517PROJECTION EXPOSURE SYSTEM, METHOD FOR MANUFACTURING A MICRO-STRUCTURED STRUCTURAL MEMBER BY THE AID OF SUCH A PROJECTION EXPOSURE SYSTEM AND POLARIZATION-OPTICAL ELEMENT ADAPTED FOR USE IN SUCH A SYSTEM - The invention relates to a projection exposure system, in particular for micro-lithography. The projection exposure system according to the invention comprises a light source for producing light in the EUV region. The projection exposure system further comprises a first optical system for illuminating a mask by the light of the light source and a second optical system for imaging the mask on a component. At least one polarization-optical element is disposed on the beam path between the light source and the component.10-06-2011
20110236809METHOD FOR EXAMINING A WAFER WITH REGARD TO A CONTAMINATION LIMIT AND EUV PROJECTION EXPOSURE SYSTEM - A method for examining at least one wafer (09-29-2011
20110235167CATADIOPTRIC PROJECTION OBJECTIVE - A catadioptric projection objective for imaging a pattern provided in an object plane of the projection objective onto an image plane of the projection objective comprises: a first objective part for imaging the pattern provided in the object plane into a first intermediate image; a second objective part for imaging the first intermediate imaging into a second intermediate image; a third objective part for imaging the second intermediate imaging directly onto the image plane; wherein a first concave mirror having a first continuous mirror surface and at least one second concave mirror having a second continuous mirror surface are arranged upstream of the second intermediate image; pupil surfaces are formed between the object plane and the first intermediate image, between the first and the second intermediate image and between the second intermediate image and the image plane; and all concave mirrors are arranged optically remote from a pupil surface. The system has potential for very high numerical apertures at moderate lens material mass consumption.09-29-2011
20110235013PROJECTION OBJECTIVE OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - A projection objective of a microlithographic projection exposure apparatus has a high index refractive optical element with an index of refraction greater than 1.6. This element has a volume and a material related optical property which varies over the volume. Variations of this optical property cause an aberration of the objective. In one embodiment at least 4 optical surfaces are provided that are arranged in at least one volume which is optically conjugate with the volume of the refractive optical element. Each optical surface comprises at least one correction means, for example a surface deformation or a birefringent layer with locally varying properties, which at least partially corrects the aberration caused by the variation of the optical property.09-29-2011
20110235012PROJECTION EXPOSURE APPARATUS FOR MICROLITHOGRAPHY FOR THE PRODUCTION OF SEMICONDUCTOR COMPONENTS - A projection exposure apparatus for microlithography for the production of semiconductor components includes at least one optical assembly with at least one optical element which can be actuated in a mechanically controlled manner is mounted in a structure. For carrying out the mechanical actuation, a control signal transmission device and/or an energy transmission device are/is provided, which introduce(s) no parasitic mechanical effects into the optical assembly at least during specific operating states of the projection exposure apparatus.09-29-2011
20110235005POSITIONING METHOD FOR AN OPTICAL ARRANGEMENT OF A PROJECTION ILLUMINATION SYSTEM - The present disclosure relates to a method for the production and/or adjustment of an optical arrangement of a projection illumination system, in which at least one actuator is used to set the position of at least one optical element to be manipulated by moving the optical element incrementally with a specific increment size. The increment size of the movement increments is set as a function of the distance of the optical element from the desired position, with the distance being represented by a distance value. If the distance value is above a first threshold value, a substantially constant increment size is set, while the specific increment size decreases as the distance from the desired position decreases if the distance value is below the first threshold value. Alternatively or additionally, a pre-specified deviation from the specific increment size and/or from a pre-specified increment size change rate results in a warning signal and/or ceasing of the movement.09-29-2011
20110229827Method and Lithography Device with a Mask Reflecting Light - A method and lithography device addressing the problem in projection optics of pupil apodization which leads to imaging defects. As here proposed, the illumination system is configured to illuminate the mask inhomogeneously. As a result, inhomogeneities in reflectivity caused by the mask itself are at least partly counteracted. This compensation not only makes the apodization over the pupil become more symmetric but also makes the intensity variation smaller overall.09-22-2011
20110228245REFLECTIVE OPTICAL ELEMENT, PROJECTION SYSTEM, AND PROJECTION EXPOSURE APPARATUS - For the use in illumination systems and projection exposure apparatuses for UV or EUV lithography, a reflective optical element is provided for a operating wavelength in the ultraviolet to extreme ultraviolet wavelength ranges. The reflective optical element includes a substrate and a reflective surface on the substrate. The multilayer system has layers of at least two alternating materials having different real parts of the refractive index at the operating wavelength. Radiation in the operating wavelength of a certain incident angle bandwidth distribution can impinge on the reflective optical element. The reflective surface includes one or more first portions, in which the layers have alternating materials of a first period thickness. The reflective surface includes one or more additional portions, in which the layers of alternating materials have a first period thickness and at least one additional period thickness. The arrangement of the first and additional portions (A09-22-2011
20110228244ILLUMINATION OPTICAL SYSTEM FOR PROJECTION LITHOGRAPHY - An illumination optical system for projection lithography for the illumination of an illumination field has a facet mirror. An optical system, which follows the illumination optical system, has an object field which can be arranged in the illumination field of the illuminate optical system. The facet mirror has a plurality of facets to reflectively guide part bundles of a bundle of illumination light. Reflection faces of the facets are tiltable in each case. In a first illumination tilt position, the tiltable facets guide the part bundle impinging on them along a first object field illumination channel to the illumination field. In a different illumination tilt position, the tiltable facets guide the part bundle impinging on them along a different object field illumination channel to the illumination field. The reflection faces of the tiltable facets are configured so that the part bundle in the at least two illumination tilt positions is reflected with a degree of reflection R coinciding within a tolerance range of +/−10%. The result is an illumination optical system which avoids an undesired influence of the illumination tilt position of the tiltable facets on the illumination light throughput of the illumination optical system.09-22-2011
20110228237REFLECTIVE OPTICAL ELEMENT AND EUV LITHOGRAPHY APPLIANCE - A reflective optical element and an EUV lithography appliance containing one such element are provided, the appliance displaying a low propensity to contamination. The reflective optical element has a protective layer system includes at least two layers. The optical characteristics of the protective layer system are between those of a spacer and an absorber, or correspond to those of a spacer. The selection of a material with the smallest possible imaginary part and a real part which is as close to 1 as possible in terms of the refractive index leads to a plateau-type reflectivity course according to the thickness of the protective layer system between two thicknesses d09-22-2011
20110228234REFLECTIVE OPTICAL ELEMENT AND METHOD FOR PRODUCTION OF SUCH AN OPTICAL ELEMENT - In order to produce stress-reduced reflective optical elements (09-22-2011
20110222144METHOD FOR PRODUCING A MULTILAYER COATING, OPTICAL ELEMENT AND OPTICAL ARRANGEMENT - A method for producing a multilayer coating (09-15-2011
20110222043MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to a microlithographic projection exposure apparatus, such as are used for the production of large-scale integrated electrical circuits and other microstructured components. The disclosure relates in particular to coatings of optical elements in order to increase or reduce the reflectivity.09-15-2011
20110216428HOUSING STRUCTURE - A housing structure has a frame structure 09-08-2011
20110216303METHOD FOR ADJUSTING A PROJECTION OBJECTIVE - A projection objective having a number of adjustable optical elements is optimized with respect to a number of aberrations by specifying a set of parameters describing imaging properties of the objective, each parameter in the set having an, absolute value at each of a plurality of field points in an image plane of the projection objective. At least one of the optical elements is adjusted such that for each of the parameters in the set, the field maximum of its absolute value is minimized.09-08-2011
20110216298PROTECTION MODULE FOR EUV LITHOGRAPHY APPARATUS, AND EUV LITHOGRAPHY APPARATUS - In EUV lithography apparatuses (09-08-2011
20110211180OPTICAL COMPONENT HAVING AN IMPROVED TRANSIENT THERMAL BEHAVIOR AND METHOD FOR IMPROVING THE TRANSIENT THERMAL BEHAVIOR OF AN OPTICAL COMPONENT - An optical component includes an optical element, a mount for the optical element, and a temperature control device configured to control a temperature of a part of the mount based on at least one parameter selected from the group consisting of a coefficient of expansion of a substrate of the optical element, and a coefficient of expansion of a material of the mount.09-01-2011
20110211179DETECTION OF CONTAMINATING SUBSTANCES IN AN EUV LITHOGRAPHY APPARATUS - An EUV (extreme ultraviolet) lithography apparatus (09-01-2011
20110205507DEVICE FOR DAMPING VIBRATIONS IN PROJECTION EXPOSURE APPARATUSES FOR SEMICONDUCTOR LITHOGRAPHY - A changeable assembly for a projection exposure apparatus for semiconductor lithography contains at least one damping element. Projection exposure apparatus for semiconductor lithography and measuring assemblies for a projection exposure apparatus for semiconductor lithography can include at least one sensor for detecting parameters and vibrations of the projection exposure apparatus, wherein the measuring assembly is embodied in such a way that it can be inserted into an exchange opening, provided for an optical element, in the projection exposure apparatus.08-25-2011
20110203320METHOD FOR MANUFACTURING A LENS OF SYNTHETIC QUARTZ GLASS WITH INCREASED H2 CONTENT - A method for manufacturing at least one lens of synthetic quartz glass with increased H08-25-2011
20110199599 SIX-MIRROR EUV PROJECTION SYSTEM WITH LOW INCIDENCE ANGLES - The invention relates to a projection system for guiding light with wavelengths ≦193 nm from an object plane to an image plane, comprising at least a first mirror, a second mirror, a third mirror, a fourth mirror, a fifth mirror and a sixth mirror centered around an optical axis and being arranged along the optical axis, with the light traveling from the object plane to the first mirror, then from the first mirror to the second mirror, then from the second mirror to the third mirror, then from the third mirror, the fourth mirror, then from the fourth mirror to the fifth mirror and then from the fifth mirror to the sixth mirror, The invention is characterized in that the first mirror is arranged along the optical axis geometrically between the fifth mirror and the sixth mirror, and the third mirror is a convex mirror.08-18-2011
20110199597IMAGING DEVICE IN A PROJECTION EXPOSURE FACILITY - An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.08-18-2011
20110194093POLARIZATION-INFLUENCING OPTICAL ARRANGEMENT AND AN OPTICAL SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - A polarization-influencing optical arrangement includes a pair, which includes a first lambda/2 plate and a second lambda/2 plate. The first and second lambda/2 plates partially overlap each other forming an overlap region and at least one non-overlap region.08-11-2011
20110194091LOW-CONTAMINATION OPTICAL ARRANGEMENT - An optical arrangement has a plurality of optical elements capable of transmitting a beam. A partial housing is provided which extends from a surface of an optical element in the direction of the beam emanating from the optical element, or of the beam incident on the optical element, and whose shape is adapted to the shape of the beam. The partial housing is surrounded at least partially by a measurement structure which is mechanically decoupled therefrom. The measurement structure has at least one sensor.08-11-2011
20110194090OPTICAL RASTER ELEMENT, OPTICAL INTEGRATOR AND ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An optical raster element for an illumination system of a microlithographic projection exposure apparatus includes an array of refractive optical elements extending on a planar or curved surface. At least two of the optical elements are arranged side by side along a reference direction with a pitch of less than 2 mm. They have a height perpendicular to the surface of less than 50 μm and a surface profile along the reference direction which includes a central section, two transition sections adjacent the central section and two end sections adjacent the transition sections. The curvatures in the two transition sections are greater than the curvatures in the central section and the end sections. The optical raster element is intended for being used as a first channel plate in an optical integrator (honeycomb condenser) and can reduce the maximum light intensities occurring in or behind the second channel plate.08-11-2011
20110194089OPTICAL SYSTEM WITH APERTURE DEVICE - An optical system has an aperture device having a multiplicity of aperture elements for the delimitation of the cross section of a ray bundle running through the optical system. The aperture device has a first aperture element, which is pivotable about a first rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a first aperture opening delimited by a first aperture edge. The aperture device also has at least one second aperture element, which is pivotable about a second rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a second aperture opening delimited by a second aperture edge. The second aperture opening is smaller than the first aperture opening. The aperture elements pivoted into the engagement position form an effective aperture opening. The aperture edges of aperture elements pivoted into the engagement position do not lie in a common plane.08-11-2011
20110194087REFLECTIVE OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - A reflective optical element e.g. for use in EUV lithography, configured for an operating wavelength in the soft X-ray or extreme ultraviolet wavelength range, includes a multilayer system (08-11-2011
20110188017METHODS AND DEVICES FOR DRIVING MICROMIRRORS - A micromirror of a micromirror array in an illumination system of a microlithographic projection exposure apparatus can be tilted through a respective tilt angle about two tilt axes. The micromirror is assigned three actuators which can respectively be driven by control signals in order to tilt the micromirror about the two tilt axes. Two control variables are specified, each of which is assigned to one tilt axis and which are both assigned to unperturbed tilt angles. For any desired combinations of the two control variables, as a function of the two control variables, one of the three actuators is selected and its control signal is set to a constant value, in particular zero. The control signals are determined so that, when the control signals are applied to the other two actuators, the micromirror adopts the unperturbed tilt angles as a function of the two control variables.08-04-2011
20110188011PARTICLE CLEANING OF OPTICAL ELEMENTS FOR MICROLITHOGRAPHY - An optical assembly is mounted in a projection exposure apparatus (08-04-2011
20110181855PROJECTION EXPOSURE APPARATUS WITH OPTIMIZED ADJUSTMENT POSSIBILITY - A projection apparatus for microlithography for imaging an object field includes an objective, one or a plurality of manipulators for manipulating one or a plurality of optical elements of the objective, a control unit for regulating or controlling the one or the plurality of manipulators, a determining device for determining at least one or a plurality of image aberrations of the objective, a memory comprising upper bounds for one or a plurality of specifications of the objective, including upper bounds for image aberrations and/or movements for the manipulators, wherein when determining an overshooting of one of the upper bounds by one of the image aberrations and/or an overshooting of one of the upper bounds by one of the manipulator movements by regulation or control of at least one manipulator within at most 30000 ms, or 10000 ms, or 5000 ms, or 1000 ms, or 200 ms, or 20 ms, or 5 ms, or 1 ms, an undershooting of the upper bounds can be effected.07-28-2011
20110181852MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - A microlithographic projection exposure apparatus has a mirror array having a base body and a plurality of mirror units. Each mirror unit includes a mirror and a solid-state articulation, which has at least one articulation part that connects the mirror to the base body. A control device makes it possible to modify the alignment of the respective mirror relative to the base body. Mutually opposing surfaces of the mirror and of the base body, or of a mirror support body connected to it, are designed as corresponding glide surfaces of a sliding bearing.07-28-2011
20110181851TEMPERATURE-CONTROL DEVICE FOR AN OPTICAL ASSEMBLY - A temperature-control device is used for controlling the temperature of an optical assembly with at least one optical body, the temperature of which is to be controlled, with at least one optical surface which can be acted upon by a heat flow. The temperature-control device has a heat sink to receive a heat flow, which is emitted by the optical body or a transmission body which is in thermal connection with the optical body. The heat sink is arranged adjacent to a peripheral region of the optical surface. The temperature-control device has a heating mechanism with at least one heating body, which is arranged adjacent to the optical body. The heating body is connected via a physical heat bridge to the heat sink.07-28-2011
20110181850ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An illumination system of a microlithographic projection exposure apparatus includes a primary light source, a system pupil surface and a mirror array. The mirror array is arranged between the primary light source and the system pupil surface. The mirror array includes a plurality of adaptive mirror elements. Each mirror element includes a mirror support and a reflective coating. Each mirror element is configured to direct light produced by the primary light source towards the system pupil surface. The mirror elements can be tiltably mounted with respect to a support structure. The mirror elements include structures having a different coefficient of thermal expansion and being fixedly attached to one another. A temperature control device is configured to variably modify the temperature distribution within the structures to change the shape of the mirror elements.07-28-2011
20110177463ILLUMINATION SYSTEM FOR EUV MICROLITHOGRAPHY - An illumination system for EUV microlithography includes an EUV light source which generates EUV illumination light with an etendue that is higher than 0.01 mm07-21-2011
20110176234HIGH POSITIONING REPRODUCIBLE LOW TORQUE MIRROR - ACTUATOR INTERFACE - The present high positioning reproducible mirror-actuator interface disclosed herein overcomes the deficiencies associated with conventional interface systems and offer a number of advantages that are disclosed herein. Generally, the mirror mounts provide a reliable and robust interface between the mirrors and actuators, that serve to move and position the mirrors, as wells as providing an interface between the mirrors and gravity compensator pins. The mirror mount is characterized as having a body that has an outer peripheral wall that includes a plurality of flexible elements around the perimeter of the body, each having a high stiffness in plane and a high flexibility out of plane. The body is open at the first end to allow flexing of the flexible elements. The flexible elements providing a direct coupling interface between the mirror mount and the mirror. The flexible elements of the mirror mount provides a number of advantages and increases the performance capabilities of the first mechanical interface between the mirror mount and the actuator.07-21-2011
20110165522IMAGING OPTICAL SYSTEM - An imaging optical system includes a plurality of mirrors configured to image an object field in an object plane of the imaging optical system into an image field in an image plane of the imaging optical system. An illumination system includes such an imaging optical system. The transmission losses of the illumination system are relatively low.07-07-2011
20110164235PROJECTION OBJECTIVE AND PROJECTION EXPOSURE APPARATUS FOR MICROLITHOGRAPHY - Projection objectives, projection exposure apparatuses and related systems and components are disclosed.07-07-2011
20110164233FIELD FACET MIRROR FOR AN ILLUMINATION OPTICS OF A PROJECTION EXPOSURE APPARATUS FOR EUV MICROLITHOGRAPHY - A field facet mirror for an illumination optics of a projection exposure apparatus for EUV microlithography transmits a structure of an object arranged in an object field into an image field. The field facet mirror has a plurality of field facets with reflection surfaces. The arrangement of the field facets next to one another spans a base plane. Projections of the reflection surfaces of at least two of the field facets onto the base plane differ with respect to at least one of the following parameters: size, shape, orientation. A field facet mirror results which can ensure a uniform object field illumination with a simultaneously high EUV throughput.07-07-2011
20110164232OPTICAL IMAGING DEVICE WITH IMAGE DEFECT DETERMINATION - An optical imaging device, in particular for microlithography, including an imaging unit adapted to image an object point on an image point and a measurement device. The imaging unit has a first optical element group having at least one first optical element. The imaging device is adapted to participate in the imaging of the object point on the image point, and the measurement unit is adapted to determine at least one image defect occurring on the image point when the object point is imaged. The measuring device includes at least one measurement light source, one second optical element group and at least one detection unit. The measurement light source transmits at least one measurement light bundle. The second optical element group includes at least one optical reference element and one second optical element, the elements adapted to direct the at least one measurement light bundle to the at least one detection unit, to produce at least one detection signal. The second optical element has a defined spatial relationship with the first optical element. The optical reference element has an at least partially reflecting first optical surface and the second optical element has an at least partially reflecting second optical surface. The measurement device is adapted to determine the at least one image defect using the at least one detection signal. The first optical surface and the second optical surface are positioned relative to one another such that a multiple reflection of the at least one measurement light bundle occurs between them.07-07-2011
20110157571PROJECTION EXPOSURE SYSTEM FOR MICROLITHOGRAPHY AND METHOD OF MONITORING A LATERAL IMAGING STABILITY - A projection exposure system (06-30-2011
20110149261OPTICAL SYSTEM, IN PARTICULAR OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An optical system, in particular of a microlithographic projection exposure apparatus, includes an optical system axis and a polarization-influencing optical arrangement, wherein said arrangement has a polarization-influencing optical element which includes an optically active material having an optical crystal axis and is of a thickness profile which varies in the direction of said optical crystal axis, and a position manipulator for manipulation of the position of said polarization-influencing optical element, wherein the polarization manipulator is adapted to cause rotation of the polarization-influencing optical element about an axis of rotation, wherein said axis of rotation is arranged at an angle of 90°±5° relative to the optical system axis.06-23-2011
20110141446PROJECTION OBJECTIVE - A projection objective, such as for EUV lithography, for imaging a pattern arranged in an object plane into an image plane with the aid of electromagnetic radiation from the extreme ultraviolet range is provided. The projection objective includes a plurality of mirrors provided with reflective coatings and arranged between the object plane and the image plane. At least one of the mirrors includes a graded reflective coating with a rotationally-asymmetric coating thickness profile in the mirror plane on a substrate with a rotationally-asymmetric or rotationally-symmetric surface profile. The projection objective can exhibit increased overall transmission.06-16-2011
20110141445ILLUMINATION OPTICAL UNIT FOR EUV MICROLITHOGRAPHY - An illumination optical unit for EUV microlithography includes a first optical element having a plurality of first reflective facet elements and a second optical element having a plurality of second reflective facet elements. Each first reflective facet element from the plurality of the first reflective facet elements has a respective maximum number of different positions which defines a set—associated with the first facet element—consisting of second reflective facet elements in that the set consists of all second facet elements onto which the first facet element directs radiation in its different positions during the operation of the illumination optical unit. The plurality of second reflective facet element forms a plurality of disjoint groups, wherein each of the groups and each of the sets contain at least two second facet elements, and there are no two second facet elements of a set which belong to the same group. This construction makes it possible to provide an illumination optical unit which can be used to provide a large number of different angle-dependent intensity distributions at the location of the object field.06-16-2011
20110128521ACTUATORS AND MICROLITHOGRAPHY PROJECTION EXPOSURE SYSTEMS AND METHODS USING THE SAME - An actuator includes a housing and a rotor that can be moved in relation to the housing in the effective direction of the actuator, wherein the actuator includes an advancing unit that is connected to the rotor at least part of the time. The advancing unit includes at least one deformation unit and at least one deformer for deforming the deformation unit. The at least one deformer is suited to deform the deformation unit perpendicular to the effective direction of the actuator such that the total length of the deformation unit changes in the effective direction as a result of the deformation. The actuator can be used in a projection exposure system for semiconductor lithography.06-02-2011
20110122392MICROLITHOGRAPHY ILLUMINATION SYSTEM AND MICROLITHOGRAPHY ILLUMINATION OPTICAL UNIT - An illumination optical unit for microlithography illuminates an object field with illumination light. The unit includes a first facet mirror that has a plurality of first facets, and a second facet mirror that has a plurality of second facets. The unit has facet pairs which include respectively a facet of the first facet mirror and a facet of the second facet mirror which predefine a plurality of illumination channels for illuminating the object field. At least some of the illumination channels have in each case an assigned polarization element for predefining an individual polarization state of the illumination light guided in the respective illumination channel.05-26-2011
20110122391OPTICAL SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS AND MICROLITHOGRAPHIC EXPOSURE METHOD - The disclosure relates to an optical system of a microlithographic projection exposure apparatus and to a microlithographic exposure method. An optical system of a microlithographic projection exposure apparatus includes an image rotator, which is arranged in the optical system such that light impinging on the image rotator is at least partially polarized. The image rotator rotates, for light impinging on the image rotator, both the intensity distribution and the polarization distribution of through a given angle of rotation.05-26-2011
20110122388ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An illumination system of a microlithographic projection exposure apparatus includes an optical raster element configured to produce a plurality of secondary light sources located in a system pupil surface. The optical raster element has a plurality of light entrance facets, each being associated with one of the secondary light sources. A beam deflecting device includes a beam deflection array of reflective or transparent beam deflecting elements, each being configured to illuminate a spot on one of the light entrance facets at a position that is variable by changing a deflection angle produced by the beam deflecting element. A control unit is configured to control the beam deflection elements such that variable light patterns assembled from the spots can be formed on at least one of the plurality of light entrance facets.05-26-2011
20110122384IMAGING OPTICS - An imaging optics has a plurality of mirrors to image an object field in an object plane into an image field in an image plane. At least one of the mirrors has a through opening for the passage of imaging light. An arrangement of the mirrors is such that principal rays run parallel or divergently in the beam path of the imaging light between the object plane and the first downstream mirror. The imaging optics can have an entrance pupil plane that lies in the beam path of the imaging light in the range of between 5 m and 2000 m in front of the object plane. The imaging optics can have an entrance pupil plane that lies in the beam path of the imaging light in the range of between 100 mm and 5000 mm in front of the object plane. Imaging optics with improved imaging quality are provided.05-26-2011
20110122382METHOD FOR MODIFYING A POLARIZATION DISTRIBUTION IN A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS, AND MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to a method for modifying a polarization distribution in a microlithographic projection exposure apparatus, and to a microlithographic projection exposure apparatus. The projection exposure apparatus has an illumination device and a projection objective. The illumination device has an optical axis and a correction arrangement having a lambda/4 plate arranged rotatably about the optical axis and/or a lambda/2 plate arranged rotatably about the optical axis. The method includes determining a polarization distribution in a predetermined plane of the projection exposure apparatus, and rotating the lambda/4 plate and/or the lambda/2 plate about the optical axis so that a local variation of the polarization distribution is reduced after rotation in comparison with the state before the rotating.05-26-2011
20110109894POLARIZATION-MODULATING OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THEREOF - The disclosure relates to a method of manufacturing a polarization-modulating optical element, wherein the element causes, for light passing through the element and due to stress-induced birefringence, a distribution of retardation between orthogonal states of polarization, the method comprising joining a first component and a second component, wherein a non-plane surface of the first component being provided with a defined height profile is joined with a plane surface of the second component, whereby a mechanical stress causing the stress-induced birefringence is produced in the such formed polarization-modulating optical element.05-12-2011
20110102758ILLUMINATION SYSTEM FOR A MICROLITHOGRAPHY PROJECTION EXPOSURE APPARATUS, MICROLITHOGRAPHY PROJECTION EXPOSURE APPARATUS COMPRISING SUCH AN ILLUMINATION SYSTEM, AND FOURIER OPTICAL SYSTEM - An illumination system for a microlithography projection exposure apparatus for illuminating an illumination field with the light from a primary light source has a variably adjustable pupil shaping unit for receiving light from the primary light source and for generating a variably adjustable two-dimensional intensity distribution in a pupil shaping surface of the illumination system. The pupil shaping unit has a Fourier optical system for converting an entrance beam bundle entering through an entrance plane of the Fourier optical system into an exit beam bundle exiting from an exit plane of the Fourier optical system. The Fourier optical system has a focal length f05-05-2011
20110096317COMPONENT FOR SETTING A SCAN-INTEGRATED ILLUMINATION ENERGY IN AN OBJECT PLANE OF A MICROLITHOGRAPHY PROJECTION EXPOSURE APPARATUS - A component for setting a scan-integrated illumination energy in an object plane of a microlithography projection exposure apparatus is disclosed. The component includes a plurality of diaphragms which are arranged alongside one another with respect to a direction perpendicular to the scan movement and which differ in their form and the position of which can be altered approximately in the scan direction so that a portion of the illumination energy can be vignetted by at least one diaphragm. The form of the individual diaphragm is specifically adapted to the form of the illumination in a diaphragm plane in which the component is arranged. This has the effect that at least parts of the delimiting edges of two diaphragms always differ in the case of an arbitrary displacement of the diaphragms.04-28-2011
20110090559PROJECTION OBJECTIVE FOR A MICROLITHOGRAPHIC EUV PROJECTION EXPOSURE APPARATUS - A projection objective for a microlithographic EUV projection exposure apparatus includes a first mirror and a second mirror. The first mirror includes a mirror substrate and a reflective coating carried by the mirror substrate. The second mirror includes a mirror substrate and a reflective coating carried by the mirror substrate. The first and second mirrors are configured so that, with otherwise equal irradiation by EUV light, the mirror substrate of the first mirror compacts less than the mirror substrate of the second mirror under the effect of the EUV light.04-21-2011
20110085239OPTICAL APPARATUS WITH ADJUSTABLE ACTION OF FORCE ON AN OPTICAL MODULE - The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.04-14-2011
20110085151ILLUMINATION OPTICAL SYSTEM FOR MICROLITHOGRAPHY AND ILLUMINATION SYSTEM AND PROJECTION EXPOSURE SYSTEM WITH AN ILLUMINATION OPTICAL SYSTEM OF THIS TYPE - An illumination optical system for microlithography is used to guide an illumination light bundle from a radiation source to an object field in an object plane. A field facet mirror has a plurality of field facets to predetermine defined illumination conditions in the object field. A following optical system is arranged downstream of the field facet mirror to transfer the illumination light into the object field. The following optical system has a pupil facet mirror with a plurality of pupil facets. Some of the field facets are divided into individual mirrors, which predetermine individual mirror illumination channels. The latter illuminate object field portions, which are smaller than the object field. At least some of the individual mirrors are configured as individual correction mirrors. The latter can be tilted between at least two tilting positions, a central region illumination taking place in a basic tilting position and a surrounding region illumination of the object field taking place in a correction tilting position. An illumination optical system is the result, with which a correction of undesired variations of illumination parameters, in particular an illumination intensity distribution over the object field, is possible without loss of light.04-14-2011
20110083542OPTICAL INTEGRATOR FOR AN ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.04-14-2011
20110080569OPTICAL ELEMENT AND METHOD - The disclosure relates to an optical element configure to at least partial spatially resolve correction of a wavefront aberration of an optical system (e.g., a projection exposure apparatus for microlithography) to which optical radiation can be applied, as well as related systems and methods.04-07-2011
20110069295OPTICAL SYSTEM FOR MICROLITHOGRAPHY - An optical system (03-24-2011
20110063598ILLUMINATION OPTICS FOR EUV MICROLITHOGRAPHY AND RELATED SYSTEM AND APPARATUS - An illumination optics for EUV microlithography guides an illumination light bundle from a radiation source to an object field with an extension ratio between a longer field dimension and a shorter field dimension, where the ratio is considerably greater than 1. A field facet mirror has a plurality of field facets that set defined illumination conditions in the object field. A following optics downstream of the field facet mirror transmits the illumination light into the object field. The following optics includes a pupil facet mirror with a plurality of pupil facets. The field facets are in each case individually allocated to the pupil facets so that portions of the illumination light bundle impinging upon in each case one of the field facets are guided on to the object field via the associated pupil facet. The field facet mirror not only includes a plurality of basic illumination field facets which provide a basic illumination of the object field via associated basic illumination pupil facets, but also includes a plurality of correction illumination field facets which provide for a correction of the illumination of the object field via associated correction illumination pupil facets. The result is an illumination optics which allows unwanted variations of illumination parameters, for instance an illumination intensity distribution or an illumination angle distribution, to be corrected across the object field.03-17-2011

Patent applications by CARL ZEISS SMT GMBH