| 20100096642 | PACKAGING STRUTURE FOR HIGH POWER LIGHT EMITTING DIODE(LED) CHIP - The present invention relates to a packaging structure for high-power light emitting diode (LED) chip, comprising a metal plate, insulators and a cover plate. The metal plate comprises a containing slot and isolating slots formed on the surface by working, and the insulators can be embedded in the isolating slot. After forming a hollow slot and notches on the surface of the cover plate by working, the cover plate is combined with the metal plate and insulators and at the same time, the hollow slot and the notches are corresponding to the containing slot and the isolating slots on the metal plate to form a hollowness state, followed by application of surface treatment to form soldering portions and an anti-soldering layer at the bottom of the metal plate. Then the metal plate is cut on both sides along free ends of the insulators so as to generate electrode contacts with positive and negative electrodes, and the surface mount technology (SMT) can be adopted for assembly of the packaging structure of high-power LED chip so as to simplify manufacturing processes, facilitate mass production and achieve separation of electricity from heat, etc. | 04-22-2010 |
