| Bridgewave Communications, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120066894 | LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS - A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure. | 03-22-2012 |
| 20110081872 | Digital Microwave Radio Link with a Variety of Ports - A microwave radio terminal capable of multiple gigabits/sec bit rate is provided. The radio terminal may use QAM modulation, including the two lowest modulation formats of BPSK and QPSK. The serial bit stream, including forward error correction (FEC) and all other overhead, is prepared in a digital circuit, such as a filed programmable gate array (FPGA) and is output serially, using SERDES devices inside the FPGA, as two separate channels known as “I-channel” and “Q-channel”. | 04-07-2011 |
| 20090159320 | Low Cost High Frequency Device Package and Methods - A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure. | 06-25-2009 |
