| Bridgelux, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120126281 | SYSTEM FOR FLASH-FREE OVERMOLDING OF LED ARRAY SUBSTRATES - System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate. | 05-24-2012 |
| 20120120664 | APPARATUS PROVIDING BEAMFORMING AND ENVIRONMENTAL PROTECTION FOR LED LIGHT SOURCES - Apparatus providing beamforming and environmental protection for LED light sources. A lens apparatus is provided to protect an LED mounted on a substrate. The lens apparatus includes an alignment feature configured to align the LED to a selected position and a focusing region configured to form a selected beam pattern from light emitted from the LED when located at the selected position. The lens apparatus also includes a compression surface configured to compress the substrate to a heat sink to facilitate heat dissipation from the LED and a fastening feature configured to fasten the lens apparatus to the heat sink to provide an environmentally protective seal, so that when the lens apparatus is fastened to the heat sink the alignment feature aligns the LED to the selected position, the compression surface compresses the substrate to the heat sink, and the protective seal protects the LED from environmental conditions. | 05-17-2012 |
| 20120120655 | AC LED ARRAY MODULE FOR STREET LIGHT APPLICATIONS - A street light includes a pole, arm and a head attached to the pole, wherein the head comprises a light source having a plurality of solid state light emitting devices and an optical element configured to produce a light distribution pattern from light emitted from the solid state light emitting devices, wherein the light source is configured to be powered directly from an AC source. | 05-17-2012 |
| 20120113641 | LIGHT MODULES CONNECTABLE USING HEAT PIPES - An illumination apparatus includes one or more solid state light emitting sources and a radiator thermally coupled to the one or more light emitting light sources, wherein the radiator is configured to be connectable to a second apparatus. The second apparatus may be a second solid state light emitting source or a second radiator. | 05-10-2012 |
| 20120112220 | LED-Based Light Source Utilizing Asymmetric Conductors - A light source includes LED dies that are flip-chip mounted on a flexible plastic substrate. The LED dies are attached to the substrate using an asymmetric conductor material with deformable conducting particles sandwiched between surface mount contacts on the LED dies and traces on the substrate. A diffusively reflective material containing light scattering particles is used instead of expensive reflective cups to reflect light upwards that is emitted sideways from the LED dies. The diffusively reflective material is dispensed over the top surface of the substrate and contacts the side surfaces of the dies. The light scattering particles are spheres of titanium dioxide suspended in silicone. The light source is manufactured in a reel-to-reel process in which the asymmetric conductor material and the diffusively reflective material are cured simultaneously. A silicone layer of molded lenses including phosphor particles is also added over the mounted LED dies in the reel-to-reel process. | 05-10-2012 |
| 20120106137 | THERMAL PIPE CAP - A light fixture includes a body, a hollow arm extending out from the body, a pipe cap at a distal end of the arm, and one or more solid state light emitting devices supported by the pipe cap. The pipe cap thermally couples the one or more solid state light emitting devices to the arm. | 05-03-2012 |
| 20120106136 | THERMAL HEAT TRANSFER WIRE - A light fixture includes a body, a hollow arm extending out from the body, a pipe cap at a distal end of the arm, and one or more solid state light emitting devices supported by the pipe cap. The pipe cap thermally couples the one or more solid state light emitting devices to the arm. | 05-03-2012 |
| 20120099321 | AC LED ARRAY MODULE FOR STREET LIGHT APPLICATIONS - A street light includes a pole, arm and a head attached to the pole, wherein the head comprises a light source having a plurality of solid state light emitting devices and an optical element configured to produce a light distribution pattern from light emitted from the solid state light emitting devices, wherein the light source is configured to be powered directly from an AC source. | 04-26-2012 |
| 20120099314 | SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN - A solid state lighting device includes a light source having one or more solid state light emitting cells and a substrate supporting the one or more solid state light emitting cells. The solid state lighting device also includes a fan integrated with the light source. | 04-26-2012 |
| 20120099311 | LED LIGHT USING INTERNAL REFLECTOR - A street light includes a pole and a head attached to the pole. The head includes a light emitting element comprising a plurality of solid state light emitting devices, an optical element, and a reflector configured to reflect light emitted by the solid state light emitting devices to the optical element to produce a light distribution pattern from the head. The light emitted from the solid state emitting devices may be Lambertian patterned light. The Lambertian patterned light may be used to illuminate the reflector. The reflector may be used to transform the Lambertian patterned light to collimated light and direct the collimated light towards the optical element. The optical element may be configured to produce the light distribution pattern from the collimated light. | 04-26-2012 |
| 20120092871 | RETROFITTABLE LED MODULE WITH HEAT SPREADER - A light source includes one or more solid state light emitting devices, a heat spreader thermally coupled to the one or more light emitting devices, and a mounting carriage configured to mount the one or more solid state light emitting devices in a lighting fixture light and thermally couple the heat spreader to the lighting fixture. | 04-19-2012 |
| 20120092865 | DRIVER-FREE LIGHT-EMITTING DEVICE - A light source includes a plurality of solid state light emitters configured to be powered directly from an AC source, and means for providing an electrically insulating and thermally conductive attachment between the solid state light emitters and a heat sink. | 04-19-2012 |
| 20120088321 | Efficient LED Array - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. | 04-12-2012 |
| 20120058580 | Surface-Textured Encapsulations for Use With Light Emitting Diodes - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 03-08-2012 |
| 20120057336 | GRADIENT OPTICS FOR EVEN LIGHT DISTRIBUTION OF LED LIGHT SOURCES - Gradient optics for even light distribution of LED light sources. In an aspect, an apparatus is provided for uniform distribution of light emitted from a light source. The apparatus includes a panel coupled to receive the light emitted from the light source, and gradient optics disposed on the panel, the gradient optics providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. In another aspect, an apparatus includes means for receiving the light emitted from the light source, and means for providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. | 03-08-2012 |
| 20110256647 | METHODS OF MANUFACTURING ELONGATED LENSES FOR USE IN LIGHT EMITTING APPARATUSES - A method of manufacturing an elongated lens for a light emitting apparatus includes forming an elongated lens having an exterior surface, and applying a photoluminescent material to the exterior surface of the lens. | 10-20-2011 |
| 20110254042 | ELONGATED LENSES FOR USE IN LIGHT EMITTING APPARATUSES - A light emitting apparatus includes one or more light emitting semiconductors, and an elongated lens encapsulating the one or more light emitting semiconductors. The elongated lens comprises an exterior surface having a photoluminescent material thereon. | 10-20-2011 |
| 20110249437 | HIGHLY EFFICIENT LED ARRAY MODULE WITH PRE-CALCULATED NON-CIRCULAR ASYMMETRICAL LIGHT DISTRIBUTION - A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array. | 10-13-2011 |
| 20110203522 | METHOD AND SYSTEM FOR DYNAMIC IN-SITU PHOSPHOR MIXING AND JETTING - A system and method for depositing a phosphor composition onto a light emitting device improves manufacturing yield, simplifies conventional processes, and decreases costs. For example, a method of dispensing a phosphor composition onto a light emitting device includes dispensing a portion of the phosphor composition onto the light emitting device utilizing a plurality of colored phosphor dispensers each for dispensing a respective type of phosphor. Power is applied to the light emitting device to emit light, and a characteristic the light emitted by the light emitting device is detected. Phosphor mixing and phosphor dispensing are dynamically controlled. Therefore the color characteristics of phosphor dispensed on LEDs are consistent. The system and method may also reduce the difference between detected characteristic of the light and a desired characteristic of the light. | 08-25-2011 |
| 20110181194 | Reconfigurable LED Array and Use in Lighting System - A light-emitting device capable of being powered by an AC power supply or an unregulated DC power supply is disclosed. The light-emitting device, in an aspect, is coupled to a controller, a light-emitting diode (“LED”) array, and a power supply, wherein the power supply can be an AC power source or an unregulated DC power source. While the power supply provides electrical power, the controller generates various LED control signals in response to power fluctuation of the electrical power. The LED array allows at least a portion of LEDs to be activated in accordance with the logic states of the LED control signals. | 07-28-2011 |
| 20110169431 | Method and Apparatus for Providing Omnidirectional Illumination Using LED Lighting - A light-emitting device capable of generating omnidirectional light utilizing a reflector is disclosed. The light-emitting device, in one aspect, includes a light emitting diode (“LED”) package, a light reflector, and a shell. The LED package, which is mounted on a plate, generates a forward light cone by converting electrical energy to optical energy. The light reflector can be formed with various different shapes that can be placed adjacent to the LED package. A function of the light reflector is to redistribute at least a portion of the forward light cone whereby the overall light illuminated by the light-emitting device complies with LM79 specifications. The shell is used to enclose the LED package and the light reflector and configured to illuminate light in omnidirectional radiation in response to the forward light cone. | 07-14-2011 |
| 20110169417 | Reconfigurable LED Array and Use in Lighting System - A light-emitting device capable of being powered by an AC power supply or an unregulated DC power supply is disclosed. The light-emitting device, in an aspect, is coupled to a controller, a light-emitting diode (“LED”) array, and a power supply, wherein the power supply can be an AC power source or an unregulated DC power source. While the power supply provides electrical power, the controller generates various LED control signals in response to power fluctuation of the electrical power. The LED array allows at least a portion of LEDs to be activated in accordance with the logic states of the LED control signals. | 07-14-2011 |
| 20110140125 | LIGHT EMITTING DIODES WITH SMOOTH SURFACE FOR REFLECTIVE ELECTRODE - A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are disposed on one side of the epitaxial layer structure. The epitaxial layer structure includes a transparent ohmic contact layer having a root-means-square (RMS) roughness less than about 3 nm at a surface whereon the second electrode is formed. The epitaxial layer structure includes a p-type epitaxial layer and a n-type epitaxial layer, wherein the n-type epitaxial layer is coupled between the first electrode and the p-type epitaxial layer, and the p-type epitaxial layer is between the second electrode and the n-type epitaxial layer. The first electrode is located on the n-type epitaxial layer. | 06-16-2011 |
| 20110101395 | LIGHT EMITTING DIODE WITH THIN MULTILAYER PHOSPHOR FILM - A multiple layer film and a method of manufacturing the same, the film having a phosphor bearing layer including phosphor and a carrier, and a rigid protective layer. In some embodiments a mixture including phosphor and an uncurable fluid are dispensed onto a surface, and the mixture is at least partially dried. A curable fluid is dispensed onto the at least partially dried mixture, and the curable fluid is cured. | 05-05-2011 |
| 20110092003 | PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 04-21-2011 |
| 20110090706 | AUTOMATIC ELECTRICAL CONNECTION ASSEMBLY FOR LIGHT MODULES - An illumination apparatus includes a solid state light emitting source and a first radiator thermally coupled to the solid state light emitting source, wherein the radiator is configured to be connectable to a second apparatus. The illumination apparatus further includes a one or more electrical conductors coupled to the radiator, wherein the electrical conductors are adapted to couple electrically to the solid state light emitting source. | 04-21-2011 |
| 20110090690 | UNIVERSAL MOUNTING CARRIER FOR SOLID STATE LIGHT EMITTING DEVICE ARRAYS - A light source includes one or more solid state light emitting devices, and a universal mounting carrier supporting the one or more solid state light emitting devices, wherein the universal mounting carrier is adapted for mounting into any of a plurality of street lights in place of a non-solid state light source, each of the street lights having at least one different physical dimension from the others. | 04-21-2011 |
| 20110089457 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 04-21-2011 |
| 20110089454 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 04-21-2011 |
| 20110089437 | CROSS FLOW CVD REACTOR - A cross flow chemical vapor deposition chamber can comprise an inlet duct having a generally rectangular cross-section and an outlet duct having a generally rectangular cross-section. The rectangular inlet duct and the rectangular outlet duct can facilitate laminar flow of reactant gases over a susceptor. Movable partitions can be configured to define a plurality of zones within the chamber. Each zone can contain a different reactant gas, concentration of reactant gas, and/or flow rate of reactant gas. Enhanced laminar flow can be provided, undesirable depletion of reactant gas can be mitigated, and enhanced control of reactant gases can be facilitated. | 04-21-2011 |
| 20110073896 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. A method for phosphor deposition on a semiconductor wafer that has a plurality of LED dies includes the operations of covering the semiconductor wafer with a selected thickness of photo resist material, removing portions of the photo resist material to expose portions of the semiconductor wafer so that electrical contacts associated with the plurality of LED dies remain unexposed, and depositing phosphor on the exposed portions of the semiconductor wafer. | 03-31-2011 |
| 20110073882 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. In an aspect, a semiconductor wafer is provided that includes a plurality of LED dies wherein at least one die includes an electrical contact, a photo-resist post covering the electrical contact, and a phosphor deposition layer covering the semiconductor wafer and surrounding the photo-resist post. In another aspect, a semiconductor wafer is provided that comprises a plurality of LED dies wherein at least one die comprises an electrical contact, a phosphor deposition layer covering the semiconductor wafer, and a cavity in the phosphor deposition layer exposing the at least one electrical contact. | 03-31-2011 |
| 20110069503 | Shape Forming Heat Sink With Flexible Heat Rod - A conforming heat dissipating structure transfers heat to an irregular surface from a heat source mounted on its bottom surface. The heat dissipating structure includes an open container filled with metal shavings and balls covered by a flexible retainer. The shavings and balls beneath the flexible retainer are pressed against the irregular surface and conform to its irregular shape. In one application, light emitting diodes are mounted to the bottom of the heat dissipating structure, and the shavings are compressed against the inside cover of a street light. A flexible heat rod enables heat to be transferred over a flexible path from a heat source on one heat dissipating structure to a heat sink pressed against another heat dissipating structure. The many strands that make up the flexible heat rod are spread out inside each open container and are pressed between the metallic shavings to achieve a good thermal contact. | 03-24-2011 |
| 20110069474 | Method and Apparatus for Generating White Light from Solid State Light Emitting Devices - An optical device capable of generating warm light using an array of phosphor islands situated over a phosphor layer is disclosed. The device includes a solid state light emitter, a phosphor layer, and phosphor islands. The solid state light emitter, in an aspect, is a light emitting diode (“LED”) capable of converting electrical energy to optical light. The phosphor layer is disposed over the solid state light emitter for generating luminous cool light in response to the optical light. Multiple phosphor islands are disposed on the phosphor layer for converting cool light to warm light, wherein the phosphor islands are evenly distributed over the phosphor layer. | 03-24-2011 |
| 20110068695 | Method and Apparatus for Providing LED Package with Controlled Color Temperature - An optical device capable of illuminating visual light with adjusting color temperature after fabrication is disclosed. The optical device includes a solid state light emitter and a phosphor layer, which is formed over the solid state light emitter. The solid state light emitter, which can be a light emitter diode (“LED”), converts electrical energy to blue light. The phosphor layer subsequently converts first light with a first wavelength to second light with a second wavelength. In one example, the first light is blue light while the second light is white light. A portion of the phosphor layer is adjusted after the phosphor layer is formed for adjusting color of the white light in accordance with color quality of the light detected by a light detector. | 03-24-2011 |
| 20110065218 | PRE-THERMAL GREASED LED ARRAY - An apparatus includes a backing material and a solid state component. The backing material carries a thermally conductive non-solid substance. The solid state component is set into the thermally conductive non-solid substance. The backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink. | 03-17-2011 |
| 20110063837 | LED ARRAY MODULE AND LED ARRAY MODULE FRAME - A solid state light emitter module frame includes a supporting member, legs, and arms. The supporting member is configured to support a reflector. The legs are coupled to the supporting member. The arms are coupled to the supporting member and extend inwardly towards an inner edge of the supporting member. Each of the arms has an attachment mechanism for attaching to an solid state light emitter array. | 03-17-2011 |
| 20110062482 | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces - A light-emitting device having multiple light-emitting diode (“LED”) dice organized in an array capable of configuring LED dice in series, parallel, and/or a combination of series and parallel via metal traces is disclosed. In one aspect, the light-emitting device includes a substrate, a dielectric layer, an LED array, and a metal trace. The dielectric layer, which is disposed over the substrate, provides electric insulation. The LED array capable of generating light is able to enhance flexibility of LED connections using a metal trace. The metal trace has a predefined shape configured to travel through the LED array for facilitating electric connections. | 03-17-2011 |
| 20110045614 | Method and Apparatus for Providing LED Package with Controlled Color Temperature - An optical device capable of illuminating visual light with adjusting color temperature after fabrication is disclosed. The optical device includes a solid state light emitter and a phosphor layer, which is formed over the solid state light emitter. The solid state light emitter, which can be a light emitter diode (“LED”), converts electrical energy to blue light. The phosphor layer subsequently converts first light with a first wavelength to second light with a second wavelength. In one example, the first light is blue light while the second light is white light. A portion of the phosphor layer is adjusted after the phosphor layer is formed for adjusting color of the white light in accordance with color quality of the light detected by a light detector. | 02-24-2011 |
| 20110039471 | PHOSPHOR HOUSING FOR LIGHT EMITTING DIODE LAMP - A light emitting apparatus includes a housing having a transparent bulb with phosphor, and at least one LED positioned within the housing to excite the phosphor and emit light through the transparent bulb. | 02-17-2011 |
| 20110031508 | Method and Apparatus for Manufacturing LED Devices using Laser Scribing - A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (“LED”) devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices. | 02-10-2011 |
| 20110026263 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 02-03-2011 |
| 20110025191 | Method and Apparatus for Generating Phosphor Film with Textured Surface - An optical device deploring a phosphor layer having a textured surface to improve output of visual light is disclosed. A light emitting device includes a solid state light emitter and a phosphor layer. The solid state light emitter, for example, is configured to convert electrical energy to optical light. The phosphor layer includes a first surface and a second surface, wherein the first surface, for example, is the top surface while the second surface is the bottom surface. The phosphor layer is disposed over the solid state light emitter for generating luminous light in response to the optical light. The first surface of the phosphor layer, in one embodiment, is configured to include a texture, which has similarly shaped uniform configurations, capable of reducing total internal reflection. | 02-03-2011 |
| 20110012157 | TRANSPARENT HEAT SPREADER FOR LEDS - A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided. | 01-20-2011 |
| 20110008923 | LIGHT EMITTING DIODES WITH SMOOTH SURFACE FOR REFLECTIVE ELECTRODE - A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are separately disposed on the epitaxial layer structure, and the epitaxial layer structure has a root-means-square (RMS) roughness less than about 3 at a surface whereon the first electrode is formed. | 01-13-2011 |
| 20110007515 | LIGHT-EMITTING DEVICE MOUNTING FIXTURE - A light-emitting device mounting fixture comprising a first means for attaching a light-emitting device to the mounting fixture in a defied position, and a second means for attaching the mounting fixture to a heat sink, wherein a distance between the light-emitting device and the location of the second means is determined in accordance with a testing voltage is disclosed. Additionally the disclosed light-emitting device mounting fixture may comprise means for attaching lead wires to electrically conducting contacts, the electrically conducting contacts providing power to the light emitting device to be inserted into the mounting fixture. Furthermore the disclosed light-emitting device mounting fixture may comprise means for disassemble able attachment of a reflector. | 01-13-2011 |
| 20100328923 | MULTIPLE LAYER PHOSPHOR BEARING FILM - A multiple layer phosphor bearing film having a phosphor bearing layer comprising phosphor. The film may also have an optical layer having a refractive index that is higher than a refractive index for the phosphor bearing layer. The phosphor beraing layer may be adhesive to enable the film to be applied to a light source. | 12-30-2010 |
| 20100327733 | MULTIPLE LAYER PHOSPHOR BEARING FILM - A multiple layer phosphor bearing film having a phosphor bearing layer comprising phosphor, a transparent protective layer, and an adhesive configured to adhere the film to a light source. | 12-30-2010 |
| 20100323466 | LIGHT EMITTING DIODE LAMP WITH PHOSPHOR COATED RELECTOR - A light emitting apparatus includes a lamp reflector having phosphor, wherein the lamp reflector further includes an aperture, and an LED light source arranged with the lamp reflector to excite the phosphor and to emit light through the aperture of the lamp reflector. | 12-23-2010 |
| 20100314651 | THIN-FILM LED WITH P AND N CONTACTS ELECTRICALLY ISOLATED FROM THE SUBSTRATE - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 12-16-2010 |
| 20100314649 | THIN-FILM LED WITH P AND N CONTACTS ELECTRICALL ISOLATED FROM THE SUBSTRATE - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 12-16-2010 |
| 20100314643 | Thin-film LED with P and N contacts electrically isolated from the substrate - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 12-16-2010 |
| 20100301728 | LIGHT SOURCE HAVING A REFRACTIVE ELEMENT - A light emitting apparatus includes a substrate, a plurality of solid state light emitting cells having a planar arrangement on the substrate, and a refractive element arranged with the solid state light emitting cells so that light emitted from the light source has a substantially spherical emission pattern. The refractive element may also be arranged with the solid state light emitting cells to mix the emitted light. | 12-02-2010 |
| 20100301726 | LIGHT SOURCE WITH OPTICS TO PRODUCE A SPHERICAL EMISSION PATTERN - A light emitting apparatus includes a substrate, a plurality of solid state light emitting cells having a planar arrangement on the substrate, and one or more reflectors arranged with the solid state light emitting cells so that light emitted from the light source has a substantially spherical emission pattern. | 12-02-2010 |
| 20100301356 | LIGHT SOURCE HAVING LIGHT EMITTING CELLS ARRANGED TO PRODUCE A SPHERICAL EMISSION PATTERN - A light source includes a mount having first and second opposite surfaces, a first light emitting element having one or more solid state light emitting cells arranged to emit light from the first surface of the mount, and a second light emitting element having one or more solid state light emitting cells arranged to emit light from the second surface of the mount. The first and second light emitting elements are arranged such that the light emitted from the light source produces a substantially spherical emission pattern. | 12-02-2010 |
| 20100297794 | EFFICIENT LED ARRAY - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. | 11-25-2010 |
| 20100279575 | METHOD AND SYSTEM FOR DYNAMIC IN-SITU PHOSPHOR MIXING AND JETTING - A system and method for depositing a phosphor composition onto a light emitting device improves manufacturing yield, simplifies conventional processes, and decreases costs. For example, a method of dispensing a phosphor composition onto a light emitting device includes dispensing a portion of the phosphor composition onto the light emitting device utilizing a plurality of colored phosphor dispensers each for dispensing a respective type of phosphor. Power is applied to the light emitting device to emit light, and a characteristic the light emitted by the light emitting device is detected. Phosphor mixing and phosphor dispensing are dynamically controlled. Therefore the color characteristics of phosphor dispensed on LEDs are consistent. The system and method may also reduce the difference between detected characteristic of the light and a desired characteristic of the light. | 11-04-2010 |
| 20100277048 | SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN - A solid state lighting device includes a light source having one or more solid state light emitting cells and a substrate supporting the one or more solid state light emitting cells. The solid state lighting device also includes a fan integrated with the light source. | 11-04-2010 |
| 20100253248 | PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 10-07-2010 |
| 20100236483 | CHEMICAL VAPOR DEPOSITION REACTOR HAVING MULTIPLE INLETS - A chemical vapor deposition reactor has a wafer carrier which cooperates with a chamber of the reactor to facilitate laminar flow of reaction gas within the chamber and a plurality of injectors configured in flow controllable zones so as to mitigate depletion. | 09-23-2010 |
| 20100213486 | TRANSPARENT HEAT SPREADER FOR LEDS - A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided. | 08-26-2010 |
| 20100142196 | EFFICIENT LED ARRAY - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. | 06-10-2010 |
| 20100141182 | PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 06-10-2010 |
| 20100140630 | Method And Apparatus For Manufacturing LED Devices Using Laser Scribing - A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (“LED”) devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices. | 06-10-2010 |
| 20100136728 | LIGHT-EMITTING DIODE CHIP WITH HIGH LIGHT EXTRACTION AND METHOD FOR MANUFACTURING THE SAME - This invention provides a light-emitting diode chip with high light extraction, which includes a substrate, an epitaxial-layer structure for generating light by electric-optical effect, a transparent reflective layer sandwiched between the substrate and the epitaxial-layer structure, and a pair of electrodes for providing power supply to the epitaxial-layer structure. A bottom surface and top surface of the epitaxial-layer structure are roughened to have a roughness not less than 100 nm root mean square (rms). The light generated by the epitaxial-layer structure is hence effectively extracted out. A transparent reflective layer not more than 5 μm rms is formed as an interface between the substrate and the epitaxial-layer structure. The light toward the substrate is more effectively reflected upward. The light extraction and brightness are thus enhanced. Methods for manufacturing the light-emitting diode chip of the present invention are also provided. | 06-03-2010 |
| 20100136725 | THERMAL MANAGEMENT FOR LED - A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED. | 06-03-2010 |
| 20100133581 | TOP CONTACT LED THERMAL MANAGEMENT - An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs. | 06-03-2010 |
| 20100133575 | LOW OPTICAL LOSS ELECTRODE STRUCTURES FOR LEDS - An electrode structure is disclosed for enhancing the brightness and/or efficiency of an LED. The electrode structure can have a metal electrode and an optically transmissive thick dielectric material formed intermediate the electrode and a light emitting semiconductor material. The electrode and the thick dielectric cooperate to reflect light from the semiconductor material back into the semiconductor so as to enhance the likelihood of the light ultimately being transmitted from the semiconductor material. Such LED can have enhanced utility and can be suitable for uses such as general illumination. | 06-03-2010 |
| 20100133556 | LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate. | 06-03-2010 |
| 20100127289 | Method and Apparatus for Providing LED Package with Controlled Color Temperature - An optical device capable of illuminating visual light with adjusting color temperature after fabrication is disclosed. The optical device includes a solid state light emitter and a phosphor layer, which is formed over the solid state light emitter. The solid state light emitter, which can be a light emitter diode (“LED”), converts electrical energy to blue light. The phosphor layer subsequently converts first light with a first wavelength to second light with a second wavelength. In one example, the first light is blue light while the second light is white light. A portion of the phosphor layer is adjusted after the phosphor layer is formed for adjusting color of the white light in accordance with color quality of the light detected by a light detector. | 05-27-2010 |
| 20100066236 | Method and Apparatus for Generating Phosphor Film with Textured Surface - An optical device deploring a phosphor layer having a textured surface to improve output of visual light is disclosed. A light emitting device includes a solid state light emitter and a phosphor layer. The solid state light emitter, for example, is configured to convert electrical energy to optical light. The phosphor layer includes a first surface and a second surface, wherein the first surface, for example, is the top surface while the second surface is the bottom surface. The phosphor layer is disposed over the solid state light emitter for generating luminous light in response to the optical light. The first surface of the phosphor layer, in one embodiment, is configured to include a texture, which has similarly shaped uniform configurations, capable of reducing total internal reflection. | 03-18-2010 |
| 20100059765 | Light-Emitting Device With Improved Electrode Structures - A light-emitting device includes first and second semiconductor layers and a light-emitting layer between the first and second semiconductor layers. The light-emitting device also includes an improved electrode structures. | 03-11-2010 |
| 20090296369 | Method and Apparatus for Generating White Light From Solid State Light Emitting Devices - An optical device capable of generating warm light using an array of phosphor islands situated over a phosphor layer is disclosed. The device includes a solid state light emitter, a phosphor layer, and phosphor islands. The solid state light emitter, in an aspect, is a light emitting diode (“LED”) capable of converting electrical energy to optical light. The phosphor layer is disposed over the solid state light emitter for generating luminous cool light in response to the optical light. Multiple phosphor islands are disposed on the phosphor layer for converting cool light to warm light, wherein the phosphor islands are evenly distributed over the phosphor layer. | 12-03-2009 |
