| BOUTAGHOU LLC Patent applications |
| Patent application number | Title | Published |
|---|
| 20120064808 | METHOD TO ENHANCE POLISHING PERFORMANCE OF ABRASIVE CHARGED STRUCTURED POLYMER SUBSTRATES - The intersection of discrete polishing islands staggered in a curvilinear shape with a workpiece maintains a substantially uniform film thickness throughout the polishing operation and also leading to a stable polishing operation due to the substantially invariant pressurization. | 03-15-2012 |
| 20110256803 | FLUIDIZED WEB POLISHING APPARATUS AND METHOD USING CONTACT PRESSURE FEEDBACK - An abrasive article with an abrasive element fabricated on a flexible foil suspended by a hydrostatic preloader, a gimball mechanism or a soft pad capable of selectively engaging with substrate to remove material while monitoring the contact pressure. A hydrostatic pressure bed is applied to the non-abrasive surface of the tensioned flexible foil to provide a contact pressure to the abrasive surface against the substrate. A series of fluid bearing surfaces are fabricated or imparted onto the abrasive side of the flexible foil to cause controlled interference and pressure with the substrate. A hydrostatic pressure emanating from the preloader supports the non-abrasive side of the flexible foil under tension while the abrasive side of the flexible foil engages a substrate. Alternatively the flexible foil web is constructed of a series of individual flexible foil bearings connected by non-straight links and housed in flexible holder pads capable of deforming and conforming to the substrate and wafer topography under applied externally applied load and moments. | 10-20-2011 |
| 20110244770 | ABRASIVE SLURRY FORMULATIONS CONTAINING NANO AND MICRO SPHERES ADDITIVES OR SELF-ASSEMBLED MONOLAYERS - This invention relates to methods for plate dressing using slurry charged with abrasives and soft polymeric or metallic micro-nano spheres additives to produce substantially uniform abrasive height. Additionally, methods for plate dressing using slurry charged with abrasives and self-assembled polymers to produce substantially uniform abrasive height are disclosed. | 10-06-2011 |
| 20110230126 | COMPOSITE POLISHING PAD - An abrasive article referred to as composite polishing pad (CPP) includes a plurality of fixed abrasive elements or a plurality of chemical mechanical polishing (CMP) pads attached to a plurality of pressure pads suspended to flexible structures capable to follow the wafer topography. A plurality of stems with dimpled ends act on the pressure pads to generate desired pressure acting on the wafer. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In one embodiment a plurality of pressure pads suspended to a plurality of stems by revolute joints. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In another embodiment, a plurality of pressure pads are attached to a plurality of stems suspended to a series of springs capable of substantial vertical deflection under a desired load. | 09-22-2011 |
