| Bondtech, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120104076 | JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT - A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding. | 05-03-2012 |
| 20100252615 | JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT - A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. | 10-07-2010 |
| 20080245843 | Joining Method and Device Produced by this Method and Joining Unit - A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. | 10-09-2008 |
