BEIJING BOE CHATANI ELECTRONICS CO., LTD.
|BEIJING BOE CHATANI ELECTRONICS CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20140168949||Direct Type Backlight and Display Device - The present invention provides a direct type backlight and a display device provided with the direct type backlight. The direct type backlight includes: a backplate; a printed circuit board fixed on the backplate; a number of LED lamp units fixed on the printed circuit board; side frames fixed on inner side walls of the backplate; reflection sheets covering inner wall of cavity formed by the printed circuit board and the side frames, said reflection sheets have lamp holes matching the LED lamp units; outer frames fixed on upper sides of the backplate and the side frames; said direct type backlight further including: a silica gel light guide plate which this the cavity formed by the printed circuit board and the side frames to cover the reflection sheets and the LED lamp units; and optical film disposed on upper surface of the silica gel light guide plate and located between the upper surface of the silica gel light guide plate and the outer frames. By diffusing the light rays emitted from the LED lamps through the silica gel light guide plate, the mixing distance of the LED lamp is shortened, thus the thickness of the direct type backlight is reduced and the display device becomes much thinner.||06-19-2014|
|20140167063||LED CHIP PACKAGING STRUCTURE, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE - A LED chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without welding a gold wire for the conductive channel as in a traditional LED. Thus, the method is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip.||06-19-2014|
|20140119051||LIGHT MIXING ELEMENT, LIGHT GUIDE PLATE, BACKLIGHT MODULE AND DISPLAY DEVICE - A light mixing element in a shape of a prism, and a cylinder of the prism of the light mixing element includes a first light-emitting inclined surface, a second light-emitting inclined surface, a bottom surface, a incident surface and a reflecting inclined surface; one side of the second light-emitting inclined surface is connected with one side of the first light-emitting inclined surface to form a top angle; the bottom surface is arranged opposite to the top angle; the incident surface is connected between one side of the bottom surface and the other side of the first light-emitting inclined surface; and the reflecting inclined surface is connected between the other side of the bottom surface and the other side of the second light-emitting inclined surface and arranged opposite to the incident surface and the first light-emitting inclined surface.||05-01-2014|
|20140104867||LED LAMP - The present invention provides a LED lamp with high brightness. a uniform light-emitting surface and good heat dissipation. The LED lamp includes a LED strip and a cylindrical light guide body connected to the LED strip, wherein light emitted from the LED strip irradiates towards the light guide body and exits via the surface of the light guide body.||04-17-2014|
|20140063848||BACKLIGHT MODULE AND DISPLAY DEVICE - According to the present disclosure, there are provided a backlight module and a display device. With the backlight module, a heat dissipating device can be saved, and a light guide plate is prevented from being warped and deformed due to heat generation of a light source. The backlight module comprises a light source, a light guide plate and a side-glowing optical fiber. The side-glowing optical fiber includes: a light emitting section which is fixed to at least one side of the light guide plate; and a light guide section, which extends from the light emitting section to the outside of the light guide plate, and a terminal of which is connected to the light source.||03-06-2014|
|20140029242||Backlight Unit And Display Device - Embodiments of the invention provide a backlight unit and a display device. The backlight unit comprises at least one light emitting component and at least one reflection support component, wherein the light emitting component comprises a plurality of element surfaces disposed obliquely and a plurality of luminophore disposed on the element surfaces, the reflection support component comprises a plurality of reflective surfaces disposed obliquely.||01-30-2014|
|20120242935||DIRECT ILLUMINATION TYPE BACKLIGHT MODULE, BOTTOM REFLECTOR AND LIQUID CRYSTAL DISPLAY - Embodiments of the disclosed technology provide to a direct illumination type backlight module comprising: a bottom reflecting plate with a upper reflecting surface; a plurality of diffuse reflectors provided on the upper reflecting surface of the bottom reflecting plate, each of the diffuse reflectors having at least one diffusion reflecting surface; a light source array provided on the upper reflecting surface of the bottom reflecting plate and comprising a plurality of light emitting devices, a light emitting surface of each of the light emitting devices facing the diffusion reflecting surface of at least one of the diffuse reflectors so that light from the light emitting devices is scattered upwards by the diffuse reflectors; and a diffuser provided above the light source array. In addition, a bottom reflector and a liquid crystal display are also provided.||09-27-2012|
Patent applications by BEIJING BOE CHATANI ELECTRONICS CO., LTD.