| Beijing AVC Technology Research Center Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110100607 | HEAT DISSIPATING CAVITY OF LOOPED HEAT PIPE - A heat dissipating cavity of looped heat pipe structure includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and looped heat pipes. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the looped heat pipes, wherefrom to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of looped heat pipes increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation. | 05-05-2011 |
| 20110100606 | HEAT DISSIPATING CAVITY - A heat dissipating cavity includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and temperature equalizing elements including heat pipes and heat expansion plates, which can be used individually or collectively. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the temperature equalizing elements, wherefrom effectively and evenly conducted to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of temperature equalizing elements increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation. | 05-05-2011 |
| 20100296249 | MICRO PASSAGE COLD PLATE DEVICE FOR A LIQUID COOLING RADIATOR - A micro passage cold plate device for a liquid cooling radiator includes a upper cover and a lower plate. The upper cover has a working medium inlet at a side thereof and a working medium outlet at another side thereof. The inlet and outlet are trumpet-shaped such that the working medium expansively enters the cold plate gradually and leaves the cold plate with a reduced way gradually. Hence, the cold plate provides an even distribution of temperature, a lower thermal resistance and a better heat dissipation performance such that the stability of the two-state flow of the working medium is enhanced for heat dissipation device in the field of electronic field. | 11-25-2010 |
| 20100188818 | HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a flat evaporator, a vapor pipe, a liquid pipe, and a condenser. The flat evaporator consists of a bottom plate, a porous material, and a top lid. The porous material is located on the bottom plate and provided with vapor flow passages. The vapor pipe and liquid pipe are communicably connected at respective one end to a vapor port and a liquid port on the evaporator, and at the other end to two sides of the condenser. The evaporator has simple structure and low manufacturing cost, and can fully effectively bear on an electronic chip to enable reduced room needed for installing the evaporator and reduced thermal resistance during heat dissipation. The heat dissipating device can be used to dissipate heat produced by computer chips, and to cool LED illuminating devices, chips for communication devices, high-power heat-producing elements in military, medical, aerial, and aerospace apparatuses. | 07-29-2010 |
| 20100000720 | LIQUID COOLING HEAT DISSIPATING DEVICE WITH HEAT TUBES GATHERING HEAT SOURCES - A liquid cooling heat dissipating device with heat tubes gathering heat sources includes a cold plate being disposed on the heat sources and a or a plurality of heat tubes disposed between the heat sources and the cold plate to contact with the heat sources completely, and an end of the respective heat tube is fixedly attached to the cold plate, respectively. The respective heat tube is sealed with a capillary material and a vapor-liquid working median contained inside. The respective heat tube contacts with the heat sources at different spots to gather the heat for being cooled with the cold plate simply. | 01-07-2010 |
