| AZUREWAVE TECHNOLOGIES, INC. Patent applications |
| Patent application number | Title | Published |
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| 20110304379 | SIGNAL MATCHING MODULE WITH COMBINATION OF ELECTRONIC COMPONENTS FOR SIGNAL MATCHING OF SINGLE OR MULTIPLE SUBSYSTEMS - A signal matching module for a single or multiple subsystems is disclosed. The signal matching module includes a plurality of electronic components with a first part of the electronic components categorized into external electronic components and a second part of the electronic components categorized into internal components. Each of the electronic components may correspond to a switch that is controllable by a corresponding control pin. And the external electronic components may be used to compensate the internal electronic components when the latter fail to cause the impedance to reach the desired level. One of the embodiments is to provide a unit cell which is used to connect with one or multiple subsystems, and an external communication port to which the external electronic components are connected serving as a feeding point for the purpose of better impedance matching. | 12-15-2011 |
| 20110253885 | IMAGE-CAPTURING MODULE FOR SIMPLIFYING OPTICAL COMPONENT AND REDUCING ASSEMBLY TIME - An image-capturing module for simplifying optical component and reducing assembly time includes a substrate unit, an image-capturing unit, a cover unit, a light-emitting unit and an optical imaging unit. The image-capturing unit has at least one image-capturing element electrically disposed on the substrate unit. The cover unit has at least one cover element disposed on the substrate unit and covering the image-capturing element, and the cover element has an opening for exposing the image-capturing element. The light-emitting unit has at least one light-emitting element electrically disposed on the substrate unit. The optical imaging unit has a light-guiding element disposed on the cover element for receiving light beams generated by the light-emitting element and an imaging element connected with the light-guiding element and disposed in the opening of the covering element. The light-guiding element and the imaging element are integrated with each other to form one piece. | 10-20-2011 |
| 20110215695 | LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY - An LED package structure for increasing light-emitting efficiency includes a heat-dissipating unit, an insulating unit, a light-emitting unit and a conductive unit. The heat-dissipating unit has a heat-dissipating substrate. The insulating unit has an insulating layer formed on the heat-dissipating substrate and at least one receiving groove passing through the insulating layer and formed above the heat-dissipating substrate. The insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the insulating layer is an annular inclined surface in the receiving groove. The light-emitting unit has at least one light-emitting element received in the receiving groove and disposed on the heat-dissipating substrate. The conductive unit has at least two conductive structures disposed on the insulating layer and separated from each other, and the light-emitting element has two electrodes respectively electrically connected to the two conductive structures via two conductive wires. | 09-08-2011 |
| 20100220450 | PACKAGING STRUCTURE OF SIP AND A MANUFACTURING METHOD THEREOF - A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. | 09-02-2010 |
| 20090079447 | TESTING SYSTEM FOR A RADIO FREQUENCY MODULE - A testing system for a RF module includes a metal casing formed a testing space therein, a RF testing socket disposed inside the testing module, and a pressing manipulator penetrating through the metal casing. A shielding material layer is disposed on the internal surface of the metal casing so that the RF signal is isolated inside the metal casing. An end of the pressing manipulator extends into the testing space. The pressing manipulator is controlled automatically and provides for a pressure on a RF module disposed on the testing module so as to execute a testing process. As mentioned above, the testing set for a RF module can prevent from RF testing interference and the testing manufacture efficiency is improved. | 03-26-2009 |
| 20090077226 | METHOD AND SYSTEM OF AUTO-MONITORING NETWORK PORTS - A method of auto-monitoring network ports includes the steps of: receiving at least one path of an application program; detecting whether or not the application program represented by the received path needs at least one network port; notifying a router to open the relative network port required by the application program if the detecting result indicates that the application program needs the network port; and notifying the router to close the relative network port required by the application program if the detecting result indicates that the application program no longer needs the network port. Hence, the present invention can achieve the purpose of exempting users from a mandatory setup of network ports for the router according to different application programs. | 03-19-2009 |
| 20090051461 | OUTPUT POWER DETECTING SYSTEM WITH A DIRECTIONAL COUPLER - A output power detecting system with a directional coupler has a directional coupler at the output terminal of the output power detecting system. The directional coupler includes a main line, a first sub line, and a second sub line. The output of the power amplifying unit is fully coupled to a power detecting unit via the coupling between the main line and the first sub line, and the external noise is coupled to the ground via the coupling between the first sub line and the second sub line. Therefore, the power detecting unit accurately detects the output power of the output power detecting system. | 02-26-2009 |
| 20090039479 | MODULE FOR INTEGRATING PERIPHERAL CIRCUIT AND A MANUFACTURING METHOD THEREOF - A module for integrating peripheral circuit includes a silicon chip substrate, at least one peripheral circuit unit, and at least one main circuit unit. The peripheral circuit unit is integrated in the silicon chip substrate via a semiconductor manufacturing process. The main circuit unit is mounted on the surface of the silicon chip substrate and is electrically connected with the peripheral circuit unit for transmitting the signal. Thereby, the dimension of the module is reduced. | 02-12-2009 |
| 20090021329 | CHIP-LEVEL THROUGH HOLE STRUCTURE OF ELECTRONIC PACKAGE - A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference. | 01-22-2009 |
| 20090010230 | AUTOMATIC WIRELESS NETWORK LINKING METHOD WITH SECURITY CONFIGURATION AND DEVICE THEREOF - An automatic wireless network linking method with a security configuration includes: providing an access point with a floating service set identifier and a shared key. The floating service set identifier has a prefix name. Next, a host system is provided to execute a setting and linking application to automatically scan the access point with the prefix name and obtain the floating service set identifier of the access point. Both the access point and the setting and linking application perform an operation process to generate a dynamic key. The dynamic key is converted into a wireless network encryption algorithm. Finally, the host system links to the access point to perform wireless communication, and uses the wireless network encryption algorithm to encrypt and decrypt data. Thereby, the time required for setting up the wireless network platform is reduced. | 01-08-2009 |
| 20090009584 | WIRELESS IMAGE SIGNAL TRANSMISSION DEVICE - A wireless image signal transmission device includes a wireless receiving and sending unit, an image-obtaining unit, and a control unit. The image-obtaining unit is used for obtaining an image signal. The control unit is electrically connected between the wireless receiving and sending unit and the image-obtaining unit. The control unit includes an image-processing unit, a plurality of first expanding interface units, and a core unit. The core unit is electrically connected with the image-processing unit and the first expanding interface unit so that the image-processing unit processes the image data received by the first expanding interface unit and converts the processed image data into a wireless network signal. Next, the wireless receiving and sending unit transmits the wireless network signal to the application system. Thereby, it is easy to integrate the system and can be applied to a variety of application fields. | 01-08-2009 |
