| Avago Technologies Fiber IP Pte. Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120155054 | ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBING ASSEMBLY AND METHOD FOR USE IN AN OPTICAL TRANSCEIVER MODULE - An optical transceiver module is provided that has an EMI absorbing assembly that comprises an EMI absorbing device that is electrically grounded rather than standing in free space in the transceiver module so that the assembly absorbs both the magnetic and electrical components of the EMI. In accordance with an embodiment, the EMI absorbing assembly includes a leadframe about which an EMI absorbing material is cast. The leadframe preferably is shaped in a way that prevents or lessens the occurrence of resonant EMI modes in the transceiver module housing. | 06-21-2012 |
| 20100112741 | INTEGRATED PHOTONIC SEMICONDUCTOR DEVICES AND METHODS FOR MAKING INTEGRATED PHOTONIC SEMICONDUCTOR DEVICES - A photonic semiconductor device and method are provided that ensure that the surface of the device upon completion of the SAG process is planar, or at least substantially planar, such that performance of the subsequent processes is facilitated, thereby enabling higher manufacturing yield to be achieved. A photonic semiconductor device and method are also provided that ensure that the isolation region of the device will have high resistance and low capacitance, without requiring the placement of a thick dielectric material beneath each of the contact pads. Eliminating the need to place thick dielectric materials underneath the contact pads eliminates the risk that the contact pads will peel away from the assembly. | 05-06-2010 |
| 20090269075 | ELECTRO-OPTICAL ASSEMBLY AND METHOD FOR MAKING AN ELECTRO-OPTICAL ASSEMBLY - An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures. | 10-29-2009 |
| 20090257745 | METHOD AND APPARATUS FOR TESTING TRANSMITTERS IN OPTICAL FIBER NETWORKS - An eye mask is provided that is defined at least partially in terms of absolute, or non-relative, optical power level values. In essence, the eye mask of the invention is a hybrid of the traditional eye mask in that the eye mask of the invention includes power level values on the optical power axis that are based on the minimum OMA set forth in the applicable standard or data sheet specification rather than on measured power level values obtained from the part being tested. Using the hybrid eye mask of the invention obviates the need to perform at least some of the tests often used to measure transmitter attributes. In addition, using the hybrid eye mask of the invention reduces the possibility that a transmitter may fail the eye mask test even though the transmitter operates satisfactorily. | 10-15-2009 |
| 20090213884 | INTEGRATED PHOTONIC SEMICONDUCTOR DEVICES AND METHODS FOR MAKING INTEGRATED PHOTONIC SEMICONDUCTOR DEVICES - A photonic semiconductor device and method are provided that ensure that the surface of the device upon completion of the SAG process is planar, or at least substantially planar, such that performance of the subsequent processes is facilitated, thereby enabling higher manufacturing yield to be achieved. A photonic semiconductor device and method are also provided that ensure that the isolation region of the device will have high resistance and low capacitance, without requiring the placement of a thick dielectric material beneath each of the contact pads. Eliminating the need to place thick dielectric materials underneath the contact pads eliminates the risk that the contact pads will peel away from the assembly. | 08-27-2009 |
| 20090202201 | MODE SELECTIVE FIBER STUB, A TRANSMITTER OPTICAL SUBASSEMBLY THAT INCORPORATES THE STUB AND METHODS FOR MAKING THE MODE SELECTIVE FIBER STUB - A fiber stub assembly is provided that has a cladding layer that is reduced in diameter near the end of the stub into which light is launched from a light source. The portion of the stub having the cladding layer with the reduced diameter is surrounded by a light-absorbing material that is in contact with the inner surface of the ferule and with the outer surface of the cladding layer. The light-absorbing material and the outer surface of the cladding layer have indices of refraction that are matched, or very close to one another, such that any modes of light that are propagating in the cladding layer that impinge on the interface propagate into the light-absorbing material and are absorbed thereby. The reduced diameter of the cladding layer and the surrounding light-absorbing material form a pin hole opening through which light is received. The pin hole opening makes it possible to use a simple ball lens to focus light from the light source into the end of the fiber stub to thereby reduce the number of modes that are dispersed into the cladding layer. | 08-13-2009 |
| 20090196007 | ELECTROMAGNETIC INTERFERENCE (EMI) SYSTEM AND METHOD FOR USE WITH AN OPTICAL TRANSCEIVER MODULE - An EMI system is provided for use with an optical transceiver module. The EMI system comprises an EMI collar that is secured about the housing of the transceiver module. The EMI collar is configured such that when the collar is secured to the module housing and the module is contained within a cage, features on the EMI collar provide electrically conductive pathways between the module housing and the cage. | 08-06-2009 |
