| ATOTECH DEUTSCHLAND GMBH Patent applications |
| Patent application number | Title | Published |
|---|
| 20120118753 | Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier - In order to be able to produce high density circuits on a dielectric substrate wherein the conductor lines of said circuit have a good adhesion to the dielectric substrate surface, a method is provided which comprises the following method steps: a) providing an auxiliary substrate having two sides, at least one of said sides having an electrically conductive surface; b) treating at least one of the at least one electrically conductive surface with at least one release layer forming compound, the at least one release layer forming compound being a heterocyclic compound having at least one thiol group, c) forming a patterned resist coating on at least one of said at least one electrically conductive surface which has been treated with said at least one release layer forming compound, the patterned resist coating having at least one resist opening thereby exposing the electrically conductive surface; d) forming an electrically conductive pattern in the at least one resist opening by electrodepositing a metal on the exposed electrically conductive surface; e) embedding each electrically conductive pattern into a dielectric material by forming a respective dielectric material layer on the respective side of the auxiliary substrate; and f) separating each dielectric material layer comprising the respective embedded electrically conductive pattern and the auxiliary substrate from each other. | 05-17-2012 |
| 20120111365 | METHOD AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED AND DEVICE FOR REMOVING OR HOLDING OFF TREATMENT LIQUID - In order to remove treatment liquid ( | 05-10-2012 |
| 20120107074 | METHOD, HOLDING MEANS, APPARATUS AND SYSTEM FOR TRANSPORTING A FLAT MATERIAL TO BE TREATED AND LOADING OR UNLOADING APPARATUS - In order to transport a flat material to be treated ( | 05-03-2012 |
| 20120080322 | METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED - In order to remove treatment liquid ( | 04-05-2012 |
| 20110293823 | METHOD AND DEVICE FOR PRODUCING A PLASTIC COATING - Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate, comprising the following steps:
| 12-01-2011 |
| 20110215003 | Method of Inspecting a Metal Coating and a Method for Analytical Control of a Deposition Electrolyte Serving to Deposit Said Metal Coating - For fast and secure determination of the quality of a metal coating as well as of an electrolyte for depositing a metal, in particular for electrolytic deposition of nickel such as of semi-gloss nickel and bright nickel and for analytical control of the deposition electrolyte, a method of inspecting a metal coating is provided, which involves the following method steps: a) depositing the metal coating from a deposition electrolyte onto a working electrode; b) electrolytically dissolving the metal coating through anodic polarisation of the working electrode with respect to a counter electrode, which is in electrolytic contact with the working electrode; c) recording an electrical dissolution potential at the working electrode over time, said potential occurring during a dissolution of the metal coating; and d) determining a time-averaged vale of the dissolution potential. | 09-08-2011 |
| 20110200842 | STRESS-REDUCED NI-P/PD STACKS FOR BONDABLE WAFER SURFACES - The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48 M−Pa (5,000 psi). Further, a process for the preparation of such a substrate is described. | 08-18-2011 |
| 20110195278 | METAL PLATING ADDITIVE, AND METHOD FOR PLATING SUBSTRATES AND PRODUCTS THEREFROM - The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, OCH2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions. | 08-11-2011 |
| 20110132766 | Method for Electrochemically Depositing a Metal on a Substrate - To electroplate a metal layer which has silica particles dispersed therein, a method for electrochemically depositing a metal on a substrate, more specifically a method of forming a corrosion-resistant nickel multilayer on a substrate, are provided, wherein the method comprises the following method steps: (a) depositing a first nickel layer having a first electric potential, (b) depositing a second nickel layer having a second electric potential which is more negative than the first electric potential over the first nickel layer and (c) depositing a third nickel layer over the second nickel layer using a solution for electrochemically depositing a metal on a substrate, said solution containing ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles, said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with said solution. | 06-09-2011 |
| 20110094583 | ELECTROPLATING ADDITIVE FOR THE DEPOSITION OF METAL, A BINARY, TERNARY, QUATERNARY OR PENTANARY ALLOY OF ELEMENTS OF GROUP 11 (IB)-GROUP 13 (IIIA)-GROUP 16 (VIA) - The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives have the general formula (A): | 04-28-2011 |
| 20110011746 | Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper - To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids. | 01-20-2011 |
| 20100326838 | PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS - A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings. | 12-30-2010 |
| 20100326713 | NI-P LAYER SYSTEM AND PROCESS FOR ITS PREPARATION - The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ≦3.0 μm, (ii) a Ni—P layer having a thickness ≦1.0 μm, (iii) a Au layer having a thickness ≦1.0 μm. | 12-30-2010 |
| 20100323099 | Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece - To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N | 12-23-2010 |
| 20100310849 | SOLID POWDER FORMULATIONS FOR THE PREPARATION OF RESIN-COATED FOILS AND THEIR USE IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS - The invention relates to solid thermosetting resin compositions and resin-coated foils, glass cloth reinforced resin-coated foils using the same and their use in the manufacturing of printed circuit boards. | 12-09-2010 |
| 20100300890 | PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS - An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it further contains (ii) N-methyl pyrrolidone is described. | 12-02-2010 |
| 20100236936 | Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings - The invention relates to an aqueous, alkaline cyanide-free electrolyte bath for de-positing zinc and zinc alloy coatings on substrate surfaces comprising (a) a source for zinc ions and optionally a source for further metal ions, (b) hydroxide ions, (c) a polymer of general formula I which is soluble in the bath and (d) at least one pyridinium compound of general formula II or III. The electrolyte bath is suitable for the galvanic deposition of bright and even zinc and zinc alloy coatings. | 09-23-2010 |
| 20100196727 | SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION RESISTANCE OF METAL OR METAL ALLOY SURFACE - Described is a new a solution comprising a phosphorous compound and a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface. | 08-05-2010 |
| 20100187121 | PROCESS FOR THE PREPARATION OF ELECTRODES FOR USE IN A FUEL CELL - A process for the preparation of electrodes for use in a fuel cell comprising a membrane electrode assembly with a negative and a positive electrode is described, said process comprising the following steps: (i) providing an electrode substrate and (ii) coating said substrate electrolytically from a plating bath with a metal layer, said metal being selected from Ag, Au, Pd and its alloys. | 07-29-2010 |
| 20100180793 | ANTI-CORROSION TREATMENT FOR CONVERSION LAYERS - The invention relates to a method for producing a coating layer protecting against corrosion wherein a surface which is to be treated is brought into contact with an aqueous treatment solution containing chromium(III) ions and at least one phosphate compound, wherein the ratio of the molar concentration of the chromium(III) ions to the molar concentration of the at least one phosphate compound (calculated as orthophosphate) lies between 1:1.5 and 1:3. The method improves the corrosion protection of metallic, in particular, zinc-containing, surfaces provided with conversion layers. The decorative and functional properties of the surface are maintained or improved. Furthermore, the known problems resulting from the use of chromium(VI)-containing compounds or from post-treatments with polymer dispersions are avoided. | 07-22-2010 |
| 20100176088 | APPARATUS AND METHOD FOR THE WET CHEMICAL TREATMENT OF A PRODUCT AND METHOD FOR INSTALLING A FLOW MEMBER INTO THE APPARATUS - To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus | 07-15-2010 |
| 20100176004 | APPARATUS AND METHOD FOR THE ELECTROLYTIC TREATMENT OF A PLATE-SHAPED PRODUCT - An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining | 07-15-2010 |
| 20100155257 | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings - An aqueous, alkaline, cyanide-free electrolyte bath for deposition of zinc alloy layers on substrate surfaces is described, which contains cationic pyridinium compounds as brighteners and polyamines as complexing agents. The electrolyte bath is suitable for electroplating bright and even zinc alloy coatings. | 06-24-2010 |
| 20100133113 | CHROMIUM(VI)-FREE BLACK PASSIVATION OF SURFACES CONTAINING ZINC - The invention relates to a treatment solution for producing substantially chromium(VI)-free black conversion layers on alloy layers containing zinc, the solution comprising the following: (i) at least one first carboxylic acid having 1 to 8 carbon atoms, the acid containing no polar groups with exception of the carboxyl group and being a monocarboxylic acid, (ii) at least one second carboxylic acid having 1 to 8 carbon atoms, comprising at least one further polar group that is selected from —OH, —SO | 06-03-2010 |
| 20100126633 | Agent for the Production of Anti-Corrosion Layers on Metal Surfaces - An agent for the production of anti-corrosion layers on metal surfaces, produced by the following steps:
| 05-27-2010 |
| 20100119713 | PROCESS FOR APPLYING A METAL COATING TO A NON-CONDUCTIVE SUBSTRATE - Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent. | 05-13-2010 |
| 20100059384 | Electrodeposition method with analysis of the electrolytic bath by solid Phase Extraction - A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous. | 03-11-2010 |
| 20100035435 | Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces - The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board. | 02-11-2010 |
| 20090301889 | Electrolytic Method For Filling Holes and Cavities With Metals - Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system. | 12-10-2009 |
| 20090250379 | Process for Manufacturing a Microreactor and Its Use as a Reformer - For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular. | 10-08-2009 |
| 20090202858 | METHOD FOR BONDING WORK PIECES MADE OF STAINLESS STEEL, NICKEL OR NICKEL ALLOYS, USING A BONDING LAYER CONSISTING OF NICKEL-PHOSPHOROUS, METHOD FOR PRODUCING A MICRO-STRUCTURED COMPONENT USING SUCH METHOD; MICRO-STRUCTURED COMPONENT OBTAINED BY SUCH METHOD - To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate. | 08-13-2009 |
| 20090200263 | METHOD FOR METALLIZING INSULATING SUBSTRATES WHEREIN THE ROUGHENING AND ETCHING PROCESSES ARE CONTROLLED BY MEANS OF GLOSS MEASUREMENT - The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards. | 08-13-2009 |
| 20090130315 | Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths - The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected from Fe, Ni, Co, Sn salts, wherein the bath can be purified continuously so that the process can be operated without interruption, as well as apparatus for carrying out this process. | 05-21-2009 |
| 20090107845 | Alkaline Electroplating Bath Having A Filtration Membrane - There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane. | 04-30-2009 |
| 20090081370 | METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS - The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask. | 03-26-2009 |
| 20090032146 | Aqueous Reaction Solution and Method of Passivating Workpieces Having Zinc or Zinc Alloy Surfaces and Use of a Heteroaromatic Compound - For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof. | 02-05-2009 |
| 20080268166 | Process for the Transfer of Powders and Powder Coatings to Substrates - The invention relates to a process for the mixing and gentle transport and the transfer of powders to substrates wherein the powder particles are first charged by friction in the presence of magnetic particles and then transported by means of a fluidized bed and optionally one or more mixing rolls and then transferred and applied to a substrate by means of an electric field between a brush drum and a substrate drum carrying said substrate, characterized in that the mixing and the transport of the powder particles and the magnetic particles are carried out by means of a boiling bed. | 10-30-2008 |
| 20080217381 | Method for Bonding Work pieces and Micro-Structured Component - For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method. | 09-11-2008 |
| 20080200360 | Aqueous Solution and Method for Removing Ionic Contaminants from the Surface of a Workpiece - To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof. | 08-21-2008 |
| 20080196875 | Micro-Structured Cooler and Use Thereof - For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils ( | 08-21-2008 |
