| 20090115052 | HYBRID SILICON/NON-SILICON ELECTRONIC DEVICE WITH HEAT SPREADER - A hybrid electronic device incorporating both Si and non-Si semiconductor components, utilizing SiC, diamond, or another highly thermally conductive material as an underlying heat spreader. The hybrid electronic device is comprised of some combination of components fabricated in: (1) the underlying heat spreader itself; (2) a thin Si layer attached to the heat spreader via wafer bonding; and/or (3) a discrete semiconductor electronics die soldered to the heat spreader. | 05-07-2009 |
